K4A8G085WB-BCTD vs K4A8G085WC-BCTD 比較
詳細並排比較 K4A8G085WB-BCTD 由 Samsung Electronics 與 K4A8G085WC-BCTD 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Samsung Electronics
K4A8G085WC-BCTD - 8Gb DDR4 SDRAM 2666Mbps 1.2V | Samsung
K4A8G085WC-BCTD ⚠ 最後購買機會規格比較
| 參數 | K4A8G085WB-BCTD | K4A8G085WC-BCTD |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | Memory ICs | Memory ICs |
| 生命週期狀態 | 啟用中 | 最後購買 |
| 單價 (USD) | $8.53 | — |
| 記憶體類型 | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gb | 8 Gb |
| 組織 | 1G x 8 | 1G x 8 |
| 資料速率 | 2666 Mbps | 2666 Mbps (PC4-2133) |
| 供應電壓 | 1.2 V | — |
| Die Revision | B-die | — |
| 封裝 | FBGA-78 (78-ball TFBGA) | 78-ball FBGA (78FBGA) |
| 安裝類型 | Surface Mount | Surface Mount |
| Bank Structure | 16 banks, 4 bank groups | — |
| Burst Length | BL8 | 8 (chop 4) |
| Termination | On-Die Termination (ODT), dynamic ODT | — |
| 功能特色 | ZQ calibration, CRC, CA parity, asynchronous reset | — |
| 工作溫度 | [DATA_NEEDED: operating temperature range] | 0C to +95C |
| Speed Bin | -BCTD (CL-tRCD-tRP bin) | — |
| Terminations | 78 | — |
| JEDEC-30 Package Code | R-PBGA-B78 | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Supply Voltage (VDD/VDDQ) | — | 1.2 V (1.14 V to 1.26 V) |
| Ball Pitch | — | 0.8 mm |
| Standard Operating Temp Range | — | 0C to +85C |
| Auto Precharge | — | Yes |
| Asynchronous Reset | — | Yes |
| CRC Function | — | Yes |
| ZQ Calibration | — | Yes |
| Dynamic ODT | — | Yes |
| Data Mask | — | Yes |
| 介面類型 | — | Synchronous, parallel |