MT40A512M8RH-075E:B vs K4A4G085WD-BCRC 比較

詳細並排比較 MT40A512M8RH-075E:B 由 Micron Technology 與 K4A4G085WD-BCRC 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Micron Technology
MT40A512M8RH-075E:B MT40A512M8RH-075E:B - DDR4 4Gb 2666 MT/s SDRAM | Micron

MT40A512M8RH-075E:B - DDR4 4Gb 2666 MT/s SDRAM | Micron

MT40A512M8RH-075E:B ✓ 啟用中
Samsung Electronics
K4A4G085WD-BCRC K4A4G085WD-BCRC - 4Gb DDR4-2400 SDRAM 512Mx8 | Samsung

K4A4G085WD-BCRC - 4Gb DDR4-2400 SDRAM 512Mx8 | Samsung

K4A4G085WD-BCRC ✓ 啟用中

規格比較

參數 MT40A512M8RH-075E:B K4A4G085WD-BCRC
品牌 Micron Technology Samsung Electronics
類別 Memory ICs Memory ICs
生命週期狀態 啟用中 啟用中
記憶體類型 DDR4 SDRAM DDR4 SDRAM (D-die)
Density 4 Gbit —
組織 512M x 8 512M x 8
資料速率 2666 MT/s (DDR4-2666) 2400 Mb/s (PC2400)
Clock Frequency 1333 MHz (1.33 GHz) —
VDD Supply Voltage 1.2 V +/-60 mV —
VDDQ Supply Voltage 1.2 V +/-60 mV —
VPP Supply Voltage 2.5 V, -125 mV/+250 mV —
介面類型 Parallel —
I/O Structure 1.2V pseudo open-drain —
參考電壓 On-die internal adjustable VREFDQ generation —
封裝 78-FBGA (9 x 10.5 mm), TFBGA FBGA-78 (TFBGA)
安裝類型 Surface Mount Surface Mount
工作溫度 [DATA_NEEDED: operating temperature range (standard grade)] —
Refresh Refresh max interval extension at extended TC temperature range (125C capable per family features) [DATA_NEEDED: Refresh specification]
Speed Grade Suffix -075E —
RoHS 狀態 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS Status]
Packaging Option Suffix :B (ball map B designation per Mouser listing) —
Memory Density — 4 Gbit
供應電壓 — 1.2 V
Number of Terminals — 78
介面 — Parallel
Access Mode — Multi-bank page burst
CAS 延遲 — [DATA_NEEDED: CAS Latency]
工作溫度範圍 — [DATA_NEEDED: Operating Temperature Range]
MSL 等級 — [DATA_NEEDED: MSL Level]

資料表與資源

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