A3PE3000L-1FGG484M - ProASIC3L Flash FPGA 35K LEs | Microchip
MPN: A3PE3000L-1FGG484M ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $149.5 | $149.50 |
| 10 | $141.2 | $1,412.00 |
| 100 | $132.8 | $13,280.00 |
| 500 | $124.9 | $62,450.00 |
| 1,000 | $117.6 | $117,600.00 |
Drop-in alternatives for A3PE3000L-1FGG484M — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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M1A3PE3000L-1FGG484M
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A3PE3000L-FGG484M
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$298 / Unit
View Datasheet →A3PE3000L-1FGG484I
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$104.5 / Unit
View Datasheet →A3PE3000L-1FG484M
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View Datasheet →A3PE3000L-FG484M
✅ Drop-In✓ In Stock
$129 / Unit
View Datasheet →A3PE3000L-FGG484I
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Contact for price
View Datasheet →A3PE3000L-1FGG484M Maximum Ratings & Electrical Characteristics
| Family | ProASIC3L (Flash FPGAs with Flash*Freeze) |
| System Gates | 3000000 |
| Logic Elements | 35K LEs |
| CLBs | 75264 |
| User I/Os | 341 |
| Embedded SRAM | 516096 bits (504 kbits) true dual-port |
| Core Voltage | 1.2 V to 1.5 V |
| I/O Voltage (VCCI) | as low as 1.2 V |
| Process Technology | 130 nm, 7-layer metal (6 copper) flash-based CMOS |
| Speed Grade | -1 |
| Configuration | Non-volatile Flash, live-at-power-up, single-chip, reprogrammable |
| Special Features | Flash*Freeze technology |
| Package | 484-ball FBGA (FGG484), 1 mm pitch |
| Mounting Type | Surface Mount |
| Design Software | Microchip Libero SoC |
A3PE3000L-1FGG484M 484-ball fbga (fgg484), 1 mm pitch Pin Configuration Guide
Complete pinout information for A3PE3000L-1FGG484M (484-ball fbga (fgg484), 1 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000L-1FGG484M.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000L-1FGG484M is suitable for 6 applications: Industrial Control and Automation, Portable and Battery-Powered Instrumentation, Aerospace and Defense Payloads, Communications Line Cards and Networking, Medical and Diagnostic Equipment, Test and Measurement Systems.
Industrial Control and Automation
The A3PE3000L-1FGG484M fits industrial control and factory automation systems where deterministic, single-chip logic consolidation is more valuable than peak fabric frequency. Its 3M system gates (75264 CLBs) absorb glue logic, motor-control sequencing, and protocol bridging that would otherwise require multiple CPLDs and discretes, while 341 user I/Os interface sensors, encoders, and fieldbus transceivers directly. Because configuration resides in on-chip flash, the device is live at power-up with no external boot device, eliminating configuration-time latency on production lines and improving robustness against power interruptions. The 1.2 V-capable I/O banks (VCCI as low as 1.2 V per datasheet DS50003268) also ease level shifting to modern low-voltage ASICs and microprocessors.
Recommended
Portable and Battery-Powered Instrumentation
Battery-powered instruments benefit directly from the A3PE3000L-1FGG484M's power profile: per Microchip datasheet DS50003268, ProASIC3L devices reduce dynamic power by 40% and static power by 50% versus the equivalent standard ProASIC3, and Flash*Freeze technology provides a near-zero-power standby state that retains all register and SRAM contents. A handheld data logger, for example, can freeze the fabric between measurement bursts and resume instantly, dramatically extending battery life compared with SRAM FPGAs that must either stay active or reconfigure from external flash. The 504 kbits of true dual-port SRAM buffer acquisition data on-chip, and the 1.2 V to 1.5 V core operation suits single-cell Li-ion derived rails.
Recommended
Aerospace and Defense Payloads
The ProASIC3L family (originally Actel/Microsemi) is widely deployed in aerospace and defense applications, and the -M graded A3PE3000L-1FGG484M addresses that channel. Flash-based configuration gives single-chip, live-at-power-up operation without a configuration PROM, reducing board area and removing a common radiation and reliability weak point in hostile environments. The 3M-gate fabric implements payload processing, telemetry framing, and bus interfaces (MIL-STD-1553 style glue, UART/CLI bridges), while 341 I/Os handle parallel backplanes. Alldatasheet references a Military ProASIC3/EL low-power flash variant line, underlining the family's defense heritage; designers should confirm program-level screening (flow) with Microchip directly.
Recommended
Communications Line Cards and Networking
In telecom and data-communications line cards, the A3PE3000L-1FGG484M serves as fabric glue between framing devices, PHYs, and backhaul processors. Its 75264 CLBs and 504 kbits of true dual-port SRAM implement FIFOs, deskew buffers, and status aggregation, while the 484-ball, 1-mm-pitch FBGA provides 341 user I/Os for wide parallel buses. The -1 speed grade balances fabric performance against power, important on densely populated cards where the low static power of the flash fabric eases thermal budget. Flash*Freeze allows quiescent line cards in idle slots to drop to standby power without losing link state, a capability SRAM-based FPGAs cannot match without full reconfiguration on wake.
Recommended
Medical and Diagnostic Equipment
Medical diagnostic instruments - patient monitors, portable analyzers, imaging front ends - require quiet, reliable, power-efficient control logic, all matched by the A3PE3000L-1FGG484M. The non-volatile flash fabric is live at power-up with no configuration delay, so acquisition channels are ready as soon as the system powers on, supporting fast instrument turn-around in clinical workflows. The low static power (50% below equivalent ProASIC3 per the datasheet) and Flash*Freeze standby reduce heat inside enclosed housings, improving patient-contact comfort and component longevity. With 341 I/Os and 1.2 V-capable banks, the device bridges modern low-voltage sensor AFEs to legacy 3.3 V system buses within a single 484-BGA chip.
Recommended
Test and Measurement Systems
Bench and automated test equipment uses the A3PE3000L-1FGG484M as a flexible timing, trigger, and routing fabric. The 3M-gate capacity implements channel multiplexing, trigger state machines, and SCPI-driven control planes, while 504 kbits of true dual-port SRAM capture waveform segments without external buffering. Because the device is field-reprogrammable via on-chip flash, instrument vendors ship one hardware platform and differentiate via firmware updates - a low total-cost-of-ownership advantage highlighted on Microchip's product page. The single-chip (no boot PROM) configuration also shortens boot time, so instruments are measurement-ready almost immediately after power-on, and 341 I/Os support dense probe-matrix switching.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000L-1FGG484M — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M1A3PE3000L-1FGG484M | A3PE3000L-FGG484M | A3PE3000L-1FGG484I | A3PE3000L-1FG484M |
|---|---|---|---|---|---|
| Package | 484-ball FBGA (FGG484), 1 mm pitch | 484-ball FBGA (FGG484) - same | 484-ball FBGA (FGG484) - same | 484-ball FBGA (FGG484) - same | 484-ball FBGA (FG484) - same body/pinout, ball variant |
| Brand | Microchip Technology | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates / Logic | 3M gates, 35K LEs, 75264 CLBs | 3M gates, 75264 CLBs | 3M gates, 35K LEs | 3M gates, 35K LEs | 3M gates, 35K LEs |
| User I/Os | 341 | 341 | 341 | 341 | 341 |
| Speed Grade | -1 | -1 | standard (no -1 prefix) | -1 | -1 |
| Core Voltage | 1.2 V to 1.5 V (low-power L family) | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V |
| Flash*Freeze Technology | Yes | Yes | Yes | Yes | Yes |
| Configuration | Non-volatile flash, live-at-power-up, single-chip | Non-volatile flash, single-chip | Non-volatile flash, single-chip | Non-volatile flash, single-chip | Non-volatile flash, single-chip |
Key Differentiators
- Lowest-power family member choice with -1 speed grade (vs A3PE3000L-FGG484M)
- Identical die under Microchip rebranding enables second sourcing (vs M1A3PE3000L-1FGG484M)
- Industrial temperature option in the exact same footprint (vs A3PE3000L-1FGG484I)
Design Notes
Exploit Flash*Freeze aggressively in duty-cycled systems. Per datasheet DS50003268, ProASIC3L cuts dynamic power by 40% and static power by 50% versus equivalent ProASIC3 parts, and entering Flash*Freeze retains all state. Estimate: at even modest static savings of tens of milliwatts in a 3M-gate fabric, a battery-powered instrument can multiply standby life several-fold by freezing between bursts. Power the core at 1.2 V (not 1.5 V) unless timing analysis in Libero SoC demands more, since core current scales with voltage.
The FGG484 package uses a 1.0 mm ball pitch, so design the land pattern per the manufacturer-recommended pad geometry in the ProASIC3L datasheet package chapter. Plan I/O bank assignment early: VCCI is set per bank and can be as low as 1.2 V, so group same-voltage interfaces (e.g., 3.3 V backplane, 1.2 V ASIC-side bus) onto their own banks before routing. Escape routing at 1 mm pitch typically requires 0.2-0.25 mm via-in-pad or dog-bone escapes on 4+ layer boards.
Do not confuse suffix variants when purchasing: A3PE3000L-1FGG484M, -1FGG484I, -FGG484M, and 1FG484M share the same pinout but differ in speed grade, temperature grading, and ball finish - a mismatch may fail qualification even though the board works. Also verify lifecycle and screening level for defense programs directly with Microchip; the -M graded suffix historically serves that channel. Finally, static timing analysis on the -1 grade is mandatory before tape-out if you target near the family's maximum system frequency.
Compliance Information
Compliance data for the exact -M suffix was not captured in the verified web data; consult Microchip's product page or distributor compliance tabs (Mouser/DigiKey) for certificates.
