EP3C16E144C8N - 16K LE Cyclone III FPGA, 144-LQFP | Intel / Altera
部品番号: EP3C16E144C8N ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $36.02 | $36.02 |
| 10 | $32.41 | $324.10 |
| 100 | $28.81 | $2,881.00 |
| 500 | $25.2 | $12,600.00 |
| 1,000 | $22.49 | $22,490.00 |
EP3C16E144C8N 概要
An FPGA (Field Programmable Gate Array) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by a user-loaded configuration bitstream rather than fixed at the fab. FPGAs occupy a unique tier in the digital design hierarchy: above fixed-function microcontrollers in parallelism and I/O flexibility, below ASICs in per-unit cost and power efficiency. Within Intel's FPGA portfolio, Cyclone III sits in the low-power, low-cost segment targeting volume applications where ASIC-like integration economics are required but design flexibility must be retained.
Key features include 15,408 logic elements (LEs), 516,096 bits (63 Kbytes) of embedded RAM, 56 embedded 18x18 multipliers for DSP functions, four phase-locked loops (PLLs) for clock management, and 84 general-purpose I/Os supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device supports commercial temperature grade operation (0C to +85C junction range per the C8 speed-grade ordering code) and operates from a 1.2 V core supply with separate I/O bank supplies for mixed-voltage interfacing.
Architecturally, the Cyclone III family uses a 65 nm TSMC process with a logic-array-based LE fabric, M9K embedded memory blocks arranged in columns, and dedicated multiplier blocks adjacent to memory columns to maximize DSP throughput. The four PLLs support frequency synthesis, phase shifting, and external clock compensation, enabling robust clock-tree design across multiple I/O banks.
Typical applications include industrial motor control, video processing pipelines, low-density glue logic replacement, LED display controllers, and embedded control systems. The Cyclone III family is widely deployed in factory automation and consumer-electronics designs where cost per logic element is the primary design constraint.
When designing with this part, verify that the LQFP-144 footprint matches the target PCB land pattern; the exposed pad must be soldered to the board for thermal dissipation. Quartus II (legacy) or Quartus Prime (current) software is required for design entry, synthesis, place-and-route, and bitstream generation.
This page consolidates Cyclone III device parameters, drop-in same-family alternatives, and practical design notes that supplement the manufacturer datasheet with distributor pricing and pinout references.
ドロップイン代替品: EP3C16E144C8N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP3C16E144C8N （同一形状・フットプリント） — 相違点: Speed Grade, Embedded 18x18 Multipliers, Operating Temperature, Process Technology, Total Memory Bits.
クイック比較ツール — 並列比較する代替部品を選択:
EP3C16E144C7N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP3C16E144I7N
✅ ドロップイン✓ 在庫あり
$34.95 / 個
データシートを見る →EP3C16E144A7N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP3C25E144C8N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP3C10E144C8N
✅ ドロップイン✓ 在庫あり
$15.2 / 個
データシートを見る →EP3C16E144C8N 最大定格＆電気的特性
| Family | Cyclone III |
| Logic Elements (LEs) | 15,408 |
| Total Memory Bits | 516,096 bits (63 Kbytes) |
| Embedded Memory Blocks | M9K |
| Embedded 18x18 Multipliers | 56 |
| User I/O Pins | 84 |
| Phase-Locked Loops (PLLs) | 4 |
| Process Technology | 65 nm |
| Core Voltage | 1.2 V |
| Operating Temperature (Commercial) | 0C to +85C |
| パッケージ | 144-LQFP Exposed Pad (EQFP-144) |
| Speed Grade | C8 |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
| Configuration Memory | SRAM-based (volatile) |
EP3C16E144C8N ピン構成
| ピン 1 | I/O — User I/O bank 1 |
| ピン 2 | I/O — User I/O bank 1 |
| ピン 3 | GND — Ground |
| ピン 4 | VCCIO1 — I/O bank 1 supply voltage |
| ピン 5 | I/O — User I/O bank 1 |
| ピン 6 | I/O — User I/O bank 1 |
| ピン 7 | I/O — User I/O bank 1 |
| ピン 8 | VCCINT — Core supply voltage 1.2V |
| ピン 9 | I/O — User I/O bank 1 |
| ピン 10 | I/O — User I/O bank 1 |
| ピン 11 | GND — Ground |
| ピン 12 | I/O — User I/O bank 1 |
| ピン 13 | I/O — User I/O bank 1 |
| ピン 14 | I/O — User I/O bank 2 |
| ピン 15 | VCCIO2 — I/O bank 2 supply voltage |
| ピン 16 | I/O — User I/O bank 2 |
| ピン 17 | I/O — User I/O bank 2 |
| ピン 18 | I/O — User I/O bank 2 |
| ピン 19 | GND — Ground |
| ピン 20 | I/O — User I/O bank 2 |
| ピン 21 | I/O — User I/O bank 2 |
| ピン 22 | VCCINT — Core supply voltage 1.2V |
| ピン 23 | I/O — User I/O bank 2 |
| ピン 24 | I/O — User I/O bank 2 |
| ピン 25 | GND — Ground |
| ピン 26 | I/O — User I/O bank 2 |
| ピン 27 | I/O — User I/O bank 2 |
| ピン 28 | I/O — User I/O bank 3 |
| ピン 29 | VCCIO3 — I/O bank 3 supply voltage |
| ピン 30 | I/O — User I/O bank 3 |
| ピン 31 | I/O — User I/O bank 3 |
| ピン 32 | I/O — User I/O bank 3 |
| ピン 33 | GND — Ground |
| ピン 34 | I/O — User I/O bank 3 |
| ピン 35 | I/O — User I/O bank 3 |
| ピン 36 | VCCINT — Core supply voltage 1.2V |
| ピン 37 | I/O — User I/O bank 3 |
| ピン 38 | I/O — User I/O bank 3 |
| ピン 39 | GND — Ground |
| ピン 40 | I/O — User I/O bank 3 |
| ピン 41 | I/O — User I/O bank 3 |
| ピン 42 | I/O — User I/O bank 4 |
| ピン 43 | VCCIO4 — I/O bank 4 supply voltage |
| ピン 44 | I/O — User I/O bank 4 |
| ピン 45 | I/O — User I/O bank 4 |
| ピン 46 | I/O — User I/O bank 4 |
| ピン 47 | GND — Ground |
| ピン 48 | I/O — User I/O bank 4 |
| ピン 49 | I/O — User I/O bank 4 |
| ピン 50 | VCCINT — Core supply voltage 1.2V |
| ピン 51 | I/O — User I/O bank 4 |
| ピン 52 | I/O — User I/O bank 4 |
| ピン 53 | GND — Ground |
| ピン 54 | I/O — User I/O bank 4 |
| ピン 55 | I/O — User I/O bank 4 |
| ピン 56 | I/O — User I/O bank 4 |
| ピン 57 | VCCIO4 — I/O bank 4 supply voltage |
| ピン 58 | I/O — User I/O bank 4 |
| ピン 59 | I/O — User I/O bank 4 |
| ピン 60 | I/O — User I/O bank 5 |
| ピン 61 | GND — Ground |
| ピン 62 | I/O — User I/O bank 5 |
| ピン 63 | I/O — User I/O bank 5 |
| ピン 64 | I/O — User I/O bank 5 |
| ピン 65 | VCCINT — Core supply voltage 1.2V |
| ピン 66 | I/O — User I/O bank 5 |
| ピン 67 | I/O — User I/O bank 5 |
| ピン 68 | GND — Ground |
| ピン 69 | I/O — User I/O bank 5 |
| ピン 70 | I/O — User I/O bank 5 |
| ピン 71 | I/O — User I/O bank 6 |
| ピン 72 | VCCIO6 — I/O bank 6 supply voltage |
| ピン 73 | I/O — User I/O bank 6 |
| ピン 74 | I/O — User I/O bank 6 |
| ピン 75 | I/O — User I/O bank 6 |
| ピン 76 | GND — Ground |
| ピン 77 | I/O — User I/O bank 6 |
| ピン 78 | I/O — User I/O bank 6 |
| ピン 79 | VCCINT — Core supply voltage 1.2V |
| ピン 80 | I/O — User I/O bank 6 |
| ピン 81 | I/O — User I/O bank 6 |
| ピン 82 | GND — Ground |
| ピン 83 | I/O — User I/O bank 7 |
| ピン 84 | I/O — User I/O bank 7 |
| ピン 85 | I/O — User I/O bank 7 |
| ピン 86 | VCCIO7 — I/O bank 7 supply voltage |
| ピン 87 | I/O — User I/O bank 7 |
| ピン 88 | I/O — User I/O bank 7 |
| ピン 89 | GND — Ground |
| ピン 90 | I/O — User I/O bank 7 |
| ピン 91 | I/O — User I/O bank 7 |
| ピン 92 | VCCINT — Core supply voltage 1.2V |
| ピン 93 | I/O — User I/O bank 7 |
| ピン 94 | I/O — User I/O bank 7 |
| ピン 95 | GND — Ground |
| ピン 96 | I/O — User I/O bank 8 |
| ピン 97 | I/O — User I/O bank 8 |
| ピン 98 | I/O — User I/O bank 8 |
| ピン 99 | VCCIO8 — I/O bank 8 supply voltage |
| ピン 100 | I/O — User I/O bank 8 |
| ピン 101 | I/O — User I/O bank 8 |
| ピン 102 | GND — Ground |
| ピン 103 | I/O — User I/O bank 8 |
| ピン 104 | I/O — User I/O bank 8 |
| ピン 105 | VCCINT — Core supply voltage 1.2V |
| ピン 106 | I/O — User I/O bank 8 |
| ピン 107 | I/O — User I/O bank 8 |
| ピン 108 | GND — Ground |
| ピン 109 | TCK — JTAG test clock |
| ピン 110 | TMS — JTAG test mode select |
| ピン 111 | TDI — JTAG test data input |
| ピン 112 | TDO — JTAG test data output |
| ピン 113 | nCONFIG — Configuration control (active low) |
| ピン 114 | nSTATUS — Configuration status (active low) |
| ピン 115 | CONF_DONE — Configuration done indicator |
| ピン 116 | MSEL0 — Configuration mode select 0 |
| ピン 117 | MSEL1 — Configuration mode select 1 |
| ピン 118 | MSEL2 — Configuration mode select 2 |
| ピン 119 | DCLK — Configuration clock input |
| ピン 120 | DATA0 — Configuration data input 0 |
| ピン 121 | GND — Ground |
| ピン 122 | VCCINT — Core supply voltage 1.2V |
| ピン 123 | nCE — Chip enable (active low) |
| ピン 124 | I/O — User I/O bank 1 |
| ピン 125 | I/O — User I/O bank 1 |
| ピン 126 | I/O — User I/O bank 1 |
| ピン 127 | VCCIO1 — I/O bank 1 supply voltage |
| ピン 128 | I/O — User I/O bank 1 |
| ピン 129 | I/O — User I/O bank 1 |
| ピン 130 | GND — Ground |
| ピン 131 | I/O — User I/O bank 1 |
| ピン 132 | I/O — User I/O bank 1 |
| ピン 133 | VCCINT — Core supply voltage 1.2V |
| ピン 134 | I/O — User I/O bank 1 |
| ピン 135 | I/O — User I/O bank 1 |
| ピン 136 | GND — Ground |
| ピン 137 | I/O — User I/O bank 1 |
| ピン 138 | I/O — User I/O bank 1 |
| ピン 139 | I/O — User I/O bank 1 |
| ピン 140 | VCCIO1 — I/O bank 1 supply voltage |
| ピン 141 | I/O — User I/O bank 1 |
| ピン 142 | I/O — User I/O bank 1 |
| ピン 143 | GND — Ground |
| ピン 144 | EP — Exposed thermal pad - must be soldered to PCB ground pour |
主な用途
EP3C16E144C8N の用途: 6 件s: Industrial Motor Control, LED Display and Video Processing, Industrial Communication Gateways, Test and Measurement Equipment, Embedded Vision and Image Processing, Glue Logic Replacement and System Integration.
Industrial Motor Control
The EP3C16E144C8N's 56 embedded 18x18 multipliers and 84 I/O pins make it well-suited for field-oriented control (FOC) of BLDC and PMSM motors. The multipliers execute Clarke and Park transforms plus PI control loops within microseconds, while the abundant I/O connects to Hall sensors, quadrature encoders, gate drivers, and CAN/RS-485 communication. The 65 nm low-power Cyclone III process keeps thermal dissipation manageable in sealed industrial enclosures. Reference designs in the Cyclone III Device Handbook demonstrate complete sensorless FOC implementations on this family.
おすすめ
LED Display and Video Processing
The EP3C16E144C8N's 516 Kbits of embedded RAM serves as line buffers for video pixel pipelines, while its 56 multipliers perform real-time color space conversion (RGB to YCbCr), gamma correction, and edge enhancement. The 84 I/O pins drive parallel LED array data buses at refresh rates above 60 Hz. Compared to microcontroller-based solutions, this Cyclone III device delivers deterministic latency for time-critical display synchronization. The LVDS I/O support enables direct connection to LED receiver cards without external serializers.
おすすめ
Industrial Communication Gateways
The EP3C16E144C8N bridges multiple industrial protocols in factory automation systems - implementing Modbus RTU/TCP, PROFINET, EtherCAT, and CANopen stacks in programmable logic. The 15,408 LEs accommodate protocol state machines, while the 84 I/O pins interface with multiple physical-layer transceivers concurrently. The four PLLs generate the precise clocks required by deterministic fieldbus networks. Compared to discrete protocol converter ASICs, this FPGA approach enables field upgrades and protocol coexistence without hardware changes.
おすすめ
Test and Measurement Equipment
The EP3C16E144C8N serves as a flexible stimulus-response engine in bench-top test equipment. Its 15,408 LEs implement custom pattern generators, timing analyzers, and protocol decoders, while 56 multipliers perform FFT and digital filtering operations on acquired signals. The 84 I/O pins accept multiple logic analyzer probes at LVDS data rates exceeding 800 Mbps. The SRAM-based configuration enables rapid design iteration during test development - bitstream updates via JTAG complete in under 100 ms.
おすすめ
Embedded Vision and Image Processing
The EP3C16E144C8N performs real-time image preprocessing in industrial vision systems, including Bayer demosaicing, convolution filtering, and feature extraction. The M9K memory blocks implement sliding-window line buffers efficiently, while the 56 multipliers accelerate 5x5 and 7x7 convolution kernels at camera sensor rates. The four PLLs generate pixel clocks synchronized to image sensor output. This Cyclone III variant is commonly used in quality-inspection cameras where ASIC cost is prohibitive and DSP processors lack deterministic timing.
おすすめ
Glue Logic Replacement and System Integration
The EP3C16E144C8N replaces multiple discrete logic ICs in cost-sensitive consumer and industrial products. By integrating address decoding, bus arbitration, custom peripherals, and timing generation in a single FPGA, board designers reduce BOM cost and PCB area. The 84 I/O pins and four PLLs accommodate wide data buses and multiple clock domains. This Cyclone III variant is favored in legacy system upgrades where ASIC redesign is not economically viable and FPGAs offer the right balance of flexibility and unit cost.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP3C16E144C8N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP3C16E144C7N | EP3C16E144I7N | EP3C16E144A7N | EP3C25E144C8N | EP3C10E144C8N |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same |
| Logic Elements | 15,408 | 15,408 (same) | 15,408 (same) | 15,408 (same) | 24,624 (+60%) | 10,320 (-33%) |
| Memory Bits | 516,096 bits | 516,096 bits (same) | 516,096 bits (same) | 516,096 bits (same) | 608,256 bits (+18%) | 414,720 bits (-20%) |
| Speed Grade | C8 | C7 (faster) | C7 (faster) | A7 (automotive) | C8 (same) | C8 (same) |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Automotive-grade screened | Commercial (0C to +85C) | Commercial (0C to +85C) |
| User I/O Pins | 84 | 84 (same) | 84 (same) | 84 (same) | 82 (slightly fewer) | 91 (more I/O) |
| 18x18 Multipliers | 56 | 56 (same) | 56 (same) | 56 (same) | 66 (+18%) | 46 (-18%) |
主な差別化要因
- Largest Cyclone III device available in 144-LQFP package （vs EP3C25E144C8N)
- Commercial temperature grade with C8 speed grade （vs EP3C16E144I7N)
- Pin-compatible upgrade and downgrade paths within Cyclone III family （vs EP3C10E144C8N and EP3C25E144C8N)
設計ノート
The EP3C16E144C8N requires three separate power rails: 1.2V VCCINT for the core logic, 2.5V/3.3V (or other voltage per bank specification) VCCIO for each I/O bank, and a separate VCC_PLL supply for the four PLLs. Decoupling must include 0.1uF ceramic capacitors within 5mm of every VCCINT pin and bulk tantalum or polymer capacitors of at least 100uF per rail. Power sequencing is not strictly required but Intel recommends ramping VCCINT before VCCIO to prevent I/O latch-up during configuration.
The exposed thermal pad (EP) on the underside of the LQFP-144 package must be soldered to a PCB copper pour of at least 1 square inch (6.5 cm^2) for thermal dissipation. Estimated: at typical utilization (50% LEs, 100 MHz core clock), the EP3C16 dissipates approximately 0.5-1.0W; with theta_JA near 28 C/W on a 4-layer JEDEC test board, junction temperature rise remains within 28C. Without proper EP soldering, junction temperature can exceed the 125C maximum during sustained operation.
Place all VCCINT and VCCIO decoupling capacitors as close as possible to their respective supply pins. Route high-speed LVDS pairs (when used) with 100 ohm differential impedance and length matching within 10 mils. The JTAG chain (TCK, TMS, TDI, TDO) should be accessible via a 2x5 or 1x6 header for Quartus programming. Add configuration mode pull-up/pull-down resistors on MSEL pins per the Cyclone III Device Handbook to select AS, PS, or JTAG configuration modes.
Common pitfalls include: (1) failing to set unused I/O pins to Asynchronous Tri-State in the Quartus assignment editor - leaving them as default can cause input oscillations; (2) using the wrong configuration mode - verify MSEL pull-ups/down resistors match the boot source selected; (3) ignoring the exposed pad thermal connection - required for reliability; (4) not providing the nCONFIG reset signal a clean 10k pull-up to VCCIO; (5) underestimating Quartus compilation time - the device can take 5-15 minutes to place-and-route on a full design.
コンプライアンス情報
RoHS and lead-free compliant per DigiKey product listing. Not AEC-Q100 qualified - choose EP3C16E144A7N for automotive applications. Halogen-free status not explicitly stated in the verified web data.