10AS066H2F34I2SG - Arria 10 SX SoC FPGA 660K LE | Intel
MPN： 10AS066H2F34I2SG ✓ 啟用中10AS066H2F34I2SG 概覽
An SoC FPGA (System-on-Chip FPGA) is a class of programmable device that combines a hardened processor subsystem with the configurable logic fabric of an FPGA. The Arria 10 SX family extends this concept by integrating an ARM Cortex-A9 MPCore complex directly on-die, reducing bill-of-material count versus a discrete CPU+FPGA solution, while the FPGA fabric provides hardware-accelerated parallel processing for DSP, packet processing, and custom interfaces. This category sits at the intersection of microcontrollers, application processors, and programmable logic, targeting applications that need both deterministic real-time processing and flexible software.
Key features of the 10AS066H2F34I2SG include integrated 1.5 GHz ARM Cortex-A9 dual-core HPS, 660K logic elements, embedded transceiver support for high-speed serial interfaces, dedicated memory controllers supporting DDR3/DDR4/LPDDR3, and partial reconfiguration capability. The F34 package variant provides 1152 ball connections in a 35x35 mm FC-FBGA, suitable for dense PCB designs.
Architecturally, the device uses Intel's 20nm TSMC process with embedded hard IP blocks for memory controllers, PCIe Gen2/Gen3 hard IP, and 10 Gbps transceivers. The HPS includes ARM Cortex-A9 cores with NEON media engine, single/double-precision floating-point unit, and a dedicated level-2 cache subsystem.
Typical applications include wireless baseband processing, broadcast video infrastructure, military radar signal processing, medical imaging, and industrial motor control. The industrial-grade temperature qualification makes it suitable for harsh-environment deployments.
When designing with the 10AS066H2F34I2SG, ensure proper thermal management via thermal vias under the package, follow Intel's pinout guidelines for the 1152-ball BGA, and provision for JTAG configuration using Quartus Prime programmer support.
This page synthesizes distributor pricing, drop-in alternatives from the same Arria 10 SX family, and practical design guidance not always surfaced in the manufacturer product brief.
直接替換替代品，適用於 10AS066H2F34I2SG — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 10AS066H2F34I2SG （相同外形與佔位） — 差異在於 Package, Temperature Grade, Operating Temperature, Transceivers, Mounting Type.
10AS066H2F34I2LG
✅ 直接替換聯絡詢價
查看資料表 →10AS066H2F34I1HG
✅ 直接替換聯絡詢價
查看資料表 →10AS066H2F34E2SG
✅ 直接替換聯絡詢價
查看資料表 →10AS066H2F34E2LG
✅ 直接替換聯絡詢價
查看資料表 →10AS066H1F34I1HG
✅ 直接替換聯絡詢價
查看資料表 →10AS066H1F34E1HG
✅ 直接替換聯絡詢價
查看資料表 →10AS066H2F34I2SG 最大額定值與電氣特性
| Family | Arria 10 SX |
| Device Name | 10AS066 |
| Logic Elements | 660,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Process Technology | 20 nm |
| Core Voltage | 0.87 V to 0.93 V |
| Maximum Fabric Frequency | 1.5 GHz |
| Number of Terminals | 1152 |
| 封裝 | FC-FBGA-1152 (F34), 35 mm x 35 mm |
| 安裝類型 | Surface Mount (BGA) |
| User I/O | 492 inputs / 492 outputs |
| 工作溫度 | -40 °C to +100 °C (Industrial) |
| Temperature Grade | Industrial |
| RoHS Compliance | RoHS Compliant |
| Configuration | FPGA + SoC integrated |
10AS066H2F34I2SG fc-fbga-1152 (f34), 35 mm x 35 mm 腳位配置指南
10AS066H2F34I2SG（fc-fbga-1152 (f34), 35 mm x 35 mm 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 10AS066H2F34I2SG.
請參閱 資料表 以查看完整腳位配置。
典型應用
10AS066H2F34I2SG 適用於 7 應用s: Wireless Baseband Processing, Broadcast Video Infrastructure, Military Radar Signal Processing, Medical Imaging Equipment, Industrial Motor Control, Test and Measurement Instrumentation, Aerospace Communication Systems.
Wireless Baseband Processing
The 10AS066H2F34I2SG's 660K logic elements and integrated ARM Cortex-A9 HPS make it ideal for wireless baseband processing in 4G/LTE small cells and 5G fronthaul units. The 1.5 GHz fabric Fmax supports real-time FFT/IFFT, channel estimation, and digital predistortion algorithms, while the dual Cortex-A9 cores handle MAC-layer protocol stack and OS-level scheduling. Industrial-grade qualification suits outdoor baseband units.
推薦
Broadcast Video Infrastructure
The 10AS066H2F34I2SG handles 4K UHD video processing, JPEG2000 encoding/decoding, and SDI/HDMI bridge functions for broadcast studio equipment. Its 660K LEs provide parallel pixel pipelines running at hundreds of MHz, and the HPS runs Linux for control-plane management, SNMP, and IP-based studio routing. Industrial temperature grade suits 24/7 rack operations.
推薦
Military Radar Signal Processing
With 660K LEs and 1.5 GHz fabric, the 10AS066H2F34I2SG performs pulse-Doppler FFT, MTI filtering, and CFAR detection for ground-based and naval radar systems. Industrial temperature and ruggedized packaging support defense applications. The HPS handles track management and display rendering. Designers should pair with high-speed ADC companion parts.
推薦
Medical Imaging Equipment
The 10AS066H2F34I2SG accelerates CT, MRI, and ultrasound beamforming by running parallel FIR filtering, back-projection, and image reconstruction pipelines. The dual ARM Cortex-A9 HPS manages patient interface, DICOM networking, and operator console. Industrial temperature and reliability suit medical-grade compliance paths.
推薦
Industrial Motor Control
The 10AS066H2F34I2SG runs high-FOV field-oriented control (FOC) loops for multi-axis servo drives and industrial robots. The FPGA fabric delivers sub-microsecond current-loop cycles while the HPS Cortex-A9 handles EtherCAT, PROFINET, and motion planning. Industrial temperature grade suits factory floor operation.
推薦
Test and Measurement Instrumentation
The 10AS066H2F34I2SG's high logic density and ARM HPS make it well suited to benchtop oscilloscopes, logic analyzers, and protocol analyzers. FPGA fabric handles multi-Gbps serial protocol decoding (PCIe Gen3, USB 3.1, SATA) while the HPS runs Linux for UI, networking, and remote control. Industrial grade suits lab/production test environments.
推薦
Aerospace Communication Systems
The 10AS066H2F34I2SG serves as the central processing element in airborne and UAV communication gateways, where it implements software-defined radio (SDR) waveforms and crypto acceleration. The 660K LEs and Cortex-A9 HPS support multi-band, multi-protocol operation, and the industrial temperature grade suits avionics bay environments.
推薦
推薦產品摘要
工程參考資料，適用於 10AS066H2F34I2SG — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 10AS066H2F34I2LG | 10AS066H2F34I1HG | 10AS066H2F34E2SG | 10AS066H2F34E2LG |
|---|---|---|---|---|---|
| Package | FC-FBGA-1152 (F34) | FC-FBGA-1152 (F34) | FC-FBGA-1152 (F34) | FC-FBGA-1152 (F34) | FC-FBGA-1152 (F34) |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 |
| Hard Processor System | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Speed Grade | -2 (H2) | -2L (H2) | -1 (H2) | -2 (H2) | -2L (H2) |
| Temperature Grade | Industrial (-40 to +100 °C) | Industrial (-40 to +100 °C) | Industrial (-40 to +100 °C) | Commercial (0 to +100 °C) | Commercial (0 to +100 °C) |
| Core Voltage | 0.87-0.93 V | 0.87-0.93 V | 0.87-0.93 V | 0.87-0.93 V | 0.87-0.93 V |
| User I/O | 492 | 492 | 492 | 492 | 492 |
主要差異化特點
- Highest speed grade (-2 H2) in the 10AS066 F34 family (對比10AS066H2F34I1HG)
- Industrial temperature grade for harsh-environment deployments (對比10AS066H2F34E2SG)
- Pin-compatible with full 10AS066 F34 family for flexible sourcing (對比10AS032H4F35I3SG (smaller die))
設計說明
The 35x35 mm FC-FBGA-1152 package dissipates up to ~30 W in worst-case use (full 660K LE utilization at 1.5 GHz with HPS active). Intel recommends a 12-layer PCB with thermal vias under the central BGA ball array and a heat sink with thermal interface material. At industrial temperature (100 °C junction), implement thermal monitoring via the Arria 10 internal temperature sensor and clock-throttle or shutdown on over-temperature.
Use 1.0 mm ball pitch BGA layout with 0.5 mm pad design per Intel BGA guidelines. Power planes should be placed on layers 2 and 5 (just below and above the signal layer where BGA breakouts exit) to provide low-inductance current return paths. DDR3/DDR4 fly-by routing must follow the JEDEC specification; maximum 5 ps skew tolerance on byte lanes. All transceiver channels require AC-coupling capacitors placed within 1 cm of the package ball.
The HPS reset and configuration pins must be sequenced according to the Arria 10 SoC boot sequence; failure to assert the proper POR sequence can leave the Cortex-A9 in an undefined state. Confirmed JTAG pin assignments (TCK/TMS/TDO/TDI) differ from legacy Cyclone designs - always re-check the F34 pinout file. Multi-voltage rails (0.9 V core, 1.1 V HPS, 1.5 V/1.8 V/2.5 V/3.3 V I/O) require careful power-rail sequencing; missing sequencing causes latch-up.
Decouple the 0.9 V core rail with 0402 ceramic capacitors (10 µF + 100 nF per region) placed within 1 mm of every BGA power/ground ball pair. For receiver (RX) data signals, maintain 100 Ω differential impedance and length-match within 5 mil across the entire pre-emphasis path. Place configuration EPCQ flash close to the FPGA MSEL/ASDATA pins to avoid boot failures.
合規資訊
RoHS compliance confirmed per Intel/Altera product page; AEC-Q100 not applicable (industrial temperature, not automotive). REACH and halogen-free status not directly stated in available data; consult Intel product declaration for full compliance documentation.
