MT41K256M16HA-15EM:E vs H5TC4G63MFR-PBA 比較

詳細並排比較 MT41K256M16HA-15EM:E 由 Micron Technology 與 H5TC4G63MFR-PBA 由 SK hynix. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Micron Technology
MT41K256M16HA-15EM:E MT41K256M16HA-15EM:E - 4Gb DDR3L SDRAM 256Mx16 | Micron

MT41K256M16HA-15EM:E - 4Gb DDR3L SDRAM 256Mx16 | Micron

MT41K256M16HA-15EM:E ✓ 啟用中
SK hynix
H5TC4G63MFR-PBA H5TC4G63MFR-PBA - 4Gb DDR3L SDRAM 256Mx16 | SK hynix

H5TC4G63MFR-PBA - 4Gb DDR3L SDRAM 256Mx16 | SK hynix

H5TC4G63MFR-PBA ✓ 啟用中

規格比較

參數 MT41K256M16HA-15EM:E H5TC4G63MFR-PBA
品牌 Micron Technology SK hynix
類別 Memory ICs Memory ICs
生命週期狀態 啟用中 啟用中
記憶體類型 DDR3L SDRAM DDR3L SDRAM
Density 4 Gbit 4 Gb
組織 256M x 16 256M x 16
供應電壓 1.35 V (1.5V compatible) —
資料速率 1333 Mbps (DDR3L-1333) 1866 Mbps (PC3L-14900)
CAS 延遲 15 —
封裝 96-ball FBGA (9x14mm) 96-ball FBGA
安裝類型 Surface Mount —
工作溫度 [DATA_NEEDED: operating temperature range] —
RoHS 狀態 Compliant —
Lead-Free Yes —
腳位數 96 —
Access Time 13.75 ns —
Clock Frequency 800 MHz —
介面 Parallel —
Supply Voltage (VDD/VDDQ) — 1.35V (+0.100V/-0.067V)
Number of Banks — 8
Burst Length — BL8, BL4 (with burst chop)
CAS Latency (CL) — Programmable
CAS Write Latency (CWL) — Programmable
Additive Latency — Programmable
On-Die Termination (ODT) — Yes
ZQ Calibration — Yes
Write Leveling — Yes
Auto Self-Refresh — Yes
Temperature-Compensated Self-Refresh — Yes
Process Technology — 30nm-class
RoHS Compliant — Yes (Lead-Free & Halogen-Free)

資料表與資源

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