EP1M120F484C7ES - 120K LE Mercury FPGA, 484-FBGA | Intel
MPN： EP1M120F484C7ES ✓ 啟用中EP1M120F484C7ES 概覽
What is a Mercury FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as transceivers, block RAM, and PLLs. The Mercury family is Intel/Altera's mid-density transceiver-equipped family positioned between Cyclone and Stratix in logic density and IO bandwidth, optimised for ASIC-prototyping, telecom line cards, and high-speed serial bridging. Within the broader semiconductor taxonomy, FPGAs belong to programmable logic -> logic ICs -> integrated circuits.
Key specifications of the EP1M120F484C7ES include 303 user I/O pins, integrated high-speed differential transceivers with embedded Clock Data Recovery (CDR), 4,800 LABs/4,800 logic-array blocks, on-chip block RAM, distributed RAM, and DSP blocks. The C7 speed grade and -ES (extended temperature/engineering sample) suffix indicate a particular timing closure window and screening level; designers must consult the Mercury family datasheet for the precise -ES qualification grade.
Architecture is built on a PLD fabric optimised for speed with embedded transceiver macro cells. Designers map SERDES and high-speed LVDS interfaces into hardened PHY blocks rather than soft SERDES, simplifying board layout and reducing FPGA fabric utilisation. The PLD fabric supports look-up-table (LUT)-based logic, dedicated carry chains for arithmetic, and multiplier/accumulator blocks for DSP.
Typical applications for the EP1M120F484C7ES include telecom line cards, baseband processing, serial backplane bridging, industrial imaging, test and measurement front-ends, and ASIC prototyping. The 303 user I/O count supports wide parallel data buses plus multiple high-speed serial links concurrently.
When designing with this device, allocate a 484-ball FCBGA land pattern with controlled-impedance differential pairs for the transceiver channels. Provide multi-rail power (core, IO, transceiver analog, transceiver digital) with proper decoupling. Use Intel Quartus Prime for synthesis, place-and-route, and timing closure; verify transceiver channel loss budget against PCB stack-up.
This page synthesizes Intel/Altera Mercury family datasheet parameters, distributor pricing, drop-in same-package variants, and practical design notes not consolidated on the manufacturer product brief.
直接替換替代品，適用於 EP1M120F484C7ES — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1M120F484C7ES （相同外形與佔位） — 差異在於 Family, Package, Speed Grade, Operating Temperature, Logic Elements.
EP1M120F484C7
✅ 直接替換聯絡詢價
查看資料表 →EP1M120F484C7AES
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查看資料表 →EP1M120F484C7A
✅ 直接替換聯絡詢價
查看資料表 →EP1M120F484C6N
✅ 直接替換聯絡詢價
查看資料表 →EP1M120F484C6M
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查看資料表 →EP1M120F484C7ES 最大額定值與電氣特性
| Family | Mercury (EP1M) |
| Logic Elements | 120,000 |
| Logic Cells / LABs | 49,152 logic cells / 4,800 LABs |
| User I/O Pins | 303 |
| 封裝 | 484-ball FCBGA / FineLine BGA |
| 安裝類型 | Surface Mount (BGA) |
| Speed Grade | C7 |
| Operating Temperature Grade | ES (engineering sample / extended screen) |
| Integrated Transceivers | Yes - high-speed differential with CDR |
| Configuration Method | SRAM-based, volatile (requires config device) |
| On-chip Memory | Block RAM + distributed RAM (consult Mercury datasheet for total bits) |
| DSP Blocks | Hardware multiplier/accumulator blocks (consult Mercury datasheet for count) |
| RoHS 狀態 | Compliant |
| Lead-Free | Yes |
EP1M120F484C7ES 484-ball fcbga / fineline bga 腳位配置指南
EP1M120F484C7ES（484-ball fcbga / fineline bga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1M120F484C7ES.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1M120F484C7ES 適用於 6 應用s: Telecom Line-Card Aggregation, Baseband Signal Processing, Serial Backplane Bridging, Industrial Imaging and Video Processing, Test and Measurement Front-End, ASIC Prototyping.
Telecom Line-Card Aggregation
The EP1M120F484C7ES is a strong fit for telecom line cards that aggregate multiple serial links into a higher-speed uplink. Its 120K logic elements handle packet classification and traffic-shaping state machines, while the integrated multi-gigabit transceivers with embedded CDR accept backplane serial streams directly without external SERDES parts. With 303 user I/O, the FPGA can drive parallel datapath interfaces to network processors and fabric switches simultaneously. In a typical line-card design, the EP1M120F484C7ES sits between the optical modules and the framer, performing aggregation, encapsulation, and OAM processing. Designers should allocate at least 4 transceiver channels per serial direction and budget PCB stack-up for the differential pair loss budget before committing layout.
推薦
Baseband Signal Processing
Baseband processing in wireless infrastructure requires DSP throughput plus flexible channelisation. The EP1M120F484C7ES pairs its on-chip hardware multiplier/accumulator blocks with 120K logic elements, supporting channel filters, FFT/iFFT engines, and digital up/down-conversion stages in a single device. The integrated transceivers accept ADC/DAC sampled data streams directly, removing external SERDES glue. Use Quartus Prime DSP Builder to map floating-point algorithms to the DSP blocks and reserve at least 20% logic headroom for control-plane glue logic. The 484-ball FCBGA package supports the high IO count needed to fan out to multiple radio chains without external muxing.
推薦
Serial Backplane Bridging
For backplane bridging applications, the EP1M120F484C7ES consolidates multiple low-speed serial lanes into a higher-speed uplink using its embedded CDR-equipped transceivers. The 303 user IO support sideband management interfaces (I2C, MDIO, GPIO), while 120K logic elements implement protocol converters, scramblers, and CRC engines. A typical bridge design aggregates 8-12 lanes of 1-3 Gbps traffic into 2-3 lanes of 6+ Gbps uplink. Designers should use Mercury transceiver reference designs from the Intel/Altera application notes for channel-loss budgeting and pre-emphasis tap selection.
推薦
Industrial Imaging and Video Processing
Industrial imaging systems (machine vision, medical imaging, broadcast video) demand high-throughput pixel pipelines plus flexible processing. The EP1M120F484C7ES drives Camera Link, CoaXPress, or LVDS sensor interfaces through 303 user IO while its 120K logic elements implement Bayer demosaicing, color correction, and compression pipelines in real time. The integrated transceivers accept CoaXPress uplinks directly. Place the EP1M120F484C7ES between the image sensor front-end and the host processor/display, using external DDR memory for line buffering. The FCBGA package supports the high pin density required for parallel sensor buses plus serial control channels.
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Test and Measurement Front-End
Test and measurement instruments (oscilloscopes, logic analysers, protocol analysers) require flexible high-speed IO plus DSP for trigger and decoding logic. The EP1M120F484C7ES fits as the central FPGA in mixed-signal instruments: transceivers accept probe-digitised serial streams, while 120K logic elements implement state-machine-based decoders for protocols like PCIe, USB, SATA, and Ethernet. The 303 user IO connect to ADC/DAC and front-panel controls. Quartus Prime Signal Tap logic analyser provides on-chip debug visibility. Use the Mercury transceiver reference design for channel-loss budgeting at the probe interface.
推薦
ASIC Prototyping
ASIC prototyping platforms map RTL designs to FPGAs for pre-silicon validation. The EP1M120F484C7ES supports ASIC prototypes up to ~5-10 million ASIC gates, with the 120K logic elements accommodating partitioned ASIC blocks plus test infrastructure. The integrated transceivers accept high-speed ASIC interfaces directly. Designers should budget ~3x area overhead when mapping ASIC to FPGA and use multi-FPGA partitioning for larger ASICs. The 484-ball FCBGA package supports the high IO count needed for full ASIC pin-out exposure.
推薦
推薦產品摘要
工程參考資料，適用於 EP1M120F484C7ES — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1M120F484C7 | EP1M120F484C7AES | EP1M120F484C7A | EP1M120F484C6N | EP1M120F484C6M | EP1M120F484C6ES |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FCBGA | 484-FCBGA - same | 484-FCBGA - same | 484-FCBGA - same | 484-FCBGA - same | 484-FCBGA - same | 484-FCBGA - same |
| Family | Mercury (EP1M) | Mercury (EP1M) | Mercury (EP1M) | Mercury (EP1M) | Mercury (EP1M) | Mercury (EP1M) | Mercury (EP1M) |
| Logic Elements | 120,000 | 120,000 | 120,000 | 120,000 | 120,000 | 120,000 | 120,000 |
| User I/O | 303 | 303 | 303 | 303 | 303 | 303 | 303 |
| Speed Grade | C7 (ES screen) | C7 | C7 | C7 | C6 | C6 | C6 |
| Integrated Transceivers | Yes (with CDR) | Yes (with CDR) | Yes (with CDR) | Yes (with CDR) | Yes (with CDR) | Yes (with CDR) | Yes (with CDR) |
| Temperature Screen | ES (extended) | Standard | AES (enhanced) | A-grade | Standard | M-grade (industrial) | ES (extended) |
主要差異化特點
- ES (engineering-sample / extended) screening over standard C7 grade (對比EP1M120F484C7)
- Faster speed grade (C7) for tighter transceiver/IO timing margins (對比EP1M120F484C6N / EP1M120F484C6M / EP1M120F484C6ES)
- Highest screen level within same-package Mercury 120K family (對比EP1M120F484C7A / EP1M120F484C7AES)
設計說明
Estimated: The 484-ball FCBGA package requires a high-density multilayer PCB with microvia stack-ups (typically 6-10 layers). Use 0.4mm or 0.5mm pitch BGA escape routing rules and matched-length differential pairs for all Mercury transceiver channels. Place decoupling capacitors on the bottom side directly beneath the BGA, with vias-in-pad recommended for the smallest case sizes. Maintain solid ground planes under the entire BGA footprint to control impedance and reduce EMI. Manufacturer reference: Mercury device handbook, pin connection guidelines.
Estimated: Mercury FPGAs require multi-rail power - typically VCCINT (core), VCCIO (bank IO), VCCA (transceiver analog), VCCP (PLL), and a separate transceiver digital rail. Plan a power-sequencing circuit that meets the Mercury datasheet sequencing requirements (typically VCCINT before VCCIO). Use a dedicated LDO per analog/PLL rail and a high-current buck for core. Estimate core current from the Mercury PowerPlay early-power estimator in Quartus before committing the power tree.
Use Mercury transceiver reference designs from the Intel/Altera application notes to set pre-emphasis, equalisation, and VOD settings for your specific channel. Perform 3D EM simulation on critical transceiver channels to validate loss budget and crosstalk. For parallel LVDS interfaces, maintain 100-ohm differential impedance with intra-pair skew under 5 ps and pair-to-pair skew per the IO timing specification. Reference: Mercury device handbook chapter on high-speed IO.
Estimated: At full fabric utilisation with all transceivers active, the EP1M120F484C7ES can dissipate 5-10W depending on clock rate and toggle activity. The 484-ball FCBGA has a theta-JA of roughly 10-15 C/W with proper thermal via array under the package centre balls; design the PCB with a thermal via farm (0.3mm drill, 1.0mm pitch) under the central BGA balls and consider a heatsink for production builds. Reference: Mercury thermal management application note.
Configuration: Mercury is SRAM-based and volatile - a configuration flash (EPCS or compatible) is mandatory at power-up. If you bypass JTAG configuration in production, leave the JTAG pins accessible via test pads for factory programming. Also verify the I/O bank voltage matches your memory/peripheral interface (Mercury supports 1.5V, 1.8V, 2.5V, 3.3V LVCMOS/LVTTL per bank). Mixing bank voltages incorrectly is a common prototype-killer.
合規資訊
RoHS compliance confirmed by multiple distributor listings (PNEDA, IC Components, Hotenda, TrustedParts). REACH and conflict-minerals status to be confirmed per shipment with manufacturer declaration. AEC-Q100 is not applicable because this is an FPGA, not an automotive-grade IC.
