K4A4G085WF-BITD vs K4A4G085WG-BCWE 比較
詳細並排比較 K4A4G085WF-BITD 由 Samsung Electronics 與 K4A4G085WG-BCWE 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | K4A4G085WF-BITD | K4A4G085WG-BCWE |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | DRAM | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 記憶體類型 | DDR4 SDRAM | DDR4 SDRAM (Volatile) |
| Density | 4 Gbit | — |
| 組織 | 512M x 8 | — |
| Speed | 2666 Mbps (MT/s) | — |
| Supply Voltage (VDD) | 1.2 V | 1.2 V |
| VPP Voltage | 2.5 V | — |
| 工作溫度 | -40C to +95C | [DATA_NEEDED: operating temperature range] |
| 封裝 | 78-ball FBGA (78FBGA) | FBGA-78 (BCW) |
| Bank Architecture | 8 banks x 4 bank groups | — |
| Burst Length | BL8 | BL8 |
| CAS 延遲 | CL19 (typical at 2666 Mbps) | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| 介面 | Parallel, DDR4 SSTL12 | Parallel (DDR4) |
| Refresh | Self-refresh and auto-refresh (8K/64ms per JEDEC DDR4) | [DATA_NEEDED: refresh rate specification] |
| Termination | ODT / dynamic ODT | — |
| Data Mask | DM supported (x8) | — |
| Application Grade | Industrial | — |
| 記憶體容量 | — | 4 Gb |
| Memory Organization | — | 512M x 8 |
| 資料速率 | — | 3200 Mbps/pin |
| Speed Class | — | DDR4-3200 |
| Technology | — | D-die DDR4 |
| DLL Mode | — | DLL Enabled (per datasheet timing) |
| RoHS 狀態 | — | Compliant |
| Packaging | — | Tray |