5CSXFC6C6U23C6N - Cyclone V SX SoC FPGA, 110K LE, 925MHz | Intel
料号： 5CSXFC6C6U23C6N ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $412 | $412.00 |
| 10 | $388.5 | $3,885.00 |
| 100 | $355 | $35,500.00 |
| 500 | $318.75 | $159,375.00 |
| 1,000 | $285 | $285,000.00 |
5CSXFC6C6U23C6N 概述
A System-on-Chip (SoC) FPGA combines a hard processor subsystem with programmable logic on a single die, enabling deterministic hardware acceleration alongside a software runtime. The Cyclone V SX family sits inside Intel's broader programmable logic hierarchy: SoC FPGA -> FPGA -> Programmable Logic Device -> Semiconductor. The hard ARM Cortex-A9 dual core runs an OS or RTOS while the FPGA fabric implements custom datapath, signal processing, or interface glue logic, eliminating the need for a separate companion processor on the board.
Key features include 110K logic elements, embedded DSP blocks, embedded M10K and MLAB memory blocks, integrated transceivers supporting common serial protocols, hard memory controllers for DDR3, and a hard PCIe Gen2 endpoint. The part offers approximately 4,160 Kbits of embedded RAM and roughly 112 DSP blocks. Peripherals include EMAC, USB 2.0 OTG, NAND flash controller, SPI, UART, I2C, and GPIO routed through the HPS-to-FPGA bridge.
Typical applications include industrial machine vision, motor control, software-defined radio front ends, factory automation controllers, broadcast video processing, and automotive driver assistance prototypes. Designers choose this part when they need ARM Cortex-A9 software processing tightly coupled with parallel FPGA datapath on one die.
When designing with this device, pay close attention to UFBGA-672 PCB layout. The 23x23 mm package requires microvia or via-in-pad PCB technology for reliable BGA fanout. Use Intel's Quartus Prime design suite for synthesis, place-and-route, and HPS configuration. Plan for the 1.1 V core rail with adequate decoupling and thermal management under heavy DSP utilization.
This page synthesizes distributor pricing for 5CSXFC6C6U23C6N, drop-in same-package alternatives within the Cyclone V SX family, and practical design notes not consolidated in the Intel Cyclone V device datasheet alone.
直接替换替代料： 5CSXFC6C6U23C6N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 5CSXFC6C6U23C6N （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Logic Elements, Speed Grade, Process Technology.
快速对比工具——选择替代料号进行并排对比：
5CSXFC6C6U23A7N
✅ 直接替换✓ 有现货
$328.75 / 个
查看数据手册 →5CSXFC6C6U23C7N
✅ 直接替换✓ 有现货
$215.8 / 个
查看数据手册 →5CSXFC6C6U23C8N
✅ 直接替换✓ 有现货
$445 / 个
查看数据手册 →5CSXFC5C6U23C6N
✅ 直接替换✓ 有现货
$175 / 个
查看数据手册 →5CSXFC4C6U23C6N
✅ 直接替换✓ 有现货
$215.4 / 个
查看数据手册 →5CSXFC6C6U23C6N 最大额定值与电气特性
| Series | Cyclone V SX SoC FPGA |
| Family | Cyclone V SX |
| Logic Elements | 110,000 |
| Processor Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Fabric Frequency | 925 MHz |
| Process Technology | 28 nm low-power |
| Core Supply Voltage | 1.1 V |
| 封装 | 672-UBGA (UFBGA) 23x23 mm |
| 安装类型 | Surface Mount (BGA) |
| 工作温度 | 0 C to +85 C (commercial) |
| Number of I/O | 145 (per JAK Electronics comparison) |
| Embedded Memory | approximately 4,160 Kbits |
| DSP Blocks | approximately 112 |
| RoHS 状态 | Compliant |
| MSL 等级 | 3 (per typical BGA handling) |
5CSXFC6C6U23C6N 672-ubga (ufbga) 23x23 mm 引脚配置指南
5CSXFC6C6U23C6N（672-ubga (ufbga) 23x23 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 5CSXFC6C6U23C6N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
5CSXFC6C6U23C6N 适用于 6 应用s: Industrial Machine Vision, Motor Control and Industrial Drives, Software Defined Radio Front End, Factory Automation Controllers, Broadcast Video Processing, Automotive ADAS Prototyping.
Industrial Machine Vision
The 5CSXFC6C6U23C6N fits industrial machine vision because the Dual ARM Cortex-A9 HPS runs the vision stack (OpenCV, Linux, image acquisition) while the 110K LE FPGA fabric implements parallel pixel pipelines, Bayer demosaicing, and object detection at line rate. The integrated HPS-FPGA AXI bridges deliver 128-bit data paths between the ARM cores and custom datapath, eliminating external processor-to-FPGA interconnect. The 672-UBGA package exposes sufficient GPIO and high-speed transceiver lanes to drive dual Camera Link or MIPI CSI-2 cameras simultaneously. Industrial temperature operation and the 28 nm low-power process suit 24/7 factory deployments.
推荐
Motor Control and Industrial Drives
The 5CSXFC6C6U23C6N is well matched to industrial motor control because the FPGA fabric executes field-oriented control (FOC), PWM generation, and encoder feedback at sub-microsecond latency, while the ARM Cortex-A9 HPS runs the higher-level motion profiler and EtherCAT/MODBUS stack. The approximately 112 DSP blocks provide ample multiply-accumulate throughput for the current-loop math, and the on-chip DDR3 controller streams parameter tables without external memory contention. The wide 145-I/O budget in UFBGA-672 supports three-phase inverter feedback and resolver excitation simultaneously.
推荐
Software Defined Radio Front End
The 5CSXFC6C6U23C6N supports software defined radio front ends because the FPGA fabric implements DDC/DUC, channelization filters, and digital predistortion at baseband sample rates, offloading the ARM Cortex-A9 HPS to handle network protocols and control plane. The Cyclone V SX fabric runs approximately 925 MHz internal performance, suitable for LTE and tactical radio baseband. Hard transceivers on the device family provide the SerDes lanes needed for ADC/DAC interfacing, while the HPS runs Linux for waveform configuration. Lower static power than Arria/Cyclone 10 GX parts makes it attractive for portable SDR.
推荐
Factory Automation Controllers
The 5CSXFC6C6U23C6N suits factory automation controllers because the dual ARM Cortex-A9 MPCore runs a deterministic RTOS or LinuxCNC for PLC logic and HMI, while the FPGA fabric implements deterministic EtherCAT, PROFINET, or EtherNet/IP slave nodes with hardware-cycle timing. The hard Ethernet MACs in the HPS simplify integration with industrial Ethernet stacks, and the abundant GPIO through the 672-UBGA package supports parallel field-bus signaling. The 28 nm low-power process reduces thermal load in sealed control cabinets, and the 110K LEs provide headroom for custom protocol extensions.
推荐
Broadcast Video Processing
The 5CSXFC6C6U23C6N handles broadcast video processing because the FPGA fabric implements SDI/HDMI bridging, color space conversion, and audio embedding at full 1080p60 rates without CPU intervention, while the ARM HPS handles control plane and metadata insertion. The DDR3 hard controller streams uncompressed video frames between FPGA logic and ARM memory, and the 4,160 Kbits embedded RAM provides line buffers for cross-conversion. The wide UFBGA-672 footprint exposes sufficient high-speed LVDS pairs for multi-channel SDI at 3 Gbps.
推荐
Automotive ADAS Prototyping
The 5CSXFC6C6U23C6N enables automotive ADAS prototyping because the dual ARM Cortex-A9 HPS runs sensor fusion and obstacle classification algorithms while the FPGA fabric implements low-latency radar FFT, lidar point-cloud clustering, and camera pre-processing. The Cyclone V SX architecture supports multiple sensor data streams in parallel, and the HPS-FPGA AXI fabric provides deterministic latency for safety-critical paths. Note that for production automotive designs, the Cyclone V automotive grade variant (typically designated by an A-speed grade or specific ordering code) is recommended over the commercial 5CSXFC6C6U23C6N.
推荐
推荐产品汇总
工程参考数据： 5CSXFC6C6U23C6N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 5CSXFC6C6U23A7N | 5CSXFC6C6U23C7N | 5CSXFC6C6U23C8N | 5CSXFC5C6U23C6N | 5CSXFC4C6U23C6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-UBGA (UFBGA) 23x23 mm | 672-UBGA (UFBGA) 23x23 mm - same | 672-UBGA (UFBGA) 23x23 mm - same | 672-UBGA (UFBGA) 23x23 mm - same | 672-UBGA (UFBGA) 23x23 mm - same | 672-UBGA (UFBGA) 23x23 mm - same |
| Family | Cyclone V SX | Cyclone V SX | Cyclone V SX | Cyclone V SX | Cyclone V SX | Cyclone V SX |
| Logic Elements | 110,000 | 110,000 | 110,000 | 110,000 | 85,000 (-23%) | 49,000 (-55%) |
| Processor Core | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Speed/Temperature Grade | C6 (commercial) | A7 (automotive/industrial) | C7 (commercial, faster) | C8 (commercial, fastest) | C6 (commercial) | C6 (commercial) |
| Maximum Fabric Frequency | 925 MHz | 925 MHz | 925 MHz | 925 MHz | 925 MHz | 925 MHz |
关键差异点
- Highest density SX SoC option at the C6 speed grade in the same UFBGA-672 footprint （对比 5CSXFC5C6U23C6N)
- Industrial/automotive temperature drop-in available in identical footprint （对比 5CSXFC6C6U23A7N)
- Cyclone V SX sub-family provides higher DSP count than SE alternatives （对比 5CSEBA6U23I7N)
设计说明
The 672-UBGA 23x23 mm package uses a 1.0 mm ball pitch, which requires microvia or via-in-pad PCB technology for reliable breakout. Use at least a 4-2-4 stacked-via construction with 0.4 mm laser-drilled microvias, and ensure the BGA land pads meet IPC-7095 nominal-diameter specifications. Plan for at least 6 PCB layers to route out 145 user I/O plus DDR3, transceivers, and clock signals without excessive via stubs. Decoupling must follow the Intel Cyclone V pin connection guidelines with bulk 220 uF polymer caps near each GPIO bank supply pin.
Estimated: at heavy DSP utilization consuming the full 110K LE fabric at approximately 85% toggle rate with all 112 DSP blocks active, the 5CSXFC6C6U23C6N dissipates approximately 3-5 W. With the UFBGA-672 theta-JA typically around 15-20 C/W on a JEDEC JESD51 4-layer test board, junction temperature rises 45-100 C above ambient. For closed-enclosure industrial designs, evaluate thermal performance in-system with thermocouples on the package top. Consider attaching a heatsink or thermal pad to the package top side if ambient temperature exceeds 60 C.
Three common pitfalls when designing with the 5CSXFC6C6U23C6N: (1) Forgetting to instantiate the HPS first-stage bootloader (preloader) before Linux boots - the HPS cannot boot without valid preloader code in QSPI or SD card. (2) Mixing 1.1 V core and 1.2 V transceiver supplies without proper sequencing - the Cyclone V datasheet mandates power-on sequence with the HPS core rail stable before FPGA fabric enters user mode. (3) Routing DDR3 signals without matching the 50 ohm impedance and length-matching per the Cyclone V external memory interface guidelines - failures here are notoriously hard to debug post-tapeout.
合规信息
RoHS compliance per DigiKey product listing. C6 grade is commercial temperature; for AEC-Q100 automotive applications, choose the automotive-grade ordering variant or 5CSXFC6C6U23A7N for extended industrial/automotive temperature.
