EP3SE260F1152I3N vs EP3SE260F1152I4N 对比

详细并排对比 EP3SE260F1152I3N 出自 Intel 和 EP3SE260F1152I4N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP3SE260F1152I3N EP3SE260F1152I3N - 255K Logic Elements Stratix III E FPGA | Intel

EP3SE260F1152I3N - 255K Logic Elements Stratix III E FPGA | Intel

EP3SE260F1152I3N ⚠ 最后一次采购
Intel
EP3SE260F1152I4N EP3SE260F1152I4N - Stratix III E FPGA, 255K LE, 1152-FCBGA | Intel

EP3SE260F1152I4N - Stratix III E FPGA, 255K LE, 1152-FCBGA | Intel

EP3SE260F1152I4N ⚠ 最后一次采购

规格对比

参数 EP3SE260F1152I3N EP3SE260F1152I4N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 最后采购期
库存状态 有库存 有库存
单价(USD) $3,360.00 $2,050.00
Series Stratix III E Stratix III E
Family Name Stratix III E —
Logic Elements / Cells 255000 —
Logic Array Blocks (LABs) 10200 10,200
Total RAM Bits 16672768 —
Number of I/Os 744 —
Number of Gates [DATA_NEEDED: number of gates] —
Core Voltage 0.9 V to 1.1 V selectable 0.86 V
工作温度 -40C to +100C (industrial) -40C to +100C (Industrial)
安装类型 Surface Mount Surface Mount
封装 / 外壳 1152-BBGA, FCBGA (FC-FBGA) —
Process Technology 65 nm CMOS TSMC 40 nm
Max Internal Frequency 500 MHz —
Supplier Temperature Grade Industrial —
RoHS 状态 [DATA_NEEDED: RoHS status] Compliant
MSL 等级 [DATA_NEEDED: MSL level] 3 (168 hours)
Logic Elements — 255,000
Embedded Memory (bits) — 16,672,768
Maximum User I/O — 744
DSP Blocks (18x18 multipliers) — 896
Transceivers — 48 (up to 8.5 Gbps)
封装 — 1152-ball FCBGA (35 mm x 35 mm)
Speed Grade — 4

数据手册与资源

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