A3P1000L-1FGG144 - ProASIC3L Low Power Flash FPGA | Microchip
MPN： A3P1000L-1FGG144 ✓ 啟用中A3P1000L-1FGG144 概覽
A Flash FPGA is a field-programmable gate array whose configuration is stored in on-chip flash cells rather than volatile SRAM, so it boots instantly at power-up with no external configuration device. Within the programmable logic hierarchy, the ProASIC3L sits in Microchip (formerly Microsemi/Actel) ProASIC3 family and targets low total cost of ownership designs that need single-chip, secure, reprogrammable logic.
Key features include a wide 1.14 V to 1.575 V core supply supporting 1.2 V to 1.5 V core operation, Flash*Freeze technology for near-zero static power in standby, instant-on flash configuration, and reprogrammability without external boot flash. The 97 available user I/O support common single-ended standards with industrial-friendly drive characteristics.
Technically, the device is built on a flash-based CMOS fabric with a sea-of-modules architecture; the speed grade -1 designates the standard performance bin, while the L suffix denotes the low-power ProASIC3L variant with Flash*Freeze mode. Deterministic flash routing avoids configuration-pull-up glitches at startup, a benefit over SRAM FPGAs for control and power-sequencing logic.
Typical applications include industrial automation control, portable and battery-powered instrumentation, power sequencing and glue logic, and secure single-chip embedded controllers.
Design consideration: because the -1 speed grade is the slowest bin, verify timing closure for high-frequency interfaces and prefer faster grades such as -2 where clock rates exceed roughly 100 MHz equivalents.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替換替代品，適用於 A3P1000L-1FGG144 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： A3P1000L-1FGG144 （相同外形與佔位） — 差異在於 Package, Operating Temperature, Family, RoHS Status, System Gates.
A3P1000L-1FGG144I
✅ 直接替換📋 參考替代品（不在目錄中）
A3P1000L-1FGG144YI
✅ 直接替換📋 參考替代品（不在目錄中）
A3P1000-1FGG144T
✅ 直接替換聯絡詢價
查看資料表 →A3P1000-2FGG144
✅ 直接替換聯絡詢價
查看資料表 →A3P1000-2FGG144I
✅ 直接替換聯絡詢價
查看資料表 →A3P1000L-1FGG144 最大額定值與電氣特性
| Logic Elements | 24576 |
| Equivalent System Gates | 1000000 |
| User I/O | 97 |
| Family | ProASIC3L (Flash*Freeze) |
| Core Supply Voltage Range | 1.14 V to 1.575 V |
| Core Voltage Options | 1.2 V to 1.5 V |
| Speed Grade | -1 |
| Configuration Memory | On-chip Flash (non-volatile, instant-on) |
| 工作溫度 | 0C to +85C (TJ) |
| 封裝 | 144-LBGA / 144-FPBGA (13x13 mm) |
| 安裝類型 | Surface Mount |
| Packaging | Tray |
| RoHS 狀態 | ROHS3 Compliant |
| Product Status | Active |
| Manufacturer Lead Time | 8 weeks |
A3P1000L-1FGG144 144-lbga / 144-fpbga (13x13 mm) 腳位配置指南
A3P1000L-1FGG144（144-lbga / 144-fpbga (13x13 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： A3P1000L-1FGG144.
請參閱 資料表 以查看完整腳位配置。
典型應用
A3P1000L-1FGG144 適用於 6 應用s: Industrial Automation and Control, Portable and Battery-Powered Instruments, Power Sequencing and Board Management, Secure Single-Chip Embedded Controllers, Communications and Networking Line Cards, Medical and Diagnostic Equipment.
Industrial Automation and Control
The A3P1000L-1FGG144 fits industrial automation control nodes that need deterministic, instant-on logic without an external configuration device. Its 24,576 logic elements and 97 user I/O provide enough capacity for sensor aggregation, state machines, and motor-interface glue logic, while the on-chip flash fabric boots within microseconds of power application - critical in factory equipment where I/O must be valid immediately at power-up. The 1.14 V to 1.575 V core supply supports 1.2 V and 1.5 V rails common in modern industrial boards. In a typical topology, the FPGA sits between a microcontroller and field-side drivers, implementing safety interlocks and sequencing that must never depend on software boot time; the flash-based fabric keeps this logic fail-safe and reprogrammable in the field.
推薦
Portable and Battery-Powered Instruments
Battery-powered instruments benefit directly from the L suffix on the A3P1000L: Flash*Freeze technology drops the device into an ultra-low static power standby state while preserving logic state and I/O, then resumes full operation in microseconds on a wake event. In a handheld data logger, the FPGA can manage display scanning, sensor front-end timing, and power gating, then enter Flash*Freeze between measurement windows. The wide 1.14 V to 1.575 V core tolerance allows direct operation from a single-cell Li-ion rail through a small buck regulator, and the absence of external configuration flash removes boot current spikes and one BOM line. The 13x13 mm, 1.0 mm-pitch 144-ball package keeps board area compact for handheld enclosures while remaining reworkable.
推薦
Power Sequencing and Board Management
Complex boards with multiple rails need power sequencing that is valid the instant power arrives - before any processor boots. The A3P1000L-1FGG144 is well suited because its flash configuration is non-volatile and instant-on: 24,576 logic elements implement sequencer state machines, brown-out monitors, and enable-chain logic, while 97 user I/O drive enable pins and monitor POWERGOOD signals across many regulators. Unlike SRAM FPGAs, the device cannot be caught un-configured during startup, so sequencing behaves identically across every power cycle. Place the FPGA on the earliest auxiliary rail, feed it with a precision supervisor, and assign I/O banks to the voltage domains they control. Flash*Freeze also lets the sequencer idle at near-zero static power in normal operation.
推薦
Secure Single-Chip Embedded Controllers
Flash-based ProASIC3L devices store their bitstream in non-volatile on-chip flash cells, which are inherently harder to read out than SRAM configuration memories, supporting designs where configuration confidentiality matters. The A3P1000L-1FGG144 with 1,000,000 gates and 24,576 logic elements can host a soft processor, encryption wrappers, and custom peripherals in one chip, eliminating the external boot flash that would otherwise expose the configuration image on a readable bus. Typical uses include secure industrial gateways, metering front ends, and anti-tamper control logic. Design the security boundary around the JTAG port - disable or lock it after production programming - and use the 97 user I/O for tamper-detect inputs. Reprogrammability permits in-field security updates without socketed parts.
推薦
Communications and Networking Line Cards
In networking equipment, the A3P1000L-1FGG144 serves as line-card glue logic: frame-buffer control, LED or status supervision, hot-swap event handling, and bridging between a host CPU and PHY devices. The -1 speed grade covers control-plane and moderate-throughput tasks, while 97 user I/O accommodate parallel buses to MACs, framer devices, and backplane connectors. Instant-on behavior ensures the card signals present-in-service as soon as power is applied, and flash reprogrammability allows feature updates during maintenance windows without changing hardware. The 13x13 mm BGA conserves line-card real estate, and the 1.14 V to 1.575 V core range tolerates supply droop from shared backplane rails when properly decoupled with bulk and 0.1 uF ceramics at each supply ball.
推薦
Medical and Diagnostic Equipment
Diagnostic instruments such as benchtop analyzers and portable monitoring devices use the A3P1000L-1FGG144 for sensor timing, acquisition sequencing, and interface bridging. The flash fabric delivers deterministic, software-independent timing for ADC sampling windows - important where measurement repeatability is regulated - and the 24,576 logic elements comfortably implement multi-channel capture pipelines. Low standby power through Flash*Freeze extends battery life in portable monitors, and single-chip configuration reduces the component count that must be qualified for medical manufacturing. Use the 97 user I/O for front-end control, isolation-buffer interfacing, and front-panel functions, and partition safety-critical cutoff logic into the FPGA so it cannot be affected by an application-processor crash or slow boot.
推薦
推薦產品摘要
工程參考資料，適用於 A3P1000L-1FGG144 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | A3P1000L-1FGG144I | A3P1000L-1FGG144YI | A3P1000-1FGG144T | A3P1000-2FGG144 | A3P1000-2FGG144I |
|---|---|---|---|---|---|---|
| Package | 144-FBGA (FGG144, 13x13 mm) | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Logic Elements | 24576 | 24576 | 24576 | 24576 | 24576 | 24576 |
| User I/O | 97 | 97 | 97 | 97 | 97 | 97 |
| Speed Grade | -1 | -1 | -1 | -1 | -2 (faster) | -2 (faster) |
| Flash*Freeze Low-Power Mode | Yes | Yes | Yes | No | No | No |
| Operating Temperature | 0C to +85C (TJ) | -40C to +100C (TJ), industrial | Extended Y bin | Commercial | Commercial | Industrial |
| Core Supply Voltage | 1.14 V to 1.575 V | 1.14 V to 1.575 V | 1.14 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
| Lifecycle Status | Active | Active | Active | Active | Active | Active |
主要差異化特點
- Flash*Freeze ultra-low standby power (對比A3P1000-2FGG144)
- Wider core supply tolerance (對比A3P1000-1FGG144T)
- Industrial temperature upgrade path (對比A3P1000L-1FGG144I)
- Lower unit cost at equal capacity (對比A3P1000-2FGG144)
設計說明
The A3P1000L-1FGG144 core tolerates 1.14 V to 1.575 V, but static and dynamic current scale strongly with core voltage - running at 1.2 V instead of 1.5 V significantly reduces power, which matters for the low-power intent of the L variant. Provide independent core and I/O bank rails, decouple every supply ball with 0.1 uF ceramics plus local bulk capacitance. Because the device is flash-configured at power-up, ensure the core rail is monotonic and within specification before system READY signals are released.
The FGG144 package is a 13x13 mm fine-pitch BGA; plan an HDI-capable fan-out with via-in-pad or dog-bone escape routing on the inner ball rows. Follow the ProASIC3L datasheet land-pattern recommendation for ball pitch and mask opening. Dedicate solid ground planes beneath the die for return paths, and route JTAG (TDI, TDO, TMS, TCK) with series termination and access to a production programming header for FlashPro in-circuit updates.
The -1 speed grade is the slowest bin in the ProASIC3L family: verify timing closure with Libero static timing analysis before committing, and do not assume SRAM-FPGA-class fabric frequencies. Second, Flash*Freeze mode requires proper entry/exit sequencing per the datasheet - I/O states are held, but wake sources must be qualified. Third, the commercial 0C to +85C (TJ) rating means junction, not ambient; compute junction temperature from estimated core power and the package theta-JA before finalizing enclosure thermal design.
合規資訊
ROHS3 Compliant per Microchip USA product data. Lead-free tray packaging. REACH, halogen-free, and conflict-minerals declarations not stated in provided data - request official compliance package from Microchip.
