EP3SE260F1152I3N vs EP3SE260F1152I4N Comparison

Detailed side-by-side comparison of EP3SE260F1152I3N by Intel and EP3SE260F1152I4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP3SE260F1152I3N EP3SE260F1152I3N - 255K Logic Elements Stratix III E FPGA | Intel

EP3SE260F1152I3N - 255K Logic Elements Stratix III E FPGA | Intel

EP3SE260F1152I3N ⚠ Last Time Buy
Intel
EP3SE260F1152I4N EP3SE260F1152I4N - Stratix III E FPGA, 255K LE, 1152-FCBGA | Intel

EP3SE260F1152I4N - Stratix III E FPGA, 255K LE, 1152-FCBGA | Intel

EP3SE260F1152I4N ⚠ Last Time Buy

Specification Comparison

Parameter EP3SE260F1152I3N EP3SE260F1152I4N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last_time_buy Last_time_buy
Stock Status In Stock In Stock
Unit Price (USD) $3,360.00 $2,050.00
Series Stratix III E Stratix III E
Family Name Stratix III E β€”
Logic Elements / Cells 255000 β€”
Logic Array Blocks (LABs) 10200 10,200
Total RAM Bits 16672768 β€”
Number of I/Os 744 β€”
Number of Gates [DATA_NEEDED: number of gates] β€”
Core Voltage 0.9 V to 1.1 V selectable 0.86 V
Operating Temperature -40C to +100C (industrial) -40C to +100C (Industrial)
Mounting Type Surface Mount Surface Mount
Package / Case 1152-BBGA, FCBGA (FC-FBGA) β€”
Process Technology 65 nm CMOS TSMC 40 nm
Max Internal Frequency 500 MHz β€”
Supplier Temperature Grade Industrial β€”
RoHS Status [DATA_NEEDED: RoHS status] Compliant
MSL Level [DATA_NEEDED: MSL level] 3 (168 hours)
Logic Elements β€” 255,000
Embedded Memory (bits) β€” 16,672,768
Maximum User I/O β€” 744
DSP Blocks (18x18 multipliers) β€” 896
Transceivers β€” 48 (up to 8.5 Gbps)
Package β€” 1152-ball FCBGA (35 mm x 35 mm)
Speed Grade β€” 4

Datasheets & Resources

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