EP20K100QC240-3V - APEX 20KE FPGA 100K Gates 189 I/O 240-BFQFP | Intel
MPN： EP20K100QC240-3V ✗ 停產EP20K100QC240-3V 概覽
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor IC containing configurable logic blocks, interconnect, and I/O cells that engineers can program after manufacturing to implement custom digital circuits. FPGAs sit within the programmable logic hierarchy above CPLDs and below ASICs, offering higher density than CPLDs and lower NRE cost than ASICs. The APEX 20KE family specifically targets SOPC (System-On-a-Programmable-Chip) integration, combining LUT logic, product-term logic, and embedded memory blocks in one fabric.
Key features of the EP20K100QC240-3V include a -3 speed grade, 0.22 µm process technology, maximum operating frequency of 167 MHz, in-system programmability via IEEE 1149.1 JTAG, and support for multiple I/O standards including LVTTL, LVCMOS, and LVDS. The MultiCore architecture lets designers place register-intensive logic in LUTs and combinatorial glue logic in product-term blocks, optimizing silicon efficiency for mixed datapath/control designs.
Typical applications include telecommunications line cards, high-speed datapath processing, DSP co-processing, glue-logic integration, and PCI bus interface bridging. The 53,248 bits of embedded memory can be configured as RAM, ROM, or FIFO, enabling single-chip implementation of state machines with on-chip buffering.
When designing with this part, note that the -3V suffix indicates the device is lead-free and RoHS-compliant, while -3 alone denotes the standard lead-bearing variant. Both share the same 240-BFQFP footprint (32x32 mm) and identical die, so PCB layouts can accommodate either part. Designers should use the Quartus II design software (legacy) for synthesis, place-and-route, and timing closure.
直接替換替代品，適用於 EP20K100QC240-3V — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP20K100QC240-3V （相同外形與佔位） — 差異在於 Operating Temperature, Package, Speed Grade, Total RAM Bits, Maximum Internal Frequency.
EP20K100QC240-3N
✅ 直接替換聯絡詢價
查看資料表 →EP20K100QC240-3
✅ 直接替換聯絡詢價
查看資料表 →EP20K100QC240-2
✅ 直接替換聯絡詢價
查看資料表 →EP20K100QC240-1
✅ 直接替換聯絡詢價
查看資料表 →EP20K100QC240-1XV
✅ 直接替換聯絡詢價
查看資料表 →EP20K100QC240-3V 最大額定值與電氣特性
| Series | APEX-20KE |
| Family | APEX-20K |
| Logic Logic Elements / Cells | 4,160 |
| Total System Gates | 100,000 |
| Total RAM Bits | 53,248 |
| Number of User I/O | 189 |
| Number of Logic Blocks | 53248 (LABs) |
| Core Voltage | 2.375 V to 2.625 V |
| 工作溫度 | 0C to +85C (Commercial) |
| Maximum Frequency | 167 MHz |
| Process Technology | 0.22 µm CMOS |
| 安裝類型 | Surface Mount |
| 封裝 | 240-BFQFP (32 x 32 mm) |
| Speed Grade | -3 (fastest APEX 20KE grade) |
| Lead-Free / RoHS | Yes (-3V suffix) |
| In-System Programmability | Yes (IEEE 1149.1 JTAG) |
EP20K100QC240-3V 240-bfqfp (32 x 32 mm) 腳位配置指南
EP20K100QC240-3V（240-bfqfp (32 x 32 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP20K100QC240-3V.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP20K100QC240-3V 適用於 6 應用s: Telecommunications Line Cards, DSP Co-Processing and Acceleration, PCI Bus Interface Bridging, Glue-Logic Integration and Chip-Set Replacement, Industrial Control and Automation, Legacy Telecom and Datacom Backplane Bridging.
Telecommunications Line Cards
The EP20K100QC240-3V fits telecom line-card designs through its combination of 100K system gates, 53,248 bits of embedded memory, and 189 user I/O pins enabling multi-protocol bridging. The MultiCore architecture lets designers place high-speed datapath (such as framer/mapper logic) in LUT cells while mapping glue control logic to product-term blocks. Operating at 167 MHz internal frequency, the part can handle T1/E1 aggregation, HDLC controllers, and UART multiplexing within a single device. The 240-BFQFP package provides the thermal headroom and pin density needed for chassis backplane interfaces while supporting LVDS I/O for low-EMI serial links.
推薦
DSP Co-Processing and Acceleration
With 4,160 logic elements and 167 MHz timing closure, the EP20K100QC240-3V serves as a co-processor that offloads DSP routines from a host DSP or microcontroller. The MultiCore architecture supports parallel multiplier/accumulator structures and FFT butterflies, while the 53 kbits of embedded RAM acts as a circular buffer for sample data. Designers can implement custom FIR filters, FFT engines, and video-processing kernels. The 240-BFQFP package exposes enough user I/O (189 pins) to stream parallel data buses between the host processor and the FPGA without multiplexing penalties.
推薦
PCI Bus Interface Bridging
The EP20K100QC240-3V's 100K gate capacity and 189 user I/O pins make it well-suited as a PCI-to-local-bus bridge, a common use case for APEX 20KE devices in industrial PCs and embedded motherboards. The 167 MHz performance supports 33 MHz PCI at full throughput, while the JTAG boundary-scan capability simplifies board-level test. Embedded memory blocks handle PCI transaction FIFOs without external SRAM, reducing BOM cost. Designers can route 32-bit PCI plus local bus plus interrupt and arbitration signals within the 189 available user I/O pins.
推薦
Glue-Logic Integration and Chip-Set Replacement
Designers frequently choose the EP20K100QC240-3V to consolidate discrete 74-series glue logic, FIFOs, and address-decoder PLDs into a single programmable device. The MultiCore architecture's product-term logic is well-suited to decoder, mux, and state-machine functions, while LUT logic handles wider datapaths. Replacing 5-15 discrete logic chips with one APEX 20KE cuts PCB area, simplifies sourcing, and adds in-system reconfigurability for late-stage design fixes. The 240-BFQFP footprint provides ample I/O for chip-set replacement in legacy industrial and military designs.
推薦
Industrial Control and Automation
Industrial control applications leverage the EP20K100QC240-3V's embedded memory for storing PLC ladder-logic-equivalent state machines and the high I/O count for interfacing to sensor arrays and motor-control peripherals. The 2.5V core and 167 MHz internal clock support deterministic timing for closed-loop control loops, while the LVDS I/O standard enables noise-immune communication with industrial sensors over long cable runs. The 240-BFQFP package is robust for industrial thermal environments and supports both commercial and industrial temperature grades within the family.
推薦
Legacy Telecom and Datacom Backplane Bridging
Backplane bridging designs in legacy telecom and datacom systems frequently use the EP20K100QC240-3V to translate between proprietary backplane protocols, custom serial formats, and standard buses. The 189 user I/O pins are sufficient for 8-bit to 32-bit parallel bus widths plus clock, frame-sync, and interrupt signals. Embedded memory acts as elastic-store FIFO between mismatched clock domains. The JTAG-based in-system programmability allows remote firmware upgrades, valuable for unmanned or hard-to-access sites.
推薦
推薦產品摘要
工程參考資料，適用於 EP20K100QC240-3V — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP20K100QC240-3N | EP20K100QC240-3 | EP20K100QC240-2 | EP20K100QC240-1 | EP20K100QC240-1XV |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 240-BFQFP (32x32 mm) | 240-BFQFP (32x32 mm) - same | 240-BFQFP (32x32 mm) - same | 240-BFQFP (32x32 mm) - same | 240-BFQFP (32x32 mm) - same | 240-BFQFP (32x32 mm) - same |
| Speed Grade | -3 (fastest) | -3 (same) | -3 (same) | -2 (slower) | -1 (slowest) | -1 (slowest, lead-free) |
| Lead-Free / RoHS | Yes | Yes | No (leaded) | No (leaded, default) | No (leaded, default) | Yes (lead-free, XV) |
| Logic Elements | 4,160 | 4,160 | 4,160 | 4,160 | 4,160 | 4,160 |
| Total System Gates | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 |
| Total RAM Bits | 53,248 | 53,248 | 53,248 | 53,248 | 53,248 | 53,248 |
| User I/O Count | 189 | 189 | 189 | 189 | 189 | 189 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Lead-free RoHS construction while sharing identical die with leaded -3 variant (對比EP20K100QC240-3)
- Fastest -3 speed grade in the APEX 20KE 100K family (對比EP20K100QC240-2)
- MultiCore architecture with embedded memory for single-chip implementations (對比EP20K100QC240-1)
設計說明
The 240-BFQFP package uses a 0.5 mm lead pitch and gull-wing leads. PCB layout must use 0.15-0.20 mm wide traces between lands with at least 4 mil spacing for the inner rows; do not route signals through the lead footprint. Place decoupling capacitors (0.1 µF ceramic plus 10 µF tantalum) within 5 mm of every VCCINT/VCCIO pin pair. For the PLL analog supply pins, use a ferrite bead and 10 µF tantalum bypass.
Configure I/O banks for LVDS only when adjacent I/O standards permit. APEX 20KE requires that all I/O in a bank share the same VCCIO reference voltage. For high-speed LVDS outputs (>200 MHz toggle), use controlled-impedance routing (50 ohm differential, 100 ohm differential), keep trace length matching to within 0.5 mm, and use ground-plane reference with via stitching every 10 mm.
Estimated: the APEX 20KE configuration flash memory is one-time-programmable for some device variants. Engineers planning field upgrades must select a serial-configuration scheme or use JTAG-based in-system programmability. When migrating between -3, -2, and -1 speed grades, expect ~25-40% timing closure differences - re-run Quartus II timing analysis after any speed-grade swap. Do not assume -V (lead-free) and non-V variants share identical thermal profiles; the lead-free solder-joint metallurgy has slightly different thermal-fatigue characteristics.
合規資訊
Lead-free / RoHS compliant per -3V suffix designation. AEC-Q100 qualification is not applicable for legacy Altera APEX 20KE FPGAs (automotive applications require newer Cyclone Auto parts). Halogen-free and conflict-minerals compliance not specified in available data.
