K4B4G1646E-BYK000 vs MT41K64M16TW-107 对比
详细并排对比 K4B4G1646E-BYK000 出自 Samsung Electronics 和 MT41K64M16TW-107 出自 Micron Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Micron Technology
MT41K64M16TW-107 - 1Gbit DDR3L SDRAM 1866MT/s | Micron Technology
MT41K64M16TW-107 ✓ 量产中规格对比
| 参数 | K4B4G1646E-BYK000 | MT41K64M16TW-107 |
|---|---|---|
| 品牌 | Samsung Electronics | Micron Technology |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $0.56 | $2.95 |
| 存储器类型 | DDR3L SDRAM | DDR3L SDRAM |
| 存储容量 | 4 Gbit | 1 Gbit |
| 存储组织 | 256M x 16 | 64M x 16 |
| Speed Grade | DDR3-1600 (1.25 ns clock cycle) | — |
| Clock Frequency | 800 MHz | 933 MHz |
| CAS Latency (CL) | [DATA_NEEDED: CAS latency - 1.25 ns CL grade indicates CL11 but not explicitly stated in provided data] | — |
| Supply Voltage (VDD) | 1.35 V (DDR3L), 1.5 V compatible (DDR3) | — |
| Number of Banks | [DATA_NEEDED: bank count] | — |
| Die Process | Samsung E-die | — |
| 封装 | 96-FBGA (BYK) | 96-FBGA (8 x 14 mm) |
| 安装类型 | Surface Mount | Surface Mount |
| 接口 | Parallel | Parallel |
| 工作温度 | [DATA_NEEDED: operating temperature range] | 0C to +95C |
| 特性 | Auto precharge, asynchronous reset, ZQ calibration, dynamic on-chip termination, data mask | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | Compliant (lead-free, halogen-free suffix J) |
| Access Time | 1.25 ns | 20 ns |
| 数据速率 | — | 1866 MT/s (DDR3-1866 speed grade -107) |
| 电源电压 | — | 1.35 V (1.283 V to 1.45 V) |
| Technology | — | CMOS DRAM |
| Refresh | — | Self refresh / auto refresh |
| Base Part Number | — | MT41K64M16 |
| Supply Voltage - DDR3 Compatible Mode | — | 1.5 V (refer to DDR3 datasheet specifications) |