K4A8G165WB-BCPB vs K4AAG165WA-BCPB 比較
詳細並排比較 K4A8G165WB-BCPB 由 Samsung Electronics 與 K4AAG165WA-BCPB 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | K4A8G165WB-BCPB | K4AAG165WA-BCPB |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | Memory ICs | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 記憶體類型 | DDR4 SDRAM | Volatile DRAM (DDR4 SDRAM) |
| Density | 8 Gb | 16 Gb |
| 組織 | 512M x 16 | 1G x 16 |
| 資料速率 | 2133 Mbps | 3200 Mbps |
| Supply Voltage (VDD) | 1.2 V | 1.2 V |
| I/O Voltage (VDDQ) | 1.2 V | — |
| 工作溫度 | 0C to +85C | [DATA_NEEDED: operating temperature for BCPB grade] |
| 封裝 | 96FBGA (TFBGA) | FBGA-96 |
| Number of Terminals | 96 | — |
| Package Shape | Rectangular, bottom terminal position | — |
| Die Generation | 8Gb B-die | — |
| 安裝類型 | Surface Mount | Surface Mount |
| 介面 | DDR4 (synchronous, double data rate) | — |
| Bank Groups | DDR4 bank-group architecture | — |
| RoHS 狀態 | Compliant (per Lisleapex listing) | [DATA_NEEDED: RoHS status] |
| Refresh | [DATA_NEEDED: refresh specification] | — |
| Technology | — | DDR4 |
| Interface Voltage (VDDQ) | — | 1.2 V |
| Memory Format | — | DRAM |
| Packaging | — | Tray |
| Product Status | — | Active |
| Power Consumption | — | 25% lower than DDR3 (per Samsung DDR4 family) |
| Bank Group Architecture | — | Yes (DDR4 internal bank groups) |
| On-Die Termination (ODT) | — | Yes |
| Max Capacity Family | — | Up to 32GB component (Samsung DDR4 family) |