MPC8347CZQAGDB-FR vs MPC8343CVRAGDB 比較

詳細並排比較 MPC8347CZQAGDB-FR 由 NXP Semiconductors 與 MPC8343CVRAGDB 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MPC8347CZQAGDB-FR MPC8347CZQAGDB-FR - 400MHz PowerQUICC II Pro MPU | NXP

MPC8347CZQAGDB-FR - 400MHz PowerQUICC II Pro MPU | NXP

MPC8347CZQAGDB-FR Obsolete
NXP Semiconductors
MPC8343CVRAGDB MPC8343CVRAGDB - PowerQUICC II Pro 400MHz SoC | NXP

MPC8343CVRAGDB - PowerQUICC II Pro 400MHz SoC | NXP

MPC8343CVRAGDB ✗ 停產

規格比較

參數 MPC8347CZQAGDB-FR MPC8343CVRAGDB
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 Obsolete 停產終止
Manufacturer NXP Semiconductors (formerly Freescale) NXP Semiconductors
Series MPC83xx (PowerQUICC II Pro) PowerQUICC II Pro
Core Processor PowerPC e300 PowerPC e300
Number of Cores 1 1
資料匯流排寬度 32-bit 32-bit
Core Frequency 400 MHz —
Bus Speed 133 MHz (per core spec) —
L1 Cache (I/D) 32 KB / 32 KB —
FPU Double-precision hardware FPU —
MMU Yes (hardware) —
RAM Controllers DDR1 / DDR2 (up to 333 MHz) —
Ethernet 2x 10/100/1000 Mbps (GMII/RGMII/TBI) Dual 10/100/1000 (GigE)
PCI 2x PCI 2.3 (1x 64-bit/66 MHz, 1x 32-bit/66 MHz) Dual PCI (PCI 2.3)
USB Hi-Speed USB 2.0 (Host/Device/OTG) Hi-Speed USB 2.0
封裝 620-TEPBGA II (29x29 mm, 1 mm pitch) —
Height 2.46 mm max —
Supply Voltage (Core) 1.2 V —
工作溫度 -40C to +105C —
安裝類型 Surface Mount (BGA) Surface Mount
Lead Free Yes (FR suffix) —
RoHS 狀態 Compliant —
QUICC Engine Yes (HDLC/ATM/Ethernet offload) —
Part Family — MPC8343EA
Core Architecture — Power Architecture (Book E enhancements)
最大時脈頻率 — 400 MHz
供應電壓 — 1.2 V core / 1.8 V / 2.5 V / 3.3 V I/O
工作溫度範圍 — -40 °C to +105 °C
Package Type — 620-HBGA (Hi-TCE, 29 mm × 29 mm, 1 mm pitch)
Lead-Free / RoHS — Yes / Compliant
Memory Controller — DDR1 / DDR2
Security Accelerator — DES / 3DES / AES / IPSec / SSL/TLS
Silicon Revision — Rev 2.1

資料表與資源

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