10AS066H2F34I1HG - Arria 10 SX SoC FPGA 660K LE | Intel
MPN: 10AS066H2F34I1HG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4426.2 | $4,426.20 |
| 10 | $4200 | $42,000.00 |
| 100 | $3950 | $395,000.00 |
| 500 | $3700 | $1,850,000.00 |
| 1,000 | $3500 | $3,500,000.00 |
Drop-in alternatives for 10AS066H2F34I1HG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS066H2F34E2SG
✅ Drop-In✓ In Stock
$2400 / Unit
View Datasheet →10AS066H2F34E2LG
✅ Drop-In✓ In Stock
$3250 / Unit
View Datasheet →10AS066H2F34E1HG
✅ Drop-In✓ In Stock
$2980 / Unit
View Datasheet →10AS066H1F34I1HG
✅ Drop-In✓ In Stock
$3720 / Unit
View Datasheet →10AS066H1F34E1HG
✅ Drop-In✓ In Stock
$3900 / Unit
View Datasheet →10AS066H2F34I1HG Maximum Ratings & Electrical Characteristics
| Series | Arria 10 SX |
| Logic Elements | 660,000 |
| HPS Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz |
| Process Technology | 20 nm |
| User I/O Count | 492 |
| Package | 1152-pin FC-FBGA (35x35 mm) |
| Supply Voltage | 0.9 V |
| Operating Temperature Range | -40C to +100C (Industrial) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Configuration Method | SRAM-based, JTAG |
| On-chip Memory | Embedded memory blocks (M20K) |
| DSP Blocks | Variable-precision DSP |
| Transceivers | Multi-gigabit transceivers (up to 12.5 Gbps) |
| Hard Memory Controller | Yes (DDR3/DDR4/LPDDR3) |
| PCIe Hard IP | PCIe Gen2/Gen3 |
10AS066H2F34I1HG 1152-pin fc-fbga (35x35 mm) Pin Configuration Guide
Complete pinout information for 10AS066H2F34I1HG (1152-pin fc-fbga (35x35 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS066H2F34I1HG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS066H2F34I1HG is suitable for 6 applications: 5G Baseband Processing, Software Defined Radio (SDR), Industrial Motor Control, Military Radar and Electronic Warfare, Broadcast Video Processing, Medical Imaging Accelerators.
5G Baseband Processing
The 10AS066H2F34I1HG fits 5G baseband processing because its 660K logic elements deliver the parallel DSP throughput needed for PHY-layer channel coding, FFT/IFFT, and MIMO processing. The dual-core ARM Cortex-A9 HPS running at 1.5 GHz handles MAC-layer scheduling and protocol stack execution without off-chip processor latency. Multi-gigabit transceivers supporting up to 12.5 Gbps enable fronthaul CPRI/eCPRI links between the baseband unit and remote radio heads. Hardened PCIe Gen3 IP simplifies backhaul connectivity to host processors, while DDR4 memory controllers sustain the data bandwidth for real-time baseband sample streams. Compared with pure-logic FPGAs, the integrated HPS eliminates an external CPU, reducing PCB footprint and BOM cost in compact small-cell deployments.
Recommended
Software Defined Radio (SDR)
The 10AS066H2F34I1HG suits SDR platforms because its FPGA fabric accelerates wideband signal processing for waveforms such as LTE, Wi-Fi, and military radio standards, while the Cortex-A9 HPS runs real-time operating systems and waveform libraries. The 12.5 Gbps transceivers handle multi-band RF sampling and digital pre-distortion feedback loops. DSP blocks with variable precision support both fixed-point and floating-point arithmetic, enabling efficient implementation of FFTs, FIR filters, and modulation/demodulation chains. Industrial temperature range ensures operation in tactical and outdoor SDR installations. The integrated ARM cores allow single-chip implementation of waveforms that would otherwise require a separate DSP or CPU subsystem.
Recommended
Industrial Motor Control
The 10AS066H2F34I1HG addresses industrial motor control by combining FPGA-based high-speed PWM generation and encoder feedback processing with an ARM Cortex-A9 HPS running real-time control loops. Variable-precision DSP blocks execute field-oriented control (FOC) algorithms with sub-microsecond latency. The 492 user I/O pins accommodate multiple motor channels, quadrature encoder interfaces, and industrial communication peripherals. Industrial temperature range (-40C to +100C) supports factory floor and outdoor equipment deployments. HPS peripherals such as CAN, UART, and SPI connect directly to industrial networks, while FPGA fabric implements custom safety logic and fast interrupt handlers required by IEC 61508 functional safety standards.
Recommended
Military Radar and Electronic Warfare
The 10AS066H2F34I1HG supports military radar and electronic warfare (EW) applications because its 660K logic elements handle wideband digital beamforming, pulse compression, and adaptive jamming algorithms in parallel. The dual-core ARM Cortex-A9 HPS runs threat library databases and mission management software. High-speed transceivers at 12.5 Gbps process digitized antenna array data streams, while variable-precision DSP blocks implement fast Fourier transforms for radar signal processing. Industrial temperature range ensures operation in military vehicle and airborne environments. The FPGA-HPS shared memory architecture via AXI buses enables deterministic low-latency communication between hardware accelerators and mission software, critical for time-sensitive EW responses.
Recommended
Broadcast Video Processing
The 10AS066H2F34I1HG serves broadcast video processing because its FPGA fabric handles real-time HEVC/H.264 encoding, color space conversion, and overlay compositing at 4K resolutions. The dual-core ARM Cortex-A9 HPS runs video transport protocols (SMPTE 2022, NDI, or MPEG-TS) and network management. Multi-gigabit transceivers support 12G-SDI and HDMI 2.0 interfaces for uncompressed video transport. DDR4 memory controllers sustain the bandwidth required for reference frame buffering at high resolutions. Industrial temperature grade suits outdoor broadcast equipment and mobile production units. The integrated SoC architecture reduces system latency by allowing direct fabric-to-HPS video frame transfer without external memory.
Recommended
Medical Imaging Accelerators
The 10AS066H2F34I1HG accelerates medical imaging workloads such as CT reconstruction, MRI image processing, and ultrasound beamforming because its parallel fabric executes back-projection, Fourier transforms, and image filtering algorithms at line-rate. The dual-core Cortex-A9 HPS manages DICOM networking, user interface, and patient data handling. Hardened PCIe Gen3 IP enables connection to host workstations or capture cards, while on-chip DSP blocks implement floating-point reconstruction algorithms efficiently. Industrial temperature range supports operation in clinical and laboratory environments. The SoC integration reduces system size for portable imaging carts, and the FPGA-HPS shared memory model eliminates external frame-buffer transfers that would otherwise limit frame rate.
Recommended
Recommended Products Summary
Engineering reference data for 10AS066H2F34I1HG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS066H2F34E2SG | 10AS066H2F34E2LG | 10AS066H2F34E1HG | 10AS066H1F34I1HG | 10AS066H1F34E1HG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-pin FC-FBGA (35x35 mm) | 1152-pin FC-FBGA (35x35 mm) - same | 1152-pin FC-FBGA (35x35 mm) - same | 1152-pin FC-FBGA (35x35 mm) - same | 1152-pin FC-FBGA (35x35 mm) - same | 1152-pin FC-FBGA (35x35 mm) - same |
| Logic Elements | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 (H1 family) | 660,000 (H1 family) |
| HPS Core | Dual ARM Cortex-A9 at 1.5 GHz | Dual ARM Cortex-A9 at 1.5 GHz | Dual ARM Cortex-A9 at 1.5 GHz | Dual ARM Cortex-A9 at 1.5 GHz | Dual ARM Cortex-A9 at 1.5 GHz | Dual ARM Cortex-A9 at 1.5 GHz |
| Speed Grade | -2 (H2) | -2 | -2 | -1 (slower) | -2 (H1 family) | -1 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Extended | Extended | Industrial (-40C to +100C) | Extended |
| User I/O Count | 492 | 492 | 492 | 492 | 492 | 492 |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Approximate Unit Price (1 pc) | $4,426.20 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Integrated dual-core ARM Cortex-A9 HPS at 1.5 GHz (vs 10AS066H1F34I1HG)
- Industrial temperature grade (-40C to +100C) (vs 10AS066H2F34E2SG)
- 660K logic elements in a single SoC device (vs 10AS066H1F34E1HG)
Design Notes
The 10AS066H2F34I1HG requires multiple power rails: 0.9 V core, 1.8 V/2.5 V/3.3 V I/O, and dedicated HPS rails (1.1 V, 1.5 V, DDR PHY). Use a sequenced power controller such as the LTC2978 or similar to enforce Intel-specified power-up and power-down sequencing. Decoupling: place 0.1 uF and 10 uF ceramic capacitors adjacent to every power pin, with bulk capacitance distributed across the board. Refer to Intel's 'Arria 10 Power Management User Guide' for the authoritative sequence and tolerance windows.
The 35x35 mm FC-FBGA package has limited heat dissipation through the PCB; in -2 speed grade industrial applications, worst-case power can exceed 25 W. Use a high-layer-count PCB (12+ layers) with dedicated inner power/ground planes, and attach a heatsink with thermal interface material rated for the junction-to-ambient resistance target. Maintain ambient temperature within the device's industrial range (-40C to +100C) by verifying chassis airflow or conduction-cooling capacity.
The 1152-ball FC-FBGA requires a high-density PCB with microvia stack-ups and 0.4-0.5 mm pitch escape routing. Use Intel's 'Arria 10 GX/SX FPGA Board Design Guidelines' for trace width, impedance targets (100 ohm differential for transceivers, 50 ohm single-ended), and layer stackup recommendations. Length-match high-speed interfaces (DDR4, PCIe, transceivers) per the Quartus Prime Fitter reports after place-and-route.
Route multi-gigabit transceiver channels on the top layers with a continuous reference ground plane beneath; avoid crossing reference plane splits. Decouple HPS clock inputs with high-Q crystals or oscillators meeting the jitter spec defined in the HPS clock controller section of the device datasheet. Place the JTAG header within 2 inches of the device for reliable programming, and add test points for PROG_N, CONFIG_DONE, and INIT_DONE signals for debugging.
A common pitfall is configuring the HPS boot source pins incorrectly, which can cause non-boot. Verify MSEL[4:0] and BOOTSEL pin straps against the intended boot source (QSPI, SD, NAND, or eMMC) before board bring-up. Another pitfall is omitting the external watchdog or reset supervisor on HPS reset, leading to boot hangs on power glitches. Always include a POR supervisor with appropriate reset pulse width.
Compliance Information
RoHS and REACH compliance per Intel Arria 10 product documentation. AEC-Q100 qualification is not applicable for FPGAs (this is an automotive IC qualification standard typically not pursued for high-density FPGAs). Conflict minerals compliance per Intel's published Conflict-Free Smelter Program disclosures.
