MRF8P20160HSR3 vs MRF8P20161HSR3 比較

詳細並排比較 MRF8P20160HSR3 由 NXP Semiconductors 與 MRF8P20161HSR3 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MRF8P20160HSR3 MRF8P20160HSR3 - 37W RF Power MOSFET 1880-2025 MHz | NXP

MRF8P20160HSR3 - 37W RF Power MOSFET 1880-2025 MHz | NXP

MRF8P20160HSR3 ✓ 啟用中
NXP Semiconductors
MRF8P20161HSR3 MRF8P20161HSR3 - 37W 1880-2025MHz RF Power MOSFET | NXP

MRF8P20161HSR3 - 37W 1880-2025MHz RF Power MOSFET | NXP

MRF8P20161HSR3 ✓ 啟用中

規格比較

參數 MRF8P20160HSR3 MRF8P20161HSR3
品牌 NXP Semiconductors NXP Semiconductors
類別 MOSFETs MOSFETs
生命週期狀態 啟用中 啟用中
Manufacturer NXP Semiconductors (formerly Freescale) NXP Semiconductors (formerly Freescale Semiconductor)
Part Number MRF8P20160HSR3 —
電晶體類型 N-Channel Enhancement-Mode Lateral MOSFET N-Channel Lateral MOSFET (RF Power)
Technology HV8 lateral RF MOSFET —
Frequency Band 1880 MHz to 2025 MHz —
Output Power (Average) 37 W (Single-Carrier W-CDMA) —
Drain Supply Voltage (VDD) 28 Vdc —
Quiescent Drain Current (IDQA) 550 mA —
Power Gain (Typ) 16.5 dB at 1.92 GHz —
Test Frequency 1.92 GHz 1.92 GHz
封裝 / 外殼 NI-780S-4 (ceramic flanged) —
安裝方式 Screw-down flange (through-hole) —
Operating Class Class AB or Class C Class AB or Class C
Junction Temperature (Max) 200 C (S-prefix sample-tested) —
Application W-CDMA / LTE / TD-SCDMA base-station PA CDMA / cellular base station RF power amplifier
RoHS 狀態 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS compliance status]
Lead Finish [DATA_NEEDED: lead finish] —
Frequency Range — 1880 MHz to 2025 MHz
Drain Supply Voltage (Vdd) — 28 V
Average Output Power — 37 W (W-CDMA)
Small-Signal Gain — 16.4 dB at 1.92 GHz
Quiescent Drain Current (Idq) — 550 mA
封裝 — NI-780S-4 (NI-780HS-4) ceramic air-cavity, surface mount
安裝類型 — Surface mount with screw-down flange
Polarity / Channel — N-Channel enhancement-mode lateral
Modulation Support — W-CDMA, LTE, multi-carrier GSM
Operating Mode — Enhancement mode

資料表與資源

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