K9MDG08U5M vs K9DVGB8U5M 比較

詳細並排比較 K9MDG08U5M 由 Samsung Electronics 與 K9DVGB8U5M 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Samsung Electronics
K9MDG08U5M K9MDG08U5M - 16Gb x8 MLC NAND Flash TSOP1-48 | Samsung

K9MDG08U5M - 16Gb x8 MLC NAND Flash TSOP1-48 | Samsung

K9MDG08U5M ✓ 啟用中
Samsung Electronics
K9DVGB8U5M K9DVGB8U5M - Samsung NAND Flash Memory Chip | Samsung

K9DVGB8U5M - Samsung NAND Flash Memory Chip | Samsung

K9DVGB8U5M ✓ 啟用中

規格比較

參數 K9MDG08U5M K9DVGB8U5M
品牌 Samsung Electronics Samsung Electronics
類別 Memory ICs Memory ICs
生命週期狀態 啟用中 啟用中
記憶體類型 MLC Large Block NAND Flash NAND Flash
Density 16 Gbit (2 GB) —
組織 16G x 8 bit [DATA_NEEDED: capacity organization]
Cell Type MLC (2 bits per cell) —
Supply Voltage Min 2.7 V —
Supply Voltage Max 3.6 V —
介面 Asynchronous x8 multiplexed address/data Asynchronous x8-bit I/O
封裝 48-pin TSOP1 dual stacked, 12 mm x 20 mm [DATA_NEEDED: package type and dimensions]
Terminals 48 —
Circuits 1 —
Die Configuration Dual stacked —
安裝類型 Surface Mount Surface Mount
工作溫度 [DATA_NEEDED: operating temperature range] [DATA_NEEDED: temperature range]
Page Size [DATA_NEEDED: page size] [DATA_NEEDED: main page size]
Block Size [DATA_NEEDED: block size] [DATA_NEEDED: erase block size]
Page Read Time (tR) [DATA_NEEDED: tR] —
Program Time (tPROG) [DATA_NEEDED: tPROG] [DATA_NEEDED: page program time]
RoHS 狀態 unknown [DATA_NEEDED: RoHS compliance]
供應電壓 — [DATA_NEEDED: VCC range]
Read Time (tR) — [DATA_NEEDED: page read cycle time]
Erase Time (tBERS) — [DATA_NEEDED: block erase time]
Endurance — [DATA_NEEDED: program/erase cycles]
Data Retention — [DATA_NEEDED: retention specification]
Access Interface Signals — CLE, ALE, WE, RE, CE, R/B, WP
Bad Block Management — Host-managed (controller ECC and bad-block table required)

資料表與資源

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