EPM570M256C5N - MAX II CPLD 440LE 5.4ns 256-MBGA | Intel
MPN： EPM570M256C5N ✓ 啟用中EPM570M256C5N 概覽
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic IC that sits between simple glue-logic gates and full FPGAs in the programmable logic hierarchy: SPLD/CPLD -> programmable logic -> logic IC -> semiconductor. MAX II devices replace discrete SSI/MSI glue logic (address decoders, bus interfaces, state machines, timing blocks) with a single reconfigurable part whose routing, I/O standards, and logic functions are loaded from on-chip Flash at power-up and retained without external configuration memory.
Key features include 440 Logic Elements (LEs), 5.4 ns tPD, 201.1 MHz fMAX, MultiVolt core supporting 1.8 V/2.5 V/3.3 V interface voltages, JTAG IEEE 1149.1 boundary-scan, in-system programmability via JTAG, and a User Flash Memory block for on-die parameter storage. The 256-MBGA package provides 212 user I/O pins, enabling high-density bus bridging without external logic expansion.
The device architecture combines a Look-Up Table (LUT) based Logic Element array, a fast continuous interconnect network, and MultiVolt I/O banks that let each pin operate at a different standard independently. Internal Flash stores both the configuration image and user data, eliminating the need for an external boot PROM and reducing board complexity for low-density logic consolidation.
Typical applications include address decoding and bus-interface bridging in 32-bit and 64-bit microprocessor systems, I/O expansion and voltage-level translation between mismatched logic families, power-up sequencing controllers for multi-rail systems, peripheral glue logic in industrial controllers, and LED-display or scanner driving where deterministic timing and zero standby power are required.
When designing with this part, observe the 256-ball MBGA PCB layout rules (1.0 mm ball pitch, microvia or via-in-pad recommended) and provide 1.8 V, 2.5 V, and 3.3 V supplies for core and I/O banks. Decouple each VCC/VCCIO pin with a 0.1 µF X7R ceramic capacitor placed within 3 mm of the ball.
This page synthesizes distributor stock, drop-in package-compatible alternatives drawn from the MAX II vertical-migration family, and practical PCB layout notes not found in the manufacturer datasheet.
直接替換替代品，適用於 EPM570M256C5N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EPM570M256C5N （相同外形與佔位） — 差異在於 Operating Temperature, Process Technology, Package, Lead-Free / RoHS, Series.
EPM1270M256C5N
✅ 直接替換📋 參考替代品（不在目錄中）
EPM2210M256C5N
✅ 直接替換📋 參考替代品（不在目錄中）
EPM570M256C4N
✅ 直接替換聯絡詢價
查看資料表 →EPM570GM256C5N
✅ 直接替換聯絡詢價
查看資料表 →EPM570GM256I5N
✅ 直接替換聯絡詢價
查看資料表 →EPM570GF256C5N
✅ 直接替換聯絡詢價
查看資料表 →EPM570F256C5N
✅ 直接替換聯絡詢價
查看資料表 →EPM570M256C5N 最大額定值與電氣特性
| Family | MAX II |
| Series | EPM570 |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Logic Elements (LEs) | 440 |
| Macro Cells | 440 |
| Pin-to-Pin Delay (tPD) | 5.4 ns |
| Maximum Operating Frequency | 201.1 MHz |
| Process Technology | 0.18 µm CMOS, non-volatile Flash |
| Supply Voltage - Core | 1.8 V |
| Supply Voltage - I/O Banks | 2.5 V / 3.3 V |
| User I/O Pins | 212 (max, package-limited) |
| User Flash Memory | 8 Kbits |
| 封裝 | 256-MBGA (Micro FineLine BGA), 1.0 mm pitch |
| 安裝類型 | Surface Mount |
| 工作溫度 | 0°C to +85°C (commercial) |
| Configuration Interface | JTAG (IEEE 1149.1) / in-system programmable |
| RoHS 狀態 | Compliant |
| Lead-Free | Yes |
EPM570M256C5N 256-mbga (micro fineline bga), 1.0 mm pitch 腳位配置指南
EPM570M256C5N（256-mbga (micro fineline bga), 1.0 mm pitch 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EPM570M256C5N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EPM570M256C5N 適用於 6 應用s: Microprocessor Address Decoding & Bus Bridging, I/O Expansion & Voltage Level Translation, Power-Up Sequencing Controller, Industrial Controller Glue Logic, Peripheral Interface Consolidation, LED Display & Scanner Driving.
Microprocessor Address Decoding & Bus Bridging
The EPM570M256C5N is well suited to decode 32-bit or 64-bit microprocessor address buses into multiple chip-select strobes with deterministic 5.4 ns propagation delay, ensuring zero wait-state operation. Its 212 user I/Os in the 256-MBGA package accept wide address and data buses directly without external buffering. MultiVolt I/O banks bridge 1.8 V, 2.5 V, and 3.3 V peripherals to a 3.3 V or 2.5 V processor without level shifters. Typical implementations consume under 50 mW standby, making the part ideal for always-on industrial controller boards.
推薦
I/O Expansion & Voltage Level Translation
With MultiVolt I/O banks supporting 1.8 V, 2.5 V, and 3.3 V simultaneously, the EPM570M256C5N consolidates multiple level-translating buffers into one CPLD. The 440 LE array is sufficient to implement 16 to 32 channels of bidirectional voltage translation plus optional direction-control logic. The 5.4 ns tPD adds less than one clock of latency on 100 MHz buses, preserving timing margins in FPGA-to-ASIC or FPGA-to-DDR memory bridges used in prototyping platforms.
推薦
Power-Up Sequencing Controller
The EPM570M256C5N delivers deterministic, programmable power-rail sequencing for multi-voltage systems such as FPGAs, DDR memory, and analog front-ends. Its non-volatile Flash configuration loads in under 1 ms and the part can be released from reset to begin sequencing with a guaranteed 5.4 ns delay precision - far tighter than discrete RC-timed sequencers. With 440 LEs, designers can implement cascaded delays, fault monitoring, and watchdog logic in a single chip, eliminating the four or five supervisor ICs typically required.
推薦
Industrial Controller Glue Logic
Factory automation controllers, PLCs, and motor-drive boards rely on the EPM570M256C5N for peripheral glue logic: encoder interfaces, PWM gating, SPI-to-parallel expansion, and isolated I/O conditioning. The 256-MBGA package's 212 user I/Os accept numerous encoder and sensor inputs simultaneously. The 0.18 µm Flash process delivers industrial-grade reliability with predictable timing for safety-related functions up to SIL-2 when paired with appropriate diagnostics.
推薦
Peripheral Interface Consolidation
Legacy designs using 74-series TTL glue for keyboard scanners, seven-segment drivers, and 8255-compatible peripheral interfaces can be fully consolidated into one EPM570M256C5N, reducing PCB area by up to 80% and BOM count by dozens of parts. The CPLD's deterministic timing reproduces the original discrete logic waveforms exactly, so existing firmware does not require modification. This makes the part popular in industrial and aerospace retrofits where form-fit-function replacement is required.
推薦
LED Display & Scanner Driving
The EPM570M256C5N's high output drive strength, 212 user I/Os, and 201.1 MHz maximum internal frequency make it suitable for multiplexing large LED matrices, dot-matrix displays, and barcode scanner arrays. Designers can implement Charlieplexing, PWM dimming, and row/column scanning in one part while offloading the display refresh from a microcontroller. MultiVolt I/O compatibility lets the CPLD drive both 3.3 V logic-level LEDs and 5 V tolerant high-brightness strings without external drivers.
推薦
推薦產品摘要
工程參考資料，適用於 EPM570M256C5N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EPM1270M256C5N | EPM2210M256C5N | EPM570M256C4N | EPM570GM256C5N | EPM570GM256I5N | EPM570GF256C5N | EPM570F256C5N |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-MBGA (1.0 mm pitch) | 256-MBGA - same | 256-MBGA - same | 256-MBGA - same | 256-MBGA - same | 256-MBGA - same | 256-MBGA - same | 256-MBGA - same |
| Logic Elements | 440 | 980 (+123%) | 2210 (+402%) | 440 (same die) | 440 (same) | 440 (same) | 440 (same) | 440 (same) |
| tPD (pin-to-pin) | 5.4 ns | 5.4 ns (same) | 5.4 ns (same) | 7.5 ns (slower -4 grade) | 5.4 ns (same) | 5.4 ns (same) | 5.4 ns (same) | 5.4 ns (same) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 2.5 V / 3.3 V |
| Operating Temperature | 0°C to +85°C (commercial) | 0°C to +85°C | 0°C to +85°C | 0°C to +85°C | 0°C to +85°C | -40°C to +100°C (industrial) | 0°C to +85°C | 0°C to +85°C |
| Family Series | MAX II M-series | MAX II M-series | MAX II M-series | MAX II M-series | MAX II G-series | MAX II G-series | MAX II G-series | MAX II F-series (legacy) |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
主要差異化特點
- Lowest-density drop-in upgrade path in the MAX II family (對比EPM1270M256C5N)
- Highest-density option for the same 256-MBGA footprint (對比EPM2210M256C5N)
- 1.8 V core architecture with MultiVolt I/O (對比EPM570F256C5N)
設計說明
Estimated: The 256-MBGA package uses 1.0 mm ball pitch and requires 4 to 6 PCB layers with microvia or via-in-pad construction for reliable assembly. Place one 0.1 µF X7R 0402 decoupling capacitor within 3 mm of every VCC and VCCIO pin pair, and add four 4.7 µF bulk capacitors near each package corner. Maintain a continuous ground plane on the layer directly beneath the BGA and avoid signal traces crossing beneath the BGA shadow to minimize crosstalk into the 201 MHz internal logic.
Estimated: Power sequencing for the EPM570M256C5N requires the 1.8 V VCCINT rail to ramp before or simultaneously with any 2.5 V / 3.3 V VCCIO bank. A hot-swap or sequencing controller such as the LTC2955 should drive the enable inputs of upstream regulators to enforce this order; out-of-order power-up can latch I/O pins into undefined states. Total typical supply current at 50 MHz toggle with all I/O active is approximately 30 mA, well within the capability of any LDO rated above 100 mA.
Do not connect the JTAG TCK, TMS, TDI, and TDO pins to any non-JTAG function in the Quartus pin assignments without setting them as input tri-state in the device options - leaving them enabled can prevent boundary-scan from acquiring the chain. When migrating a design from a 100-pin TQFP MAX II device to the 256-MBGA package, unused I/O pins must be set to 'tri-state' in the fitter settings rather than left floating, since input-only MBGA balls can float into the linear region and draw supply current.
合規資訊
RoHS compliant and lead-free per Intel product declaration. BGA balls use SAC305 lead-free alloy compatible with JEDEC J-STD-020 260°C peak reflow. AEC-Q100 not applicable - this is a commercial-grade CPLD; industrial-temperature variants (EPM570GM256I5N) are recommended for harsh-environment applications.
