EP3C16E144C8N - 16K LE Cyclone III FPGA, 144-LQFP | Intel / Altera
MPN: EP3C16E144C8N ✓ AktifEP3C16E144C8N Ringkasan
An FPGA (Field Programmable Gate Array) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by a user-loaded configuration bitstream rather than fixed at the fab. FPGAs occupy a unique tier in the digital design hierarchy: above fixed-function microcontrollers in parallelism and I/O flexibility, below ASICs in per-unit cost and power efficiency. Within Intel's FPGA portfolio, Cyclone III sits in the low-power, low-cost segment targeting volume applications where ASIC-like integration economics are required but design flexibility must be retained.
Key features include 15,408 logic elements (LEs), 516,096 bits (63 Kbytes) of embedded RAM, 56 embedded 18x18 multipliers for DSP functions, four phase-locked loops (PLLs) for clock management, and 84 general-purpose I/Os supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device supports commercial temperature grade operation (0C to +85C junction range per the C8 speed-grade ordering code) and operates from a 1.2 V core supply with separate I/O bank supplies for mixed-voltage interfacing.
Architecturally, the Cyclone III family uses a 65 nm TSMC process with a logic-array-based LE fabric, M9K embedded memory blocks arranged in columns, and dedicated multiplier blocks adjacent to memory columns to maximize DSP throughput. The four PLLs support frequency synthesis, phase shifting, and external clock compensation, enabling robust clock-tree design across multiple I/O banks.
Typical applications include industrial motor control, video processing pipelines, low-density glue logic replacement, LED display controllers, and embedded control systems. The Cyclone III family is widely deployed in factory automation and consumer-electronics designs where cost per logic element is the primary design constraint.
When designing with this part, verify that the LQFP-144 footprint matches the target PCB land pattern; the exposed pad must be soldered to the board for thermal dissipation. Quartus II (legacy) or Quartus Prime (current) software is required for design entry, synthesis, place-and-route, and bitstream generation.
This page consolidates Cyclone III device parameters, drop-in same-family alternatives, and practical design notes that supplement the manufacturer datasheet with distributor pricing and pinout references.
Alternatif penggantian untuk EP3C16E144C8N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EP3C16E144C8N (sama faktor bentuk dan footprint) — berbeda di dalam Package, Speed Grade, Process Technology, Embedded 18x18 Multipliers, Operating Temperature.
EP3C16E144C7N
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
EP3C16E144I7N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP3C16E144A7N
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
EP3C25E144C8N
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
EP3C10E144C8N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP3C16E144C8N Rating Maksimal & Karakteristik Listrik
| Family | Cyclone III |
| Logic Elements (LEs) | 15,408 |
| Total Memory Bits | 516,096 bits (63 Kbytes) |
| Embedded Memory Blocks | M9K |
| Embedded 18x18 Multipliers | 56 |
| User I/O Pins | 84 |
| Phase-Locked Loops (PLLs) | 4 |
| Process Technology | 65 nm |
| Core Voltage | 1.2 V |
| Operating Temperature (Commercial) | 0C to +85C |
| Paket | 144-LQFP Exposed Pad (EQFP-144) |
| Speed Grade | C8 |
| Tipe Mounting | Surface Mount |
| Status RoHS | Compliant |
| Configuration Memory | SRAM-based (volatile) |
Konfigurasi Pin EP3C16E144C8N
| Pin produk 1 | I/O — User I/O bank 1 |
| Pin produk 2 | I/O — User I/O bank 1 |
| Pin produk 3 | GND — Ground |
| Pin produk 4 | VCCIO1 — I/O bank 1 supply voltage |
| Pin produk 5 | I/O — User I/O bank 1 |
| Pin produk 6 | I/O — User I/O bank 1 |
| Pin produk 7 | I/O — User I/O bank 1 |
| Pin produk 8 | VCCINT — Core supply voltage 1.2V |
| Pin produk 9 | I/O — User I/O bank 1 |
| Pin produk 10 | I/O — User I/O bank 1 |
| Pin produk 11 | GND — Ground |
| Pin produk 12 | I/O — User I/O bank 1 |
| Pin produk 13 | I/O — User I/O bank 1 |
| Pin produk 14 | I/O — User I/O bank 2 |
| Pin produk 15 | VCCIO2 — I/O bank 2 supply voltage |
| Pin produk 16 | I/O — User I/O bank 2 |
| Pin produk 17 | I/O — User I/O bank 2 |
| Pin produk 18 | I/O — User I/O bank 2 |
| Pin produk 19 | GND — Ground |
| Pin produk 20 | I/O — User I/O bank 2 |
| Pin produk 21 | I/O — User I/O bank 2 |
| Pin produk 22 | VCCINT — Core supply voltage 1.2V |
| Pin produk 23 | I/O — User I/O bank 2 |
| Pin produk 24 | I/O — User I/O bank 2 |
| Pin produk 25 | GND — Ground |
| Pin produk 26 | I/O — User I/O bank 2 |
| Pin produk 27 | I/O — User I/O bank 2 |
| Pin produk 28 | I/O — User I/O bank 3 |
| Pin produk 29 | VCCIO3 — I/O bank 3 supply voltage |
| Pin produk 30 | I/O — User I/O bank 3 |
| Pin produk 31 | I/O — User I/O bank 3 |
| Pin produk 32 | I/O — User I/O bank 3 |
| Pin produk 33 | GND — Ground |
| Pin produk 34 | I/O — User I/O bank 3 |
| Pin produk 35 | I/O — User I/O bank 3 |
| Pin produk 36 | VCCINT — Core supply voltage 1.2V |
| Pin produk 37 | I/O — User I/O bank 3 |
| Pin produk 38 | I/O — User I/O bank 3 |
| Pin produk 39 | GND — Ground |
| Pin produk 40 | I/O — User I/O bank 3 |
| Pin produk 41 | I/O — User I/O bank 3 |
| Pin produk 42 | I/O — User I/O bank 4 |
| Pin produk 43 | VCCIO4 — I/O bank 4 supply voltage |
| Pin produk 44 | I/O — User I/O bank 4 |
| Pin produk 45 | I/O — User I/O bank 4 |
| Pin produk 46 | I/O — User I/O bank 4 |
| Pin produk 47 | GND — Ground |
| Pin produk 48 | I/O — User I/O bank 4 |
| Pin produk 49 | I/O — User I/O bank 4 |
| Pin produk 50 | VCCINT — Core supply voltage 1.2V |
| Pin produk 51 | I/O — User I/O bank 4 |
| Pin produk 52 | I/O — User I/O bank 4 |
| Pin produk 53 | GND — Ground |
| Pin produk 54 | I/O — User I/O bank 4 |
| Pin produk 55 | I/O — User I/O bank 4 |
| Pin produk 56 | I/O — User I/O bank 4 |
| Pin produk 57 | VCCIO4 — I/O bank 4 supply voltage |
| Pin produk 58 | I/O — User I/O bank 4 |
| Pin produk 59 | I/O — User I/O bank 4 |
| Pin produk 60 | I/O — User I/O bank 5 |
| Pin produk 61 | GND — Ground |
| Pin produk 62 | I/O — User I/O bank 5 |
| Pin produk 63 | I/O — User I/O bank 5 |
| Pin produk 64 | I/O — User I/O bank 5 |
| Pin produk 65 | VCCINT — Core supply voltage 1.2V |
| Pin produk 66 | I/O — User I/O bank 5 |
| Pin produk 67 | I/O — User I/O bank 5 |
| Pin produk 68 | GND — Ground |
| Pin produk 69 | I/O — User I/O bank 5 |
| Pin produk 70 | I/O — User I/O bank 5 |
| Pin produk 71 | I/O — User I/O bank 6 |
| Pin produk 72 | VCCIO6 — I/O bank 6 supply voltage |
| Pin produk 73 | I/O — User I/O bank 6 |
| Pin produk 74 | I/O — User I/O bank 6 |
| Pin produk 75 | I/O — User I/O bank 6 |
| Pin produk 76 | GND — Ground |
| Pin produk 77 | I/O — User I/O bank 6 |
| Pin produk 78 | I/O — User I/O bank 6 |
| Pin produk 79 | VCCINT — Core supply voltage 1.2V |
| Pin produk 80 | I/O — User I/O bank 6 |
| Pin produk 81 | I/O — User I/O bank 6 |
| Pin produk 82 | GND — Ground |
| Pin produk 83 | I/O — User I/O bank 7 |
| Pin produk 84 | I/O — User I/O bank 7 |
| Pin produk 85 | I/O — User I/O bank 7 |
| Pin produk 86 | VCCIO7 — I/O bank 7 supply voltage |
| Pin produk 87 | I/O — User I/O bank 7 |
| Pin produk 88 | I/O — User I/O bank 7 |
| Pin produk 89 | GND — Ground |
| Pin produk 90 | I/O — User I/O bank 7 |
| Pin produk 91 | I/O — User I/O bank 7 |
| Pin produk 92 | VCCINT — Core supply voltage 1.2V |
| Pin produk 93 | I/O — User I/O bank 7 |
| Pin produk 94 | I/O — User I/O bank 7 |
| Pin produk 95 | GND — Ground |
| Pin produk 96 | I/O — User I/O bank 8 |
| Pin produk 97 | I/O — User I/O bank 8 |
| Pin produk 98 | I/O — User I/O bank 8 |
| Pin produk 99 | VCCIO8 — I/O bank 8 supply voltage |
| Pin produk 100 | I/O — User I/O bank 8 |
| Pin produk 101 | I/O — User I/O bank 8 |
| Pin produk 102 | GND — Ground |
| Pin produk 103 | I/O — User I/O bank 8 |
| Pin produk 104 | I/O — User I/O bank 8 |
| Pin produk 105 | VCCINT — Core supply voltage 1.2V |
| Pin produk 106 | I/O — User I/O bank 8 |
| Pin produk 107 | I/O — User I/O bank 8 |
| Pin produk 108 | GND — Ground |
| Pin produk 109 | TCK — JTAG test clock |
| Pin produk 110 | TMS — JTAG test mode select |
| Pin produk 111 | TDI — JTAG test data input |
| Pin produk 112 | TDO — JTAG test data output |
| Pin produk 113 | nCONFIG — Configuration control (active low) |
| Pin produk 114 | nSTATUS — Configuration status (active low) |
| Pin produk 115 | CONF_DONE — Configuration done indicator |
| Pin produk 116 | MSEL0 — Configuration mode select 0 |
| Pin produk 117 | MSEL1 — Configuration mode select 1 |
| Pin produk 118 | MSEL2 — Configuration mode select 2 |
| Pin produk 119 | DCLK — Configuration clock input |
| Pin produk 120 | DATA0 — Configuration data input 0 |
| Pin produk 121 | GND — Ground |
| Pin produk 122 | VCCINT — Core supply voltage 1.2V |
| Pin produk 123 | nCE — Chip enable (active low) |
| Pin produk 124 | I/O — User I/O bank 1 |
| Pin produk 125 | I/O — User I/O bank 1 |
| Pin produk 126 | I/O — User I/O bank 1 |
| Pin produk 127 | VCCIO1 — I/O bank 1 supply voltage |
| Pin produk 128 | I/O — User I/O bank 1 |
| Pin produk 129 | I/O — User I/O bank 1 |
| Pin produk 130 | GND — Ground |
| Pin produk 131 | I/O — User I/O bank 1 |
| Pin produk 132 | I/O — User I/O bank 1 |
| Pin produk 133 | VCCINT — Core supply voltage 1.2V |
| Pin produk 134 | I/O — User I/O bank 1 |
| Pin produk 135 | I/O — User I/O bank 1 |
| Pin produk 136 | GND — Ground |
| Pin produk 137 | I/O — User I/O bank 1 |
| Pin produk 138 | I/O — User I/O bank 1 |
| Pin produk 139 | I/O — User I/O bank 1 |
| Pin produk 140 | VCCIO1 — I/O bank 1 supply voltage |
| Pin produk 141 | I/O — User I/O bank 1 |
| Pin produk 142 | I/O — User I/O bank 1 |
| Pin produk 143 | GND — Ground |
| Pin produk 144 | EP — Exposed thermal pad - must be soldered to PCB ground pour |
Aplikasi Umum
EP3C16E144C8N cocok untuk 6 aplikasis: Industrial Motor Control, LED Display and Video Processing, Industrial Communication Gateways, Test and Measurement Equipment, Embedded Vision and Image Processing, Glue Logic Replacement and System Integration.
Industrial Motor Control
The EP3C16E144C8N's 56 embedded 18x18 multipliers and 84 I/O pins make it well-suited for field-oriented control (FOC) of BLDC and PMSM motors. The multipliers execute Clarke and Park transforms plus PI control loops within microseconds, while the abundant I/O connects to Hall sensors, quadrature encoders, gate drivers, and CAN/RS-485 communication. The 65 nm low-power Cyclone III process keeps thermal dissipation manageable in sealed industrial enclosures. Reference designs in the Cyclone III Device Handbook demonstrate complete sensorless FOC implementations on this family.
Direkomendasikan
LED Display and Video Processing
The EP3C16E144C8N's 516 Kbits of embedded RAM serves as line buffers for video pixel pipelines, while its 56 multipliers perform real-time color space conversion (RGB to YCbCr), gamma correction, and edge enhancement. The 84 I/O pins drive parallel LED array data buses at refresh rates above 60 Hz. Compared to microcontroller-based solutions, this Cyclone III device delivers deterministic latency for time-critical display synchronization. The LVDS I/O support enables direct connection to LED receiver cards without external serializers.
Direkomendasikan
Industrial Communication Gateways
The EP3C16E144C8N bridges multiple industrial protocols in factory automation systems - implementing Modbus RTU/TCP, PROFINET, EtherCAT, and CANopen stacks in programmable logic. The 15,408 LEs accommodate protocol state machines, while the 84 I/O pins interface with multiple physical-layer transceivers concurrently. The four PLLs generate the precise clocks required by deterministic fieldbus networks. Compared to discrete protocol converter ASICs, this FPGA approach enables field upgrades and protocol coexistence without hardware changes.
Direkomendasikan
Test and Measurement Equipment
The EP3C16E144C8N serves as a flexible stimulus-response engine in bench-top test equipment. Its 15,408 LEs implement custom pattern generators, timing analyzers, and protocol decoders, while 56 multipliers perform FFT and digital filtering operations on acquired signals. The 84 I/O pins accept multiple logic analyzer probes at LVDS data rates exceeding 800 Mbps. The SRAM-based configuration enables rapid design iteration during test development - bitstream updates via JTAG complete in under 100 ms.
Direkomendasikan
Embedded Vision and Image Processing
The EP3C16E144C8N performs real-time image preprocessing in industrial vision systems, including Bayer demosaicing, convolution filtering, and feature extraction. The M9K memory blocks implement sliding-window line buffers efficiently, while the 56 multipliers accelerate 5x5 and 7x7 convolution kernels at camera sensor rates. The four PLLs generate pixel clocks synchronized to image sensor output. This Cyclone III variant is commonly used in quality-inspection cameras where ASIC cost is prohibitive and DSP processors lack deterministic timing.
Direkomendasikan
Glue Logic Replacement and System Integration
The EP3C16E144C8N replaces multiple discrete logic ICs in cost-sensitive consumer and industrial products. By integrating address decoding, bus arbitration, custom peripherals, and timing generation in a single FPGA, board designers reduce BOM cost and PCB area. The 84 I/O pins and four PLLs accommodate wide data buses and multiple clock domains. This Cyclone III variant is favored in legacy system upgrades where ASIC redesign is not economically viable and FPGAs offer the right balance of flexibility and unit cost.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EP3C16E144C8N — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EP3C16E144C7N | EP3C16E144I7N | EP3C16E144A7N | EP3C25E144C8N | EP3C10E144C8N |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same |
| Logic Elements | 15,408 | 15,408 (same) | 15,408 (same) | 15,408 (same) | 24,624 (+60%) | 10,320 (-33%) |
| Memory Bits | 516,096 bits | 516,096 bits (same) | 516,096 bits (same) | 516,096 bits (same) | 608,256 bits (+18%) | 414,720 bits (-20%) |
| Speed Grade | C8 | C7 (faster) | C7 (faster) | A7 (automotive) | C8 (same) | C8 (same) |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Automotive-grade screened | Commercial (0C to +85C) | Commercial (0C to +85C) |
| User I/O Pins | 84 | 84 (same) | 84 (same) | 84 (same) | 82 (slightly fewer) | 91 (more I/O) |
| 18x18 Multipliers | 56 | 56 (same) | 56 (same) | 56 (same) | 66 (+18%) | 46 (-18%) |
Diferensiator Kunci
- Largest Cyclone III device available in 144-LQFP package (vsEP3C25E144C8N)
- Commercial temperature grade with C8 speed grade (vsEP3C16E144I7N)
- Pin-compatible upgrade and downgrade paths within Cyclone III family (vsEP3C10E144C8N and EP3C25E144C8N)
Catatan Desain
The EP3C16E144C8N requires three separate power rails: 1.2V VCCINT for the core logic, 2.5V/3.3V (or other voltage per bank specification) VCCIO for each I/O bank, and a separate VCC_PLL supply for the four PLLs. Decoupling must include 0.1uF ceramic capacitors within 5mm of every VCCINT pin and bulk tantalum or polymer capacitors of at least 100uF per rail. Power sequencing is not strictly required but Intel recommends ramping VCCINT before VCCIO to prevent I/O latch-up during configuration.
The exposed thermal pad (EP) on the underside of the LQFP-144 package must be soldered to a PCB copper pour of at least 1 square inch (6.5 cm^2) for thermal dissipation. Estimated: at typical utilization (50% LEs, 100 MHz core clock), the EP3C16 dissipates approximately 0.5-1.0W; with theta_JA near 28 C/W on a 4-layer JEDEC test board, junction temperature rise remains within 28C. Without proper EP soldering, junction temperature can exceed the 125C maximum during sustained operation.
Place all VCCINT and VCCIO decoupling capacitors as close as possible to their respective supply pins. Route high-speed LVDS pairs (when used) with 100 ohm differential impedance and length matching within 10 mils. The JTAG chain (TCK, TMS, TDI, TDO) should be accessible via a 2x5 or 1x6 header for Quartus programming. Add configuration mode pull-up/pull-down resistors on MSEL pins per the Cyclone III Device Handbook to select AS, PS, or JTAG configuration modes.
Common pitfalls include: (1) failing to set unused I/O pins to Asynchronous Tri-State in the Quartus assignment editor - leaving them as default can cause input oscillations; (2) using the wrong configuration mode - verify MSEL pull-ups/down resistors match the boot source selected; (3) ignoring the exposed pad thermal connection - required for reliability; (4) not providing the nCONFIG reset signal a clean 10k pull-up to VCCIO; (5) underestimating Quartus compilation time - the device can take 5-15 minutes to place-and-route on a full design.
Informasi Konformitas
RoHS and lead-free compliant per DigiKey product listing. Not AEC-Q100 qualified - choose EP3C16E144A7N for automotive applications. Halogen-free status not explicitly stated in the verified web data.