EP1SGX40DF1020I6N - Stratix GX FPGA, 41.25K LEs, 1020-FBGA | Intel
MPN： EP1SGX40DF1020I6N ✓ 啟用中EP1SGX40DF1020I6N 概覽
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose digital logic fabric, interconnect, I/O cells, and embedded memory/blocks can be reconfigured by the end user after manufacture. FPGAs sit hierarchically between ASICs (Application-Specific Integrated Circuits) and general-purpose processors: they offer ASIC-class parallelism and deterministic latency while retaining the programmability of software-defined hardware. The Stratix GX family specifically adds hardened multi-gigabit transceivers, making it a sub-class often referred to as an FPGA with SerDes or a communications-grade FPGA, distinguishing it from lower-cost Cyclone families and from non-transceiver Stratix variants.
Key features of the EP1SGX40DF1020I6N include 624 maximum user I/O pins, 4,125 LABs (Logic Array Blocks), 3,423,744 embedded RAM bits, embedded DSP blocks for fixed- and floating-point arithmetic, and 1.5V core supply operation. The 'GX' designation indicates integrated high-speed serial transceivers supporting protocols such as PCI Express, Serial RapidIO, XAUI, and Gigabit Ethernet, freeing the user from building serializer/deserializer (SerDes) logic in soft fabric. The 1020-ball FBGA package exposes all transceivers, I/O, configuration, and clock signals while providing excellent signal-integrity characteristics for multi-gigabit signalling.
Typical applications include telecommunications line cards, military/aerospace signal processing, ASIC prototyping, high-speed data-acquisition front-ends, and embedded digital-signal-processing systems. Industrial-grade temperature screening and legacy process maturity make it a long-life-cycle component for OEM programs that must run for 10-15 years.
When designing with this device, ensure your power architecture can supply the 1.5V core rail with sufficient decoupling, and validate pin-out against the 1020-BGA land pattern before PCB fabrication. Configuration is handled via the dedicated configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL) - consult the Stratix GX device family datasheet for the supported configuration schemes (Passive Serial, Fast Passive Parallel, JTAG, etc.).
直接替換替代品，適用於 EP1SGX40DF1020I6N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1SGX40DF1020I6N （相同外形與佔位） — 差異在於 Operating Temperature, Process Technology, Package, Speed Grade, Family.
EP1SGX40DF1020C6N
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查看資料表 →EP1SGX40DF1020I6
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查看資料表 →EP1SGX40DF1020I7N
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查看資料表 →EP1SGX40CF1020I5
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查看資料表 →EP1SGX40DF1020I6N 最大額定值與電氣特性
| Series | Stratix GX |
| Family | Stratix (First Generation) |
| Manufacturer | Intel (formerly Altera) |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) |
| Number of Logic Elements (LEs) | 41,250 |
| Number of LABs (Logic Array Blocks) | 4,125 |
| Total RAM Bits | 3,423,744 |
| Maximum User I/O Pins | 624 |
| 封裝 / 外殼 | 1020-BBGA / 1020-FBGA |
| Package Size | 33 x 33 mm, 1.0 mm pitch |
| Supplier Device Package | 1020-FBGA (33 x 33) |
| 工作溫度 | 0 C to 85 C (industrial grade 'I') |
| Speed Grade | 6 (I6) |
| 安裝類型 | Surface Mount (BGA) |
| Logic Family | CMOS (SRAM-based configuration) |
| Packaging | Tray / Bulk |
| Configuration Mode | Passive Serial / Fast Passive Parallel / JTAG (per Stratix GX handbook) |
EP1SGX40DF1020I6N 1020-fbga (33 x 33) 腳位配置指南
EP1SGX40DF1020I6N（1020-fbga (33 x 33) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1SGX40DF1020I6N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1SGX40DF1020I6N 適用於 6 應用s: Telecommunications Line Cards, ASIC Prototyping, Military and Aerospace Signal Processing, High-Speed Data Acquisition Front-Ends, Embedded DSP and Software-Defined Radio, Industrial Networking and Protocol Bridging.
Telecommunications Line Cards
The EP1SGX40DF1020I6N suits telecommunications line-card designs because its integrated multi-gigabit SerDes directly supports protocols such as PCI Express, Serial RapidIO, XAUI, and Gigabit Ethernet without consuming soft logic resources. Its 41,250 logic elements and 3,423,744 RAM bits are sufficient to implement packet-processing engines, traffic managers, and serializer/deserializer framer logic. The industrial 0C-85C temperature screening allows deployment in central-office equipment that must operate 24/7 over 10-15 year life cycles. Designers can rely on the Stratix GX handbook reference designs for backplane interconnects.
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ASIC Prototyping
The EP1SGX40DF1020I6N is well established as an ASIC prototyping vehicle. Its 41,250 logic elements and 3.4 Mbit of embedded RAM reproduce the bulk of mid-density ASIC RTL within a single device, while the hardened DSP blocks accelerate arithmetic-intensive pre-silicon verification. Designers partition larger ASICs across multiple FPGAs using chip-to-chip SerDes channels for high-bandwidth pin-multiplexing. Quartus II software (and Pro/Standard for newer devices) provides timing-driven place-and-route and synthesis support. The 1020-FBGA exposes sufficient I/O (up to 624 user I/O) for prototype-to-ASIC pin mapping.
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Military and Aerospace Signal Processing
The EP1SGX40DF1020I6N's industrial-grade temperature screening (0C-85C) and long-life-cycle availability make it applicable to military and aerospace signal-processing platforms such as radar front-ends, electronic-warfare subsystems, and SIGINT receivers. The integrated SerDes channels carry digitized RF samples to downstream processors, while the embedded DSP blocks perform FFT, digital down-conversion, and pulse-Doppler processing. Programs that already standardized on first-generation Stratix GX can maintain supply chains through Rochester Electronics and authorized brokers. For full MIL-PRF screening, the equivalent military part number should be ordered through the appropriate MIL-supply channel.
推薦
High-Speed Data Acquisition Front-Ends
In data-acquisition front-ends, the EP1SGX40DF1020I6N's hardened SerDes channels accept digitized samples from high-speed ADCs and route them into on-chip RAM buffers or out through parallel LVDS links. The 3.4 Mbit of embedded RAM supports multi-channel DMA buffering at hundreds of MSPS sample rates. Designers can build digital down-conversion, channelization, and trigger logic in the 41,250-LE fabric. The industrial temperature grade supports laboratory and field-deployable instrumentation. Quartus II MegaWizard Plug-In Manager provides turnkey IP for common ADC interface protocols (LVDS, DDR, JESD204 equivalents).
推薦
Embedded DSP and Software-Defined Radio
The EP1SGX40DF1020I6N supports embedded DSP and software-defined radio (SDR) workloads through its hardened DSP blocks (multipliers, adders, accumulators) and 3.4 Mbit of memory. SDR applications such as digital up-/down-conversion, FFT-based spectral analysis, and baseband modem processing fit comfortably within 41,250 logic elements. The integrated multi-gigabit transceivers backhaul digital samples between RF cards and baseband processing modules, removing the need for external SerDes ICs. This combination of DSP density, memory, and SerDes was a hallmark of the Stratix GX generation and remains valuable for long-life SDR programs.
推薦
Industrial Networking and Protocol Bridging
Industrial networking platforms benefit from the EP1SGX40DF1020I6N's mix of multi-gigabit SerDes and substantial general-purpose logic. Designers can build fieldbus-to-Ethernet bridges, real-time Ethernet switches (EtherCAT, PROFINET, EtherNet/IP) and legacy protocol converters inside a single device. The 0C-85C industrial temperature grade is critical for factory-floor equipment where ambient temperatures fluctuate and shock/vibration are common. The 1020-FBGA's high pin count also allows direct connection to DDR SDRAM memories for packet buffering. Reference designs in the Stratix GX handbook illustrate representative industrial-bridging topologies.
推薦
推薦產品摘要
工程參考資料，適用於 EP1SGX40DF1020I6N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1SGX40DF1020C6N | EP1SGX40DF1020I5N | EP1SGX40DF1020I6 | EP1SGX40DF1020I7N | EP1SGX40CF1020I5 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1020-FBGA (33 x 33 mm, 1.0 mm pitch) | 1020-FBGA (33 x 33) - same | 1020-FBGA (33 x 33) - same | 1020-FBGA (33 x 33) - same | 1020-FBGA (33 x 33) - same | 1020-FBGA (33 x 33) - same |
| Logic Elements | 41,250 | 41,250 (same die) | 41,250 (same die) | 41,250 (same die) | 41,250 (same die) | 41,250 (same die) |
| Temperature Grade | Industrial 0C-85C | Commercial 0C-70C | Industrial 0C-85C | Industrial 0C-85C | Industrial 0C-85C | Industrial 0C-85C |
| Speed Grade | 6 | 6 | 5 (slower) | 6 | 7 (faster) | 5 |
| High-Speed Transceivers | Yes (Stratix GX) | Yes (Stratix GX) | Yes (Stratix GX) | Yes (Stratix GX) | Yes (Stratix GX) | Yes (Stratix GX) |
| Maximum User I/O | 624 | 624 | 624 | 624 | 624 | 624 |
| Embedded RAM Bits | 3,423,744 | 3,423,744 (same die) | 3,423,744 (same die) | 3,423,744 (same die) | 3,423,744 (same die) | 3,423,744 (same die) |
| Core Supply Voltage | 1.425 V - 1.575 V (1.5 V nominal) | 1.425 V - 1.575 V | 1.425 V - 1.575 V | 1.425 V - 1.575 V | 1.425 V - 1.575 V | 1.425 V - 1.575 V |
主要差異化特點
- Largest logic capacity in the first-generation Stratix GX family at this speed/temperature grade (對比EP1SGX25DF1020I6N)
- Industrial temperature grade 0C-85C for factory and telecom deployments (對比EP1SGX40DF1020C6N)
- Speed grade 6 - mid-position in the Stratix GX speed grade range (對比EP1SGX40DF1020I5N)
設計說明
Estimated power analysis: a fully populated EP1SGX40 at 100% utilization across logic, 3.4 Mbit RAM, DSP blocks, and all SerDes channels can exceed 10 W core dissipation. Use a 4-layer (or more) PCB with a continuous power plane on inner layers, and follow Intel/Altera's Stratix GX power-decoupling recommendation of approximately 20 low-ESR ceramic bypass capacitors per side of the device plus bulk polymer/tantalum capacitors at the voltage regulator outputs. A multi-phase switching controller is recommended for the 1.5 V core rail at high utilization.
The 1020-FBGA at 1.0 mm pitch requires PCB fabrication with microvia (laser-drilled) stack-up - typical 4-6 mil laser vias on 6-8 layer stack-ups. Escape routing in the inner layers should follow either dog-bone or via-in-pad patterns. After PCB assembly, BGA solder joints must be inspected via X-ray or endoscopic optical inspection because the 1020 balls are not visible from the package sides. Plan thermal relief copper pours under the BGA per the package land-pattern recommendation.
For the integrated multi-gigabit SerDes, route the high-speed transceiver channels with controlled-impedance differential pairs (typically 100 ohm differential), keep total length below the Stratix GX handbook maximum for the chosen data rate, and use matched-length tuning within each channel. Avoid routing SerDes lanes across split power planes; use solid reference planes. AC-coupling capacitors (typically 0.01-0.1 uF) are required at the transmitter side per the Stratix GX handbook.
Common pitfalls include: (1) forgetting to set the MSEL configuration-mode pins to match the chosen configuration scheme (Passive Serial, Fast Passive Parallel, JTAG); (2) failing to assert nCONFIG during power-up until the 1.5 V core rail is stable; (3) using commercial-temperature FPGAs in industrial environments; (4) ignoring JTAG pin pull-up/-down requirements during board bring-up. (5) note that 'I6' = industrial + speed grade 6 - if you see 'C6' or 'I5' in the part number, the temperature or speed grade is different even though the package matches.
合規資訊
Stratix GX family pre-dates universal RoHS adoption; RoHS status for first-generation Stratix GX should be confirmed with the authorized distributor (Rochester Electronics / Intel FPGA product longevity program).
