MC8641DVU1000GE - Dual 1GHz e600 SoC, 1023-FCBGA | NXP
MPN： MC8641DVU1000GE ⚠ 最後購買機會MC8641DVU1000GE 概覽
What is a dual-core Power Architecture SoC? A SoC (System-on-Chip) integrates CPU cores, memory controllers, and high-speed I/O into one silicon device, replacing what previously required a separate CPU, chipset, and I/O bridge. The MPC86xx family extends the classic PowerPC e600 core into multi-core, integrated variants, positioning the SoC above discrete microprocessor solutions and below ASSPs in the embedded-compute hierarchy: MPU -> embedded MPU -> SoC -> multiprocessor SoC. This makes the MC8641DVU1000GE ideal for designs that previously required two companion I/O bridge chips.
Key features include two e600 cores each issuing up to three instructions per cycle through a compact 7-stage pipeline, hardware virtualization support, 32 KB L1 instruction and data caches per core, a unified 1 MB backside L2 cache, integrated DDR1/DDR2 controller with ECC, four 10/100/1000 Mb/s Ethernet MACs, two x4 PCIe endpoints/RCs, two Serial RapidIO ports, and a Security Engine for accelerated cryptography. The e600 core's AltiVec unit performs 128-bit vector operations, making the SoC well suited to signal-processing workloads.
The architecture integrates the memory controller and I/O bridges directly onto the die, reducing board complexity and BOM versus discrete MPU+bridge designs. Voltage is 1.05 V core, with separate rails for I/O and DDR. Thermal envelope is 0 to 105 C junction. Part number suffix conventions: 'D' denotes dual-core, 'V' denotes the standard speed grade, 'U' denotes the FCBGA package, '1000' is the 1.0 GHz core frequency, 'G' indicates Pb-free, and 'E' is the extended temperature grade.
Typical applications include industrial routers and switches, defense/aerospace signal processing, telecom line cards, medical imaging, military/aerospace embedded compute, and high-end imaging. The dual GbE and dual SRIO ports specifically suit line-card and base-station designs where multiple deterministic fabrics are required.
When designing with the MC8641DVU1000GE, allocate generous PCB area for the 33 x 33 mm FCBGA, follow NXP layout guidelines for DDR2 trace matching, and provide adequate bulk decoupling near each power rail. Signal integrity on the SRIO and PCIe links requires controlled-impedance routing and length matching per the device reference manual.
This page consolidates distributor pricing, drop-in same-package alternatives, and practical design notes not found in a single datasheet chapter.
直接替換替代品，適用於 MC8641DVU1000GE — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MC8641DVU1000GE （相同外形與佔位） — 差異在於 Package, Ethernet, PCI Express, Operating Temperature, Core Architecture.
MC8641DTVU1000GE
✅ 直接替換聯絡詢價
查看資料表 →MC8641VU1000NE
✅ 直接替換聯絡詢價
查看資料表 →MC8641DHX1500KE
✅ 直接替換📋 參考替代品（不在目錄中）
MC8640DTVJ1250HE
✅ 直接替換聯絡詢價
查看資料表 →MC8641DVU1000GE 最大額定值與電氣特性
| Processor Type | PowerPC e600 MPC86xx 32-Bit |
| Core Count | 2 (dual-core) |
| Core Architecture | Power Architecture, superscalar, 7-stage pipeline |
| Core Frequency | 1.0 GHz |
| Maximum Core Frequency | Up to 1.5 GHz (family max) |
| Core Supply Voltage | 1.05 V |
| SIMD Engine | AltiVec (128-bit vector unit) |
| L1 Cache | 32 KB instruction + 32 KB data per core |
| L2 Cache | 1 MB unified backside |
| Memory Controller | DDR1 / DDR2 with ECC |
| Ethernet | 4 x 10/100/1000 Mbps MAC |
| PCI Express | 2 x PCIe interfaces |
| Serial RapidIO | 2 x SRIO ports |
| 封裝 | 1023-ball FCCBGA (33 x 33 mm) |
| 工作溫度 | 0 C to +105 C |
| Silicon Revision | Rev 3.0 |
MC8641DVU1000GE 1023-ball fccbga (33 x 33 mm) 腳位配置指南
MC8641DVU1000GE（1023-ball fccbga (33 x 33 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： MC8641DVU1000GE.
請參閱 資料表 以查看完整腳位配置。
典型應用
MC8641DVU1000GE 適用於 6 應用s: Industrial Routers and Switches, Telecom Line Cards and Base Stations, Defense and Aerospace Embedded Compute, Medical Imaging Systems, High-End Industrial Imaging and Machine Vision, Print and Imaging Controllers.
Industrial Routers and Switches
The MC8641DVU1000GE integrates four Gigabit Ethernet MACs alongside dual PCIe and dual Serial RapidIO, eliminating companion bridge chips and reducing BOM cost. At 1.0 GHz dual-core the SoC can run a full IP routing stack plus control-plane protocols concurrently with deterministic throughput on the SRIO fabric. The 0 to +105 C industrial temperature envelope and DDR2 ECC support suit fanless outdoor and industrial-cabinet installations.
推薦
Telecom Line Cards and Base Stations
The dual Serial RapidIO ports combined with dual PCIe and four GbE MACs match the fabric and backplane architecture of UMTS/LTE base-station line cards. The AltiVec SIMD unit accelerates PHY-layer DSP blocks, while the integrated Security Engine offloads encryption for backhaul links. The 1023-ball FCCBGA package enables dense line-card layouts where multiple SoCs share a single backplane fabric.
推薦
Defense and Aerospace Embedded Compute
The extended 0 to +105 C industrial temperature range, dual-core redundancy options, and ECC-protected DDR2 controller make the MC8641DVU1000GE suitable for ruggedized defense and aerospace compute subsystems. The AltiVec unit accelerates radar and EW signal-processing pipelines, while the integrated Security Engine enables secure boot and encrypted communications required by modern defense platforms.
推薦
Medical Imaging Systems
Dual 1.0 GHz e600 cores plus AltiVec SIMD deliver the parallel throughput needed for real-time CT, MRI, and ultrasound image reconstruction. DDR2 with ECC protects patient-data integrity, while fanless operation suits sterile medical environments. The four GbE MACs enable high-bandwidth network-attached imaging consoles and DICOM transfer to PACS servers.
推薦
High-End Industrial Imaging and Machine Vision
Dual GbE MACs paired with dual PCIe make the MC8641DVU1000GE well suited to multi-camera industrial vision systems where Camera Link, CoaXPress, or GigE Vision feeds must be processed and forwarded in real time. The AltiVec unit accelerates pixel-level processing pipelines, and the deterministic L2 cache latency supports deterministic vision-cycle timing for quality-control inspection lines.
推薦
Print and Imaging Controllers
High-end production print engines require deterministic real-time scheduling of multiple data streams while simultaneously running the controller firmware stack. The dual e600 cores provide separation between real-time print-pipeline control and management-plane software, and the integrated PCIe and GbE MACs interface directly to host networks and page-description-language accelerators.
推薦
推薦產品摘要
工程參考資料，適用於 MC8641DVU1000GE — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MC8641DTVU1000GE | MC8641VU1000NE | MC8641DHX1500KE | MC8640DTVJ1250HE |
|---|---|---|---|---|---|
| Package | 1023-ball FCCBGA (33 x 33 mm) | 1023-ball FCCBGA (33 x 33 mm) - same | 1023-ball FCCBGA family - same footprint | 1023-ball FCCBGA family - same footprint | 1023-ball FCCBGA family - same footprint |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Count | 2 (dual-core) | 2 (dual-core) | 1 (single-core) | 2 (dual-core) | 2 (dual-core) |
| Core Frequency | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.5 GHz | 1.25 GHz |
| Memory Controller | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC |
| Ethernet MACs | 4 x GbE | 4 x GbE | 4 x GbE | 4 x GbE | 4 x GbE |
| PCI Express / SRIO | 2 x PCIe + 2 x SRIO | 2 x PCIe + 2 x SRIO | 2 x PCIe + 2 x SRIO | 2 x PCIe + 2 x SRIO | 2 x PCIe + 2 x SRIO |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
主要差異化特點
- Drop-in dual-core variant with identical 1.0 GHz frequency (對比MC8641DTVU1000GE)
- Higher throughput per dollar in dual-core configuration (對比MC8641VU1000NE)
- Lower frequency, lower power envelope at same integration (對比MC8641DHX1500KE)
設計說明
The MC8641DVU1000GE is rated for a 0 to +105 C junction temperature envelope and integrates significant on-die logic including dual e600 cores, DDR controller, and multiple high-speed I/O PHYs. Designers must compute total power dissipation from the family reference manual power tables and verify that the system thermal resistance (theta-JA + heatsink) keeps junction temperature below 105 C under worst-case ambient. Forced airflow is typically required in dense line-card and base-station layouts.
The 1023-ball FCCBGA at 33 x 33 mm requires a multi-layer PCB (typically 8+ layers) with microvia stack-ups and matched-length DDR2 trace routing. Follow NXP's MPC8641D hardware design guidelines for trace impedance (50 ohm nominal for single-ended, 100 ohm differential for PCIe/SRIO), DDR2 VTT termination, and reference-voltage decoupling. Land pattern should be solder-mask-defined per the package drawing.
Route SRIO and PCIe differential pairs on inner stripline layers with continuous reference planes to maintain 100 ohm differential impedance and minimize crosstalk. Keep at least 4x dielectric spacing between aggressor and victim pairs. Length-match within the tolerance specified in the reference manual per lane. Place AC-coupling capacitors as close to the SoC balls as the breakout allows.
Avoid substituting the MC8641DVU1000GE with single-core variants (e.g., MC8641VU1000NE) in multi-threaded firmware without re-validating real-time scheduling. The dual-core D variants expose two private L1 caches and a shared L2; software partitioning assumptions break on single-core silicon. Also verify that the supply-rail sequencing in the reference manual is observed during power-up to avoid latch-up.
合規資訊
Pb-free per the 'G' suffix in the orderable part number. RoHS compliance per NXP product page. AEC-Q100 not applicable for this industrial/defense MPU grade.
