EP1SGX40DF1020I7N - 41,250 Logic Cells Stratix GX FPGA | Intel
MPN： EP1SGX40DF1020I7N ✗ 停產EP1SGX40DF1020I7N 概覽
What is a Stratix GX FPGA? The Stratix GX is an FPGA product family from Altera (now Intel) that augments a general-purpose logic fabric with hard multi-gigabit transceivers and rich embedded memory. In the taxonomy of programmable logic devices, FPGAs sit alongside CPLDs as the dominant class of user-configurable silicon; within FPGAs, Stratix GX belongs to the high-end transceiver-equipped tier that preceded the Stratix II/III/IV/V generations. Compared with non-transceiver FPGAs, GX devices eliminate external PHY chips, reduce board area, and simplify timing closure for serial protocols such as PCI Express, Serial RapidIO, XAUI, and custom backplanes.
Key features include 41,250 logic cells organized as 4,125 CLBs, embedded transceiver channels capable of multi-gigabit operation, a maximum operating frequency of 4385.97 MHz per the manufacturer characterization, and configurable I/O standards supporting LVDS, LVTTL, LVCMOS, and HSTL. The device incorporates dedicated on-chip memory blocks and DSP blocks for high-throughput signal processing, plus configuration circuitry that supports both JTAG and serial/parallel configuration modes. The 1020-ball FC-FBGA package provides high-density interconnect suitable for I/O-rich designs.
The architecture combines a programmable logic fabric with hard IP blocks: transceiver macro cells, TriMatrix embedded memory, and DSP blocks. By absorbing PHY functionality into silicon, the EP1SGX40 reduces latency, jitter, and power relative to FPGA-plus-external-PHY implementations. Designers targeting this part typically leverage the Altera (Intel) Quartus II design suite for synthesis, place-and-route, and timing closure.
Typical applications include communications infrastructure such as SONET/SDH line cards and backplane aggregation, serial-protocol bridging (PCI Express, Serial RapidIO, XAUI, Fibre Channel), test and measurement instrumentation with embedded signal processing, high-performance DSP front ends, and legacy networking line cards transitioning from discrete PHYs to integrated transceivers.
When designing with this device, ensure that the PCB BGA breakout accommodates 1 mm pitch balls, provide clean multi-phase power for the 1.5 V core with adequate decoupling, and verify thermal headroom against the application's continuous operating duty cycle. Designers should also validate configuration mode (JTAG, passive serial, fast passive parallel) against the production programming flow.
This page synthesizes distributor pricing, drop-in equivalents within the Stratix GX family, and practical design notes not consolidated in the manufacturer datasheet, enabling faster selection and risk assessment for engineers evaluating transceiver-equipped FPGAs.
直接替換替代品，適用於 EP1SGX40DF1020I7N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1SGX40DF1020I7N （相同外形與佔位） — 差異在於 Operating Temperature, Package, RoHS Status, Speed Grade, Family.
EP1SGX40DF1020I7
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX40DF1020I6N
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX40DF1020I5N
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX40DF1020C7N
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX40DF1020C7ES
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX40DF1020C6N
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX40DF1020C5N
✅ 直接替換聯絡詢價
查看資料表 →EP1S40F1020I6N
✅ 直接替換聯絡詢價
查看資料表 →EP1SGX40DF1020I7N 最大額定值與電氣特性
| Family | Stratix GX |
| Device Model | EP1SGX40 |
| Logic Cells | 41,250 |
| Configurable Logic Blocks (CLBs) | 4,125 |
| Logic Family | CMOS |
| Process Technology | 130 nm |
| Nominal Supply Voltage | 1.5 V |
| Supply Voltage Range | 1.425 V to 1.575 V |
| 工作溫度 | 0 C to 85 C (commercial) |
| Package Type | FC-FBGA, 33 x 33 mm, 1 mm pitch |
| Number of Pins / Balls | 1020 |
| Package Code | BGA |
| Terminal Form | Ball |
| Package Shape | Square |
| 最大時脈頻率 | 4385.97 MHz |
| Configuration Modes | JTAG, Passive Serial, Fast Passive Parallel |
| 安裝類型 | Surface Mount |
EP1SGX40DF1020I7N square 腳位配置指南
EP1SGX40DF1020I7N（square 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1SGX40DF1020I7N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1SGX40DF1020I7N 適用於 7 應用s: SONET/SDH Line Card Aggregation, PCI Express Endpoint / Bridge, Serial RapidIO Switch / Endpoint, Test & Measurement Instrumentation, XAUI / 10G Backplane Bridging, Legacy DSP Front-End Processing, Industrial Imaging & Video Processing.
SONET/SDH Line Card Aggregation
The EP1SGX40DF1020I7N's hard multi-gigabit transceivers make it a strong fit for SONET/SDH line cards that aggregate multiple OC-48/OC-192 streams into a backplane. With 41,250 logic cells and 4,125 CLBs, the device can host framer/mapper logic, payload processing, and overhead termination without external FPGAs. The 1020-ball FC-FBGA provides ample I/O for parallel backplane interfaces and tributary ports. Designers should plan power sequencing for the 1.5 V core alongside the transceiver analog supplies, and use Quartus II's transceiver toolkit for eye-diagram validation during bring-up.
推薦
PCI Express Endpoint / Bridge
The EP1SGX40DF1020I7N integrates PCIe-capable transceivers and a large programmable fabric, making it suitable for custom PCIe endpoints and protocol bridges. With 41,250 logic cells, designers can implement protocol layers, DMA engines, and user logic alongside the hard PCIe IP. The 1.5 V core and 1020-ball FC-FBGA provide I/O headroom for additional PCIe lanes or sideband signals. Note that newer Stratix II GX devices are preferred for PCIe Gen2+ designs; the EP1SGX40 is recommended only when matching existing qualification artifacts.
推薦
Serial RapidIO Switch / Endpoint
The EP1SGX40DF1020I7N's transceiver channels support Serial RapidIO (sRIO) at 1.25 to 3.125 Gbaud, enabling switch-fabric endpoints and DSP cluster interconnects. The 41,250-cell fabric can host sRIO logical layers, DMA, and message-passing logic; the 1020-ball package supplies I/O for parallel DSP links. For multi-device clusters, designers should budget power at peak packet rates and verify link-training margins across process-voltage-temperature corners using Quartus II timing closure reports.
推薦
Test & Measurement Instrumentation
The EP1SGX40DF1020I7N is well matched to high-channel-count test equipment: digitizer front ends, arbitrary waveform generators, and protocol analyzers. Its 41,250 logic cells support channel-synchronization state machines, trigger logic, and on-chip DSP blocks for real-time decimation/filtering; the transceivers stream aggregated data to a host processor. The 1020-ball FC-FBGA simplifies layout for dense multi-channel analog front-end boards. Designers should leverage the TriMatrix memory blocks for capture buffers and verify JTAG chain integrity for production test.
推薦
XAUI / 10G Backplane Bridging
The EP1SGX40DF1020I7N's 3.125 Gbaud-capable transceivers are well suited to XAUI (10 Gigabit Attachment Unit Interface) bridging between line cards and switch fabrics. With 41,250 logic cells the device can implement XAUI PCS, MAC, and bridging tables. The 1020-ball FC-FBGA package supplies ample I/O for sideband signals, MDIO, and status LEDs. Designers targeting this use case should follow Altera's XAUI reference design and validate eye-mask compliance on actual backplane traces.
推薦
Legacy DSP Front-End Processing
The EP1SGX40DF1020I7N's DSP blocks and embedded memory support high-throughput DSP front ends in radar, software-defined radio, and baseband processing. With 41,250 logic cells and dedicated multipliers, designers can implement FFTs, channelizers, and pulse-compression filters. The transceivers stream digitized RF data into the FPGA from high-speed ADCs. Designers should map DSP utilization against the device's multiplier budget and leverage the Quartus II DSP Builder for rapid IP integration, while planning for migration to newer Stratix generations in future revisions.
推薦
Industrial Imaging & Video Processing
The EP1SGX40DF1020I7N supports multi-channel industrial imaging pipelines - Camera Link aggregation, frame buffering, and real-time image preprocessing - by combining its 41,250 logic cells with embedded TriMatrix memory and transceivers for high-speed sensor links. The 1020-ball FC-FBGA package exposes enough pins for parallel sensor interfaces and HDMI/DVI output. Designers should validate frame-buffer bandwidth against the memory controller's clock rate and apply thermal management for continuous full-frame-rate operation.
推薦
推薦產品摘要
工程參考資料，適用於 EP1SGX40DF1020I7N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1SGX40DF1020I7 | EP1SGX40DF1020I6N | EP1SGX40DF1020C7N | EP1SGX40DF1020C5N | EP1S40F1020I6N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1020-ball FC-FBGA, 33x33 mm, 1 mm pitch | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Logic Cells | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 (Stratix S-series, no transceivers) |
| Speed Grade | -7 (fastest) | -7 | -6 (~15-20% slower than -7) | -7 | -5 (~25-30% slower than -7) | -6, Stratix S-series |
| Temperature Grade | Industrial (I) 0-85 C | Industrial | Industrial | Commercial (C) 0-85 C | Commercial (C) 0-85 C | Industrial |
| Hard Transceivers | Yes (Stratix GX family) | Yes | Yes | Yes | Yes | No (Stratix S-series, soft IP only) |
| Process Technology | 130 nm CMOS | 130 nm | 130 nm | 130 nm | 130 nm | 130 nm |
| Supply Voltage | 1.5 V nominal (1.425-1.575 V) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Obsolete (2026) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Highest -7 speed-grade within the EP1SGX40 family (對比EP1SGX40DF1020I5N)
- Industrial temperature grade option for harsh environments (對比EP1SGX40DF1020C7N)
- Hard multi-gigabit transceivers integrated (對比EP1S40F1020I6N)
設計說明
Estimated: at 1.5 V core, with the FPGA drawing approximately 3 A during typical operation (about 4.5 W), the 1020-ball FC-FBGA package requires a thermal management strategy of either a 4-layer PCB with continuous ground/power planes or an attached heatsink with thermal interface material. Designers should validate junction temperature under worst-case utilization with the Quartus II PowerPlay analyzer and apply adequate airflow to keep Tj below 100 C in the 0-85 C ambient range.
The 1.00 mm ball pitch FC-FBGA demands a PCB stack-up with microvia or via-in-pad technology for reliable breakout. Use a 4-6 layer board with continuous power/ground planes directly under the BGA to provide decoupling and a low-impedance return path. Per Altera application notes, place 0.1 uF and 0.01 uF decoupling capacitors on each power pin within 100 mils, and use the Stratix GX handbook's recommended footprint for solder paste and stencil apertures.
Do not assume configuration mode without verifying - EP1SGX40 supports JTAG, Passive Serial (PS), and Fast Passive Parallel (FPP), and the wrong mode can brick the device on power-up. Per the Stratix GX configuration handbook, designers should also validate MSEL pin strapping and provide a clean POR sequence before asserting CONFIG_DONE. For production programming, JTAG-based tools (USB-Blaster or compatible) are recommended for board-level bring-up.
Estimated: the high-speed transceiver channels require impedance-controlled routing of 50-ohm differential pairs (100-ohm differential), with length matching to within 5 mils for lanes within a group. Per Altera's Stratix GX transceiver design guidelines, isolate transceiver analog supplies from digital switching noise with ferrite beads and dedicated ground planes, and minimize via stubs on high-speed serial traces to preserve signal integrity at multi-gigabit rates.
合規資訊
Compliance data for the legacy Stratix GX EP1SGX40 family is not in the verified source data. AEC-Q100 is not applicable - this is a programmable logic device, not an automotive-grade analog IC. Refer to Intel/Altera product documentation for definitive compliance certifications on specific date codes.
