EP3C16E144C8N - 16K LE Cyclone III FPGA, 144-LQFP | Intel / Altera
N.º da peça: EP3C16E144C8N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $36.02 | $36,02 |
| 10 | $32.41 | $324,10 |
| 100 | $28.81 | $2.881,00 |
| 500 | $25.2 | $12.600,00 |
| 1.000 | $22.49 | $22.490,00 |
EP3C16E144C8N Visão geral
An FPGA (Field Programmable Gate Array) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by a user-loaded configuration bitstream rather than fixed at the fab. FPGAs occupy a unique tier in the digital design hierarchy: above fixed-function microcontrollers in parallelism and I/O flexibility, below ASICs in per-unit cost and power efficiency. Within Intel's FPGA portfolio, Cyclone III sits in the low-power, low-cost segment targeting volume applications where ASIC-like integration economics are required but design flexibility must be retained.
Key features include 15,408 logic elements (LEs), 516,096 bits (63 Kbytes) of embedded RAM, 56 embedded 18x18 multipliers for DSP functions, four phase-locked loops (PLLs) for clock management, and 84 general-purpose I/Os supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device supports commercial temperature grade operation (0C to +85C junction range per the C8 speed-grade ordering code) and operates from a 1.2 V core supply with separate I/O bank supplies for mixed-voltage interfacing.
Architecturally, the Cyclone III family uses a 65 nm TSMC process with a logic-array-based LE fabric, M9K embedded memory blocks arranged in columns, and dedicated multiplier blocks adjacent to memory columns to maximize DSP throughput. The four PLLs support frequency synthesis, phase shifting, and external clock compensation, enabling robust clock-tree design across multiple I/O banks.
Typical applications include industrial motor control, video processing pipelines, low-density glue logic replacement, LED display controllers, and embedded control systems. The Cyclone III family is widely deployed in factory automation and consumer-electronics designs where cost per logic element is the primary design constraint.
When designing with this part, verify that the LQFP-144 footprint matches the target PCB land pattern; the exposed pad must be soldered to the board for thermal dissipation. Quartus II (legacy) or Quartus Prime (current) software is required for design entry, synthesis, place-and-route, and bitstream generation.
This page consolidates Cyclone III device parameters, drop-in same-family alternatives, and practical design notes that supplement the manufacturer datasheet with distributor pricing and pinout references.
Alternativas drop-in para EP3C16E144C8N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP3C16E144C8N (mesmo formato e footprint) — diferindo em Speed Grade, Embedded 18x18 Multipliers, Operating Temperature, Process Technology, Total Memory Bits.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP3C16E144C7N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP3C16E144I7N
✅ Drop-In✓ Em estoque
$34.95 / unidade
Ver ficha técnica →EP3C16E144A7N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP3C25E144C8N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP3C10E144C8N
✅ Drop-In✓ Em estoque
$15.2 / unidade
Ver ficha técnica →EP3C16E144C8N Classificações máximas e características elétricas
| Family | Cyclone III |
| Logic Elements (LEs) | 15,408 |
| Total Memory Bits | 516,096 bits (63 Kbytes) |
| Embedded Memory Blocks | M9K |
| Embedded 18x18 Multipliers | 56 |
| User I/O Pins | 84 |
| Phase-Locked Loops (PLLs) | 4 |
| Process Technology | 65 nm |
| Core Voltage | 1.2 V |
| Operating Temperature (Commercial) | 0C to +85C |
| Encapsulamento | 144-LQFP Exposed Pad (EQFP-144) |
| Speed Grade | C8 |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Configuration Memory | SRAM-based (volatile) |
Configuração de pinos do EP3C16E144C8N
| Pino 1 | I/O — User I/O bank 1 |
| Pino 2 | I/O — User I/O bank 1 |
| Pino 3 | GND — Ground |
| Pino 4 | VCCIO1 — I/O bank 1 supply voltage |
| Pino 5 | I/O — User I/O bank 1 |
| Pino 6 | I/O — User I/O bank 1 |
| Pino 7 | I/O — User I/O bank 1 |
| Pino 8 | VCCINT — Core supply voltage 1.2V |
| Pino 9 | I/O — User I/O bank 1 |
| Pino 10 | I/O — User I/O bank 1 |
| Pino 11 | GND — Ground |
| Pino 12 | I/O — User I/O bank 1 |
| Pino 13 | I/O — User I/O bank 1 |
| Pino 14 | I/O — User I/O bank 2 |
| Pino 15 | VCCIO2 — I/O bank 2 supply voltage |
| Pino 16 | I/O — User I/O bank 2 |
| Pino 17 | I/O — User I/O bank 2 |
| Pino 18 | I/O — User I/O bank 2 |
| Pino 19 | GND — Ground |
| Pino 20 | I/O — User I/O bank 2 |
| Pino 21 | I/O — User I/O bank 2 |
| Pino 22 | VCCINT — Core supply voltage 1.2V |
| Pino 23 | I/O — User I/O bank 2 |
| Pino 24 | I/O — User I/O bank 2 |
| Pino 25 | GND — Ground |
| Pino 26 | I/O — User I/O bank 2 |
| Pino 27 | I/O — User I/O bank 2 |
| Pino 28 | I/O — User I/O bank 3 |
| Pino 29 | VCCIO3 — I/O bank 3 supply voltage |
| Pino 30 | I/O — User I/O bank 3 |
| Pino 31 | I/O — User I/O bank 3 |
| Pino 32 | I/O — User I/O bank 3 |
| Pino 33 | GND — Ground |
| Pino 34 | I/O — User I/O bank 3 |
| Pino 35 | I/O — User I/O bank 3 |
| Pino 36 | VCCINT — Core supply voltage 1.2V |
| Pino 37 | I/O — User I/O bank 3 |
| Pino 38 | I/O — User I/O bank 3 |
| Pino 39 | GND — Ground |
| Pino 40 | I/O — User I/O bank 3 |
| Pino 41 | I/O — User I/O bank 3 |
| Pino 42 | I/O — User I/O bank 4 |
| Pino 43 | VCCIO4 — I/O bank 4 supply voltage |
| Pino 44 | I/O — User I/O bank 4 |
| Pino 45 | I/O — User I/O bank 4 |
| Pino 46 | I/O — User I/O bank 4 |
| Pino 47 | GND — Ground |
| Pino 48 | I/O — User I/O bank 4 |
| Pino 49 | I/O — User I/O bank 4 |
| Pino 50 | VCCINT — Core supply voltage 1.2V |
| Pino 51 | I/O — User I/O bank 4 |
| Pino 52 | I/O — User I/O bank 4 |
| Pino 53 | GND — Ground |
| Pino 54 | I/O — User I/O bank 4 |
| Pino 55 | I/O — User I/O bank 4 |
| Pino 56 | I/O — User I/O bank 4 |
| Pino 57 | VCCIO4 — I/O bank 4 supply voltage |
| Pino 58 | I/O — User I/O bank 4 |
| Pino 59 | I/O — User I/O bank 4 |
| Pino 60 | I/O — User I/O bank 5 |
| Pino 61 | GND — Ground |
| Pino 62 | I/O — User I/O bank 5 |
| Pino 63 | I/O — User I/O bank 5 |
| Pino 64 | I/O — User I/O bank 5 |
| Pino 65 | VCCINT — Core supply voltage 1.2V |
| Pino 66 | I/O — User I/O bank 5 |
| Pino 67 | I/O — User I/O bank 5 |
| Pino 68 | GND — Ground |
| Pino 69 | I/O — User I/O bank 5 |
| Pino 70 | I/O — User I/O bank 5 |
| Pino 71 | I/O — User I/O bank 6 |
| Pino 72 | VCCIO6 — I/O bank 6 supply voltage |
| Pino 73 | I/O — User I/O bank 6 |
| Pino 74 | I/O — User I/O bank 6 |
| Pino 75 | I/O — User I/O bank 6 |
| Pino 76 | GND — Ground |
| Pino 77 | I/O — User I/O bank 6 |
| Pino 78 | I/O — User I/O bank 6 |
| Pino 79 | VCCINT — Core supply voltage 1.2V |
| Pino 80 | I/O — User I/O bank 6 |
| Pino 81 | I/O — User I/O bank 6 |
| Pino 82 | GND — Ground |
| Pino 83 | I/O — User I/O bank 7 |
| Pino 84 | I/O — User I/O bank 7 |
| Pino 85 | I/O — User I/O bank 7 |
| Pino 86 | VCCIO7 — I/O bank 7 supply voltage |
| Pino 87 | I/O — User I/O bank 7 |
| Pino 88 | I/O — User I/O bank 7 |
| Pino 89 | GND — Ground |
| Pino 90 | I/O — User I/O bank 7 |
| Pino 91 | I/O — User I/O bank 7 |
| Pino 92 | VCCINT — Core supply voltage 1.2V |
| Pino 93 | I/O — User I/O bank 7 |
| Pino 94 | I/O — User I/O bank 7 |
| Pino 95 | GND — Ground |
| Pino 96 | I/O — User I/O bank 8 |
| Pino 97 | I/O — User I/O bank 8 |
| Pino 98 | I/O — User I/O bank 8 |
| Pino 99 | VCCIO8 — I/O bank 8 supply voltage |
| Pino 100 | I/O — User I/O bank 8 |
| Pino 101 | I/O — User I/O bank 8 |
| Pino 102 | GND — Ground |
| Pino 103 | I/O — User I/O bank 8 |
| Pino 104 | I/O — User I/O bank 8 |
| Pino 105 | VCCINT — Core supply voltage 1.2V |
| Pino 106 | I/O — User I/O bank 8 |
| Pino 107 | I/O — User I/O bank 8 |
| Pino 108 | GND — Ground |
| Pino 109 | TCK — JTAG test clock |
| Pino 110 | TMS — JTAG test mode select |
| Pino 111 | TDI — JTAG test data input |
| Pino 112 | TDO — JTAG test data output |
| Pino 113 | nCONFIG — Configuration control (active low) |
| Pino 114 | nSTATUS — Configuration status (active low) |
| Pino 115 | CONF_DONE — Configuration done indicator |
| Pino 116 | MSEL0 — Configuration mode select 0 |
| Pino 117 | MSEL1 — Configuration mode select 1 |
| Pino 118 | MSEL2 — Configuration mode select 2 |
| Pino 119 | DCLK — Configuration clock input |
| Pino 120 | DATA0 — Configuration data input 0 |
| Pino 121 | GND — Ground |
| Pino 122 | VCCINT — Core supply voltage 1.2V |
| Pino 123 | nCE — Chip enable (active low) |
| Pino 124 | I/O — User I/O bank 1 |
| Pino 125 | I/O — User I/O bank 1 |
| Pino 126 | I/O — User I/O bank 1 |
| Pino 127 | VCCIO1 — I/O bank 1 supply voltage |
| Pino 128 | I/O — User I/O bank 1 |
| Pino 129 | I/O — User I/O bank 1 |
| Pino 130 | GND — Ground |
| Pino 131 | I/O — User I/O bank 1 |
| Pino 132 | I/O — User I/O bank 1 |
| Pino 133 | VCCINT — Core supply voltage 1.2V |
| Pino 134 | I/O — User I/O bank 1 |
| Pino 135 | I/O — User I/O bank 1 |
| Pino 136 | GND — Ground |
| Pino 137 | I/O — User I/O bank 1 |
| Pino 138 | I/O — User I/O bank 1 |
| Pino 139 | I/O — User I/O bank 1 |
| Pino 140 | VCCIO1 — I/O bank 1 supply voltage |
| Pino 141 | I/O — User I/O bank 1 |
| Pino 142 | I/O — User I/O bank 1 |
| Pino 143 | GND — Ground |
| Pino 144 | EP — Exposed thermal pad - must be soldered to PCB ground pour |
Aplicações típicas
EP3C16E144C8N é adequado para 6 aplicaçãos: Industrial Motor Control, LED Display and Video Processing, Industrial Communication Gateways, Test and Measurement Equipment, Embedded Vision and Image Processing, Glue Logic Replacement and System Integration.
Industrial Motor Control
The EP3C16E144C8N's 56 embedded 18x18 multipliers and 84 I/O pins make it well-suited for field-oriented control (FOC) of BLDC and PMSM motors. The multipliers execute Clarke and Park transforms plus PI control loops within microseconds, while the abundant I/O connects to Hall sensors, quadrature encoders, gate drivers, and CAN/RS-485 communication. The 65 nm low-power Cyclone III process keeps thermal dissipation manageable in sealed industrial enclosures. Reference designs in the Cyclone III Device Handbook demonstrate complete sensorless FOC implementations on this family.
Recomendado
LED Display and Video Processing
The EP3C16E144C8N's 516 Kbits of embedded RAM serves as line buffers for video pixel pipelines, while its 56 multipliers perform real-time color space conversion (RGB to YCbCr), gamma correction, and edge enhancement. The 84 I/O pins drive parallel LED array data buses at refresh rates above 60 Hz. Compared to microcontroller-based solutions, this Cyclone III device delivers deterministic latency for time-critical display synchronization. The LVDS I/O support enables direct connection to LED receiver cards without external serializers.
Recomendado
Industrial Communication Gateways
The EP3C16E144C8N bridges multiple industrial protocols in factory automation systems - implementing Modbus RTU/TCP, PROFINET, EtherCAT, and CANopen stacks in programmable logic. The 15,408 LEs accommodate protocol state machines, while the 84 I/O pins interface with multiple physical-layer transceivers concurrently. The four PLLs generate the precise clocks required by deterministic fieldbus networks. Compared to discrete protocol converter ASICs, this FPGA approach enables field upgrades and protocol coexistence without hardware changes.
Recomendado
Test and Measurement Equipment
The EP3C16E144C8N serves as a flexible stimulus-response engine in bench-top test equipment. Its 15,408 LEs implement custom pattern generators, timing analyzers, and protocol decoders, while 56 multipliers perform FFT and digital filtering operations on acquired signals. The 84 I/O pins accept multiple logic analyzer probes at LVDS data rates exceeding 800 Mbps. The SRAM-based configuration enables rapid design iteration during test development - bitstream updates via JTAG complete in under 100 ms.
Recomendado
Embedded Vision and Image Processing
The EP3C16E144C8N performs real-time image preprocessing in industrial vision systems, including Bayer demosaicing, convolution filtering, and feature extraction. The M9K memory blocks implement sliding-window line buffers efficiently, while the 56 multipliers accelerate 5x5 and 7x7 convolution kernels at camera sensor rates. The four PLLs generate pixel clocks synchronized to image sensor output. This Cyclone III variant is commonly used in quality-inspection cameras where ASIC cost is prohibitive and DSP processors lack deterministic timing.
Recomendado
Glue Logic Replacement and System Integration
The EP3C16E144C8N replaces multiple discrete logic ICs in cost-sensitive consumer and industrial products. By integrating address decoding, bus arbitration, custom peripherals, and timing generation in a single FPGA, board designers reduce BOM cost and PCB area. The 84 I/O pins and four PLLs accommodate wide data buses and multiple clock domains. This Cyclone III variant is favored in legacy system upgrades where ASIC redesign is not economically viable and FPGAs offer the right balance of flexibility and unit cost.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP3C16E144C8N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP3C16E144C7N | EP3C16E144I7N | EP3C16E144A7N | EP3C25E144C8N | EP3C10E144C8N |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same |
| Logic Elements | 15,408 | 15,408 (same) | 15,408 (same) | 15,408 (same) | 24,624 (+60%) | 10,320 (-33%) |
| Memory Bits | 516,096 bits | 516,096 bits (same) | 516,096 bits (same) | 516,096 bits (same) | 608,256 bits (+18%) | 414,720 bits (-20%) |
| Speed Grade | C8 | C7 (faster) | C7 (faster) | A7 (automotive) | C8 (same) | C8 (same) |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Automotive-grade screened | Commercial (0C to +85C) | Commercial (0C to +85C) |
| User I/O Pins | 84 | 84 (same) | 84 (same) | 84 (same) | 82 (slightly fewer) | 91 (more I/O) |
| 18x18 Multipliers | 56 | 56 (same) | 56 (same) | 56 (same) | 66 (+18%) | 46 (-18%) |
Principais diferenciais
- Largest Cyclone III device available in 144-LQFP package (vs EP3C25E144C8N)
- Commercial temperature grade with C8 speed grade (vs EP3C16E144I7N)
- Pin-compatible upgrade and downgrade paths within Cyclone III family (vs EP3C10E144C8N and EP3C25E144C8N)
Notas de projeto
The EP3C16E144C8N requires three separate power rails: 1.2V VCCINT for the core logic, 2.5V/3.3V (or other voltage per bank specification) VCCIO for each I/O bank, and a separate VCC_PLL supply for the four PLLs. Decoupling must include 0.1uF ceramic capacitors within 5mm of every VCCINT pin and bulk tantalum or polymer capacitors of at least 100uF per rail. Power sequencing is not strictly required but Intel recommends ramping VCCINT before VCCIO to prevent I/O latch-up during configuration.
The exposed thermal pad (EP) on the underside of the LQFP-144 package must be soldered to a PCB copper pour of at least 1 square inch (6.5 cm^2) for thermal dissipation. Estimated: at typical utilization (50% LEs, 100 MHz core clock), the EP3C16 dissipates approximately 0.5-1.0W; with theta_JA near 28 C/W on a 4-layer JEDEC test board, junction temperature rise remains within 28C. Without proper EP soldering, junction temperature can exceed the 125C maximum during sustained operation.
Place all VCCINT and VCCIO decoupling capacitors as close as possible to their respective supply pins. Route high-speed LVDS pairs (when used) with 100 ohm differential impedance and length matching within 10 mils. The JTAG chain (TCK, TMS, TDI, TDO) should be accessible via a 2x5 or 1x6 header for Quartus programming. Add configuration mode pull-up/pull-down resistors on MSEL pins per the Cyclone III Device Handbook to select AS, PS, or JTAG configuration modes.
Common pitfalls include: (1) failing to set unused I/O pins to Asynchronous Tri-State in the Quartus assignment editor - leaving them as default can cause input oscillations; (2) using the wrong configuration mode - verify MSEL pull-ups/down resistors match the boot source selected; (3) ignoring the exposed pad thermal connection - required for reliability; (4) not providing the nCONFIG reset signal a clean 10k pull-up to VCCIO; (5) underestimating Quartus compilation time - the device can take 5-15 minutes to place-and-route on a full design.
Informações de conformidade
RoHS and lead-free compliant per DigiKey product listing. Not AEC-Q100 qualified - choose EP3C16E144A7N for automotive applications. Halogen-free status not explicitly stated in the verified web data.