EP3SE260F1152I3N vs EP3SE260F1152I4N Comparison
Detailed side-by-side comparison of EP3SE260F1152I3N by Intel and EP3SE260F1152I4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3SE260F1152I3N - 255K Logic Elements Stratix III E FPGA | Intel
EP3SE260F1152I3N ⚠ Last Time BuyIntel
EP3SE260F1152I4N - Stratix III E FPGA, 255K LE, 1152-FCBGA | Intel
EP3SE260F1152I4N ⚠ Last Time BuySpecification Comparison
| Parameter | EP3SE260F1152I3N | EP3SE260F1152I4N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last Time Buy | Last Time Buy |
| Series | Stratix III E | Stratix III E |
| Family Name | Stratix III E | — |
| Logic Elements / Cells | 255000 | — |
| Logic Array Blocks (LABs) | 10200 | 10,200 |
| Total RAM Bits | 16672768 | — |
| Number of I/Os | 744 | — |
| Number of Gates | [DATA_NEEDED: number of gates] | — |
| Core Voltage | 0.9 V to 1.1 V selectable | 0.86 V |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (Industrial) |
| Mounting Type | Surface Mount | Surface Mount |
| Package / Case | 1152-BBGA, FCBGA (FC-FBGA) | — |
| Process Technology | 65 nm CMOS | TSMC 40 nm |
| Max Internal Frequency | 500 MHz | — |
| Supplier Temperature Grade | Industrial | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant |
| MSL Level | [DATA_NEEDED: MSL level] | 3 (168 hours) |
| Logic Elements | — | 255,000 |
| Embedded Memory (bits) | — | 16,672,768 |
| Maximum User I/O | — | 744 |
| DSP Blocks (18x18 multipliers) | — | 896 |
| Transceivers | — | 48 (up to 8.5 Gbps) |
| Package | — | 1152-ball FCBGA (35 mm x 35 mm) |
| Speed Grade | — | 4 |