EP1S20F484C7N - Stratix FPGA, 18,460 LEs, 484-FBGA | Altera
MPN： EP1S20F484C7N ✗ 停產EP1S20F484C7N 概覽
An FPGA (Field Programmable Gate Array) is a programmable logic device whose architecture combines configurable logic blocks (CLBs), programmable interconnect, embedded memory (M4K/M-RAM blocks in Stratix), embedded multipliers (DSP blocks), and high-speed transceivers or PLLs. FPGAs belong to the broader semiconductor hierarchy of programmable logic devices (PLD) and serve as glue logic, co-processors, and prototyping vehicles in digital design. The Stratix family positioned above Cyclone and below Stratix GX in Altera's 2003-era lineup.
Key differentiating features of the EP1S20F484C7N include 1,846 LABs (Logic Array Blocks) with 2,132 CLBs, TriMatrix embedded memory totalling 1.7 Mbits with true dual-port RAM capability, dedicated 18x18 multipliers for DSP acceleration, and up to 361 LVDS/TTL-compatible user I/Os. The device supports configuration via passive serial (PS), passive parallel asynchronous (PPA), passive parallel synchronous (PPS), and JTAG modes.
Architecture depth: the device uses a row/column-based LAB structure connected by MultiTrack interconnect, with embedded RAM blocks configurable from 128x36 up to 4Kx36 bits. Phase-locked loops (PLLs) handle clock distribution and frequency synthesis, while the 1.5 V core is supported by separate VCCIO banks that allow mixed-voltage I/O interfacing (1.5 V, 1.8 V, 2.5 V, 3.3 V LVTTL/LVCMOS).
Typical applications include telecom line cards, video and image processing pipelines, high-speed serial protocol bridging, DSP front-ends, ASIC prototyping, and military/aerospace test equipment. Engineers select the EP1S20F484C7N for designs needing moderate logic density, generous on-chip memory, and a 484-FBGA footprint compatible with commercial-grade thermal envelopes.
Design consideration: the 484-FBGA (23x23 mm, 1.0 mm pitch) requires a 4-6 layer PCB with matched-length impedance-controlled routing for LVDS pairs; designers must follow Altera's AN75 pin connection guidelines for unused I/O, JTAG chain, and configuration mode pin strapping.
This page synthesizes distributor inventory, parametric specifications, drop-in same-package alternatives, and practical design notes not found in the original manufacturer datasheet, enabling engineers to evaluate the EP1S20F484C7N for both new and legacy designs.
直接替換替代品，適用於 EP1S20F484C7N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1S20F484C7N （相同外形與佔位） — 差異在於 Package, Operating Temperature, Speed Grade, Configuration Modes, Family.
EP1S20F484C7
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP1S20F484C6N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP1S20F484C5N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP1S20F484C7N 最大額定值與電氣特性
| Family | Stratix |
| Logic Elements | 18,460 |
| Logic Array Blocks (LABs) | 1,846 |
| Configurable Logic Blocks (CLBs) | 2,132 |
| Embedded Memory (M4K blocks + RAM) | 1,669,248 bits |
| User I/O Pins | 361 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Maximum Internal Clock Frequency | 420.17 MHz |
| 封裝 | 484-FBGA (FC-BGA, 23x23 mm, 1.0 mm pitch) |
| 安裝類型 | Surface Mount |
| 工作溫度 | 0 °C to 85 °C (commercial) |
| Speed Grade | C7 |
| Lead-Free / RoHS | Yes (N suffix indicates lead-free) |
| Configuration Modes | PS, PPA, PPS, JTAG |
| Embedded Multipliers (DSP blocks) | Yes (18x18 multipliers) |
EP1S20F484C7N 484-fbga (fc-bga, 23x23 mm, 1.0 mm pitch) 腳位配置指南
EP1S20F484C7N（484-fbga (fc-bga, 23x23 mm, 1.0 mm pitch) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1S20F484C7N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1S20F484C7N 適用於 6 應用s: Telecom Line Card / Protocol Bridging, Video and Image Processing Pipeline, DSP Co-Processor / FIR Filter Acceleration, ASIC Prototyping and Emulation, Test and Measurement Instrumentation, Industrial Control and Automation Backplane.
Telecom Line Card / Protocol Bridging
The EP1S20F484C7N's 18,460 logic elements and 1,669,248 bits of embedded memory, combined with up to 361 user I/Os in a 484-FBGA package, suit it to telecom line-card designs where high-density glue logic, packet header processing, and TDM/Ethernet protocol bridging are required. Embedded 18x18 multipliers accelerate Reed-Solomon / CRC engine operations, while the rich TriMatrix memory supports deep FIFO buffering for ingress traffic. The commercial 0-85 °C temperature grade satisfies typical central-office thermal envelopes. Compared with an ASIC, the Stratix FPGA allows rapid revision when a new framing or FEC protocol emerges. Designers should reserve sufficient LVDS pairs for high-speed serial links and follow the Stratix Device Handbook AN75 pin-connection guidelines for unused I/O.
推薦
Video and Image Processing Pipeline
The EP1S20F484C7N supports real-time video processing such as scaling, de-interlacing, and colour-space conversion in standard-definition and early high-definition broadcast equipment. Its 1,669,248 bits of embedded memory buffer line-rate video streams without external SRAM, and the 361 user I/Os accept parallel BT.656/BT.1120 video buses while also providing timing-control signals. The 130 nm process delivers sufficient performance for SDR video at 148.5 MHz pixel clock and supports basic progressive HD pipelines. The 484-FBGA package exposes enough I/O for 24-bit RGB plus timing and ancillary data lines. Engineers should constrain and time-budget the pipeline using Quartus II TimeQuest to confirm fMAX headroom.
推薦
DSP Co-Processor / FIR Filter Acceleration
Engineers use the EP1S20F484C7N as a DSP co-processor for multi-channel FIR filtering, FFT pre-processing, and adaptive beamforming in radar, sonar, and instrumentation front-ends. The device's embedded 18x18 hardware multipliers and M4K memory blocks sustain hundreds of MMACs (million multiply-accumulate operations per second) at the C7 speed grade's fMAX. With 1,669,248 bits of on-chip memory the part holds substantial coefficient and sample windows, reducing off-chip memory pressure. The 484-FBGA package gives the LVDS I/O density needed for multi-channel ADC/DAC interfacing. Designers should pipeline DSP blocks to their maximum depth and use Quartus II's DSP megafunctions for fastest result.
推薦
ASIC Prototyping and Emulation
ASIC prototyping teams frequently place the EP1S20F484C7N on FPGA-based prototype boards to validate ASIC RTL before tape-out. Its 18,460 logic elements, large embedded memory, and 361 I/Os in a 484-FBGA footprint provide enough capacity to host medium-complexity ASIC blocks at real-time clock frequencies, while the 130 nm process preserves timing characteristics close to the target ASIC node. The C7 speed grade reduces prototyping margins that would otherwise be needed for slower FPGA fabrics. Multi-FPGA partitioning tools support the EP1S20F484C7N alongside its siblings for full-chip emulation. Designers should map ASIC clock trees explicitly and budget cross-FPGA interconnect delays.
推薦
Test and Measurement Instrumentation
The EP1S20F484C7N is a flexible logic core inside test and measurement instruments, including logic analyzers, protocol analyzers, and arbitrary waveform generators. Its 361 user I/Os support multi-channel acquisition with 200+ MHz state-mode sampling, while the 1,669,248 bits of embedded memory provide deep capture buffers on-chip. The C7 speed grade enables pattern generation up to 420 MHz. Designers can implement custom trigger sequencers, pattern matching, and timing engines entirely in fabric without external glue logic. The 484-FBGA package footprint (23x23 mm, 1.0 mm pitch) suits compact instrument mainboards, and the commercial temperature range satisfies typical lab environments.
推薦
Industrial Control and Automation Backplane
Factory-automation backplanes use the EP1S20F484C7N to host custom control algorithms, real-time Ethernet protocol stacks (PROFINET, EtherCAT), and motion-control glue logic. The device's 18,460 logic elements fit multi-axis motion controllers, while its 361 I/Os connect directly to encoder counters, PWM outputs, and digital I/O banks at LVTTL/LVCMOS levels. Embedded memory supports deterministic buffering of position-feedback data, and dedicated 18x18 multipliers accelerate PID loop math. The commercial 0-85 °C operating range suits control-cabinet thermal environments when paired with adequate airflow. Designers should isolate motor-drive signals from logic I/O and use Altera's LVDS signalling for noise-immune encoder feedback.
推薦
推薦產品摘要
工程參考資料，適用於 EP1S20F484C7N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1S20F484C7 | EP1S20F484C6N | EP1S20F484C5N |
|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera |
| Package | 484-FBGA (23x23 mm, 1.0 mm pitch) | 484-FBGA (23x23 mm, 1.0 mm pitch) - same | 484-FBGA (23x23 mm, 1.0 mm pitch) - same | 484-FBGA (23x23 mm, 1.0 mm pitch) - same |
| Speed Grade | C7 (fastest commercial) | C7 (same as target) | C6 (one step slower) | C5 (slowest commercial) |
| Logic Elements | 18,460 | 18,460 | 18,460 | 18,460 |
| Embedded Memory | 1,669,248 bits | 1,669,248 bits | 1,669,248 bits | 1,669,248 bits |
| User I/O Pins | 361 | 361 | 361 | 361 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 °C to 85 °C (commercial) | 0 °C to 85 °C (commercial) | 0 °C to 85 °C (commercial) | 0 °C to 85 °C (commercial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Fastest commercial speed grade (C7) for the EP1S20F484 package (對比EP1S20F484C6N)
- Lead-free RoHS-compliant packaging (N suffix) (對比Non-N (leaded) variants of the same die)
- Highest achievable internal clock frequency in the Stratix EP1S20 family (對比EP1S20F484C5N (slowest speed grade))
設計說明
Estimated: the 484-FBGA package has a 23x23 mm body with 1.0 mm pitch. Use a 4-6 layer PCB stack-up with matched-length impedance-controlled routing for LVDS pairs. Place all decoupling capacitors as close as possible to the FPGA power pins - use 0.1 µF MLCC per VCCIO pin plus bulk tantalum or polymer capacitors (10-100 µF) per power plane. A solid uninterrupted GND plane beneath the BGA is critical for return-current paths and thermal dissipation. Follow Altera's AN75 pin-connection guidelines for unused I/O and JTAG pin strapping.
Estimated: at typical 1.5 V core operation with ~70% logic utilization and 50% toggle rate, expect 2-5 W dissipation. The 484-FBGA relies primarily on thermal balls (the BGA's full bottom grid acts as both electrical ground and thermal path); a thermal via array stitched into the PCB inner planes is mandatory. Without proper thermal vias, junction temperature can exceed 85 °C ambient limits. Reference the Stratix Device Family Data Sheet for junction-to-ambient thermal resistance and design airflow accordingly.
For LVDS signalling, route differential pairs with 100 Ω differential impedance and matched length within 50 mils (1.27 mm) to avoid skew. Use 3-W spacing between adjacent differential pairs to minimize crosstalk. Place series-damping resistors near the FPGA LVDS driver pin when driving long board traces (>5 inches). For DDR-style source-synchronous interfaces (parallel data plus clock), keep the clock-to-data skew within ±50 ps across PVT corners - leverage Quartus II TimeQuest to constrain these paths.
Do not leave the MSEL (configuration mode) pins floating - strap them to VCC or GND through 1 kΩ pull-up/pull-down to select the desired configuration mode (PS, PPA, PPS, JTAG). Failing to terminate unused LVDS pairs correctly can cause high-current draw on the I/O bank. Never apply 3.3 V signals to VCCIO = 1.5 V banks, even momentarily during hot-plug events, as this will damage the I/O cells. Verify configuration mode is correct before releasing reset to avoid the device entering an undefined state.
Estimated: design the 1.5 V core supply with a tolerance of ±5% (1.425-1.575 V). For VCCIO banks, each bank supports 1.5 V, 1.8 V, 2.5 V, or 3.3 V - separate regulator outputs are typically required if mixed voltages are needed. Power sequencing requires the 2.5 V PLL analogue supply to ramp before the 1.5 V core, otherwise the PLL may lock incorrectly. Add soft-start control to all supply rails to limit inrush current. Use a 4-layer PCB with separate GND, VCCINT, VCCIO, and VCC_PLL planes for clean power distribution.
合規資訊
RoHS compliance indicated by N suffix in MPN (lead-free). REACH, halogen-free, and conflict-mineral declarations were not present in the verified web data and are marked unknown. AEC-Q100 is not applicable for FPGAs - this is a programmable logic device, not an automotive-qualified IC. Compliance details should be verified against the original manufacturer declaration before use in regulated end products.
