A3PE3000L-1FGG484M - ProASIC3L Flash FPGA 35K LEs | Microchip
MPN： A3PE3000L-1FGG484M ✓ 啟用中A3PE3000L-1FGG484M 概覽
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of programmable logic blocks and interconnects that designers configure to implement custom digital circuits. Within the programmable logic hierarchy, the ProASIC3L family sits in the low-power, mid-density class of flash FPGAs, distinct from SRAM-based FPGAs because configuration is stored in non-volatile on-chip flash, enabling single-chip, live-at-power-up operation without an external boot flash.
Key features of the A3PE3000L include a 1.2 V core voltage (the L suffix denotes low-power operation), I/O operation as low as 1.2 V, and Microchip's Flash*Freeze technology, which the datasheet states reduces dynamic power by 40% and static power by 50% versus the equivalent ProASIC3 device. The device is fabricated on a 130-nm, 7-layer-metal (6 copper) flash-based CMOS process and is reprogrammable in-system.
Architecturally, the ProASIC3L fabric consists of VersaTiles (logic modules), embedded SRAM blocks, and abundant routing resources, supporting system performance suited to glue logic consolidation, interface bridging, and control-path implementations. Level 0 support and true single-chip operation simplify board design and improve reliability versus multi-chip configuration schemes.
Typical applications include industrial control and automation, portable and battery-powered instrumentation, aerospace/defense payloads requiring non-volatile, secure configuration, and communications line cards where the low static power of the flash fabric and the Flash*Freeze mode directly extend battery life or reduce thermal budget.
A key design consideration: the -1 speed grade balances performance against the lowest dynamic power; verify I/O bank voltage assignment early since VCCI can be as low as 1.2 V per bank. Use Microchip Libero SoC design suite for synthesis and place-and-route.
This page synthesizes distributor pricing and stock, drop-in alternatives within the same 484-BGA footprint, and practical design notes not found in the manufacturer datasheet alone.
直接替換替代品，適用於 A3PE3000L-1FGG484M — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： A3PE3000L-1FGG484M （相同外形與佔位） — 差異在於 Family, Package, Process Technology, Operating Temperature, System Gates.
M1A3PE3000L-1FGG484M
✅ 直接替換📋 參考替代品（不在目錄中）
A3PE3000L-FGG484M
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000L-1FGG484I
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000L-1FG484M
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000L-FG484M
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000L-FGG484I
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000L-1FGG484M 最大額定值與電氣特性
| Family | ProASIC3L (Flash FPGAs with Flash*Freeze) |
| System Gates | 3000000 |
| Logic Elements | 35K LEs |
| CLBs | 75264 |
| User I/Os | 341 |
| Embedded SRAM | 516096 bits (504 kbits) true dual-port |
| Core Voltage | 1.2 V to 1.5 V |
| I/O Voltage (VCCI) | as low as 1.2 V |
| Process Technology | 130 nm, 7-layer metal (6 copper) flash-based CMOS |
| Speed Grade | -1 |
| Configuration | Non-volatile Flash, live-at-power-up, single-chip, reprogrammable |
| Special Features | Flash*Freeze technology |
| 封裝 | 484-ball FBGA (FGG484), 1 mm pitch |
| 安裝類型 | Surface Mount |
| Design Software | Microchip Libero SoC |
A3PE3000L-1FGG484M 484-ball fbga (fgg484), 1 mm pitch 腳位配置指南
A3PE3000L-1FGG484M（484-ball fbga (fgg484), 1 mm pitch 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： A3PE3000L-1FGG484M.
請參閱 資料表 以查看完整腳位配置。
典型應用
A3PE3000L-1FGG484M 適用於 6 應用s: Industrial Control and Automation, Portable and Battery-Powered Instrumentation, Aerospace and Defense Payloads, Communications Line Cards and Networking, Medical and Diagnostic Equipment, Test and Measurement Systems.
Industrial Control and Automation
The A3PE3000L-1FGG484M fits industrial control and factory automation systems where deterministic, single-chip logic consolidation is more valuable than peak fabric frequency. Its 3M system gates (75264 CLBs) absorb glue logic, motor-control sequencing, and protocol bridging that would otherwise require multiple CPLDs and discretes, while 341 user I/Os interface sensors, encoders, and fieldbus transceivers directly. Because configuration resides in on-chip flash, the device is live at power-up with no external boot device, eliminating configuration-time latency on production lines and improving robustness against power interruptions. The 1.2 V-capable I/O banks (VCCI as low as 1.2 V per datasheet DS50003268) also ease level shifting to modern low-voltage ASICs and microprocessors.
推薦
Portable and Battery-Powered Instrumentation
Battery-powered instruments benefit directly from the A3PE3000L-1FGG484M's power profile: per Microchip datasheet DS50003268, ProASIC3L devices reduce dynamic power by 40% and static power by 50% versus the equivalent standard ProASIC3, and Flash*Freeze technology provides a near-zero-power standby state that retains all register and SRAM contents. A handheld data logger, for example, can freeze the fabric between measurement bursts and resume instantly, dramatically extending battery life compared with SRAM FPGAs that must either stay active or reconfigure from external flash. The 504 kbits of true dual-port SRAM buffer acquisition data on-chip, and the 1.2 V to 1.5 V core operation suits single-cell Li-ion derived rails.
推薦
Aerospace and Defense Payloads
The ProASIC3L family (originally Actel/Microsemi) is widely deployed in aerospace and defense applications, and the -M graded A3PE3000L-1FGG484M addresses that channel. Flash-based configuration gives single-chip, live-at-power-up operation without a configuration PROM, reducing board area and removing a common radiation and reliability weak point in hostile environments. The 3M-gate fabric implements payload processing, telemetry framing, and bus interfaces (MIL-STD-1553 style glue, UART/CLI bridges), while 341 I/Os handle parallel backplanes. Alldatasheet references a Military ProASIC3/EL low-power flash variant line, underlining the family's defense heritage; designers should confirm program-level screening (flow) with Microchip directly.
推薦
Communications Line Cards and Networking
In telecom and data-communications line cards, the A3PE3000L-1FGG484M serves as fabric glue between framing devices, PHYs, and backhaul processors. Its 75264 CLBs and 504 kbits of true dual-port SRAM implement FIFOs, deskew buffers, and status aggregation, while the 484-ball, 1-mm-pitch FBGA provides 341 user I/Os for wide parallel buses. The -1 speed grade balances fabric performance against power, important on densely populated cards where the low static power of the flash fabric eases thermal budget. Flash*Freeze allows quiescent line cards in idle slots to drop to standby power without losing link state, a capability SRAM-based FPGAs cannot match without full reconfiguration on wake.
推薦
Medical and Diagnostic Equipment
Medical diagnostic instruments - patient monitors, portable analyzers, imaging front ends - require quiet, reliable, power-efficient control logic, all matched by the A3PE3000L-1FGG484M. The non-volatile flash fabric is live at power-up with no configuration delay, so acquisition channels are ready as soon as the system powers on, supporting fast instrument turn-around in clinical workflows. The low static power (50% below equivalent ProASIC3 per the datasheet) and Flash*Freeze standby reduce heat inside enclosed housings, improving patient-contact comfort and component longevity. With 341 I/Os and 1.2 V-capable banks, the device bridges modern low-voltage sensor AFEs to legacy 3.3 V system buses within a single 484-BGA chip.
推薦
Test and Measurement Systems
Bench and automated test equipment uses the A3PE3000L-1FGG484M as a flexible timing, trigger, and routing fabric. The 3M-gate capacity implements channel multiplexing, trigger state machines, and SCPI-driven control planes, while 504 kbits of true dual-port SRAM capture waveform segments without external buffering. Because the device is field-reprogrammable via on-chip flash, instrument vendors ship one hardware platform and differentiate via firmware updates - a low total-cost-of-ownership advantage highlighted on Microchip's product page. The single-chip (no boot PROM) configuration also shortens boot time, so instruments are measurement-ready almost immediately after power-on, and 341 I/Os support dense probe-matrix switching.
推薦
推薦產品摘要
工程參考資料，適用於 A3PE3000L-1FGG484M — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | M1A3PE3000L-1FGG484M | A3PE3000L-FGG484M | A3PE3000L-1FGG484I | A3PE3000L-1FG484M |
|---|---|---|---|---|---|
| Package | 484-ball FBGA (FGG484), 1 mm pitch | 484-ball FBGA (FGG484) - same | 484-ball FBGA (FGG484) - same | 484-ball FBGA (FGG484) - same | 484-ball FBGA (FG484) - same body/pinout, ball variant |
| Brand | Microchip Technology | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates / Logic | 3M gates, 35K LEs, 75264 CLBs | 3M gates, 75264 CLBs | 3M gates, 35K LEs | 3M gates, 35K LEs | 3M gates, 35K LEs |
| User I/Os | 341 | 341 | 341 | 341 | 341 |
| Speed Grade | -1 | -1 | standard (no -1 prefix) | -1 | -1 |
| Core Voltage | 1.2 V to 1.5 V (low-power L family) | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V |
| Flash*Freeze Technology | Yes | Yes | Yes | Yes | Yes |
| Configuration | Non-volatile flash, live-at-power-up, single-chip | Non-volatile flash, single-chip | Non-volatile flash, single-chip | Non-volatile flash, single-chip | Non-volatile flash, single-chip |
主要差異化特點
- Lowest-power family member choice with -1 speed grade (對比A3PE3000L-FGG484M)
- Identical die under Microchip rebranding enables second sourcing (對比M1A3PE3000L-1FGG484M)
- Industrial temperature option in the exact same footprint (對比A3PE3000L-1FGG484I)
設計說明
Exploit Flash*Freeze aggressively in duty-cycled systems. Per datasheet DS50003268, ProASIC3L cuts dynamic power by 40% and static power by 50% versus equivalent ProASIC3 parts, and entering Flash*Freeze retains all state. Estimate: at even modest static savings of tens of milliwatts in a 3M-gate fabric, a battery-powered instrument can multiply standby life several-fold by freezing between bursts. Power the core at 1.2 V (not 1.5 V) unless timing analysis in Libero SoC demands more, since core current scales with voltage.
The FGG484 package uses a 1.0 mm ball pitch, so design the land pattern per the manufacturer-recommended pad geometry in the ProASIC3L datasheet package chapter. Plan I/O bank assignment early: VCCI is set per bank and can be as low as 1.2 V, so group same-voltage interfaces (e.g., 3.3 V backplane, 1.2 V ASIC-side bus) onto their own banks before routing. Escape routing at 1 mm pitch typically requires 0.2-0.25 mm via-in-pad or dog-bone escapes on 4+ layer boards.
Do not confuse suffix variants when purchasing: A3PE3000L-1FGG484M, -1FGG484I, -FGG484M, and 1FG484M share the same pinout but differ in speed grade, temperature grading, and ball finish - a mismatch may fail qualification even though the board works. Also verify lifecycle and screening level for defense programs directly with Microchip; the -M graded suffix historically serves that channel. Finally, static timing analysis on the -1 grade is mandatory before tape-out if you target near the family's maximum system frequency.
合規資訊
Compliance data for the exact -M suffix was not captured in the verified web data; consult Microchip's product page or distributor compliance tabs (Mouser/DigiKey) for certificates.
