5CSXFC6C6U23I7LN - Cyclone V SX SoC FPGA 110K LE | Altera
料号： 5CSXFC6C6U23I7LN ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $180.24 | $180.24 |
| 10 | $162.21 | $1,622.10 |
| 100 | $144.19 | $14,419.00 |
| 500 | $130.67 | $65,335.00 |
| 1,000 | $119.55 | $119,550.00 |
5CSXFC6C6U23I7LN 概述
A System-on-Chip FPGA is a single silicon device that combines a general-purpose microprocessor subsystem with a programmable FPGA fabric, allowing hardware accelerators and I/O peripherals to be customized while the processor runs application software. In the broader taxonomy, an SoC FPGA sits between pure FPGAs (logic only) and Application Processors (software only), offering the best of both: deterministic hardware parallelism plus the flexibility of an ARM Cortex-A9 Linux-capable host. Cyclone V SX devices are positioned in the low-power segment of Intel's FPGA portfolio, targeting applications that need a balance of functionality, flexibility, and power efficiency.
Key features of the 5CSXFC6C6U23I7LN include 110K logic elements, 5,140 Kbits of embedded memory, variable-precision DSP blocks supporting 18x18 and 27x27 multipliers, integrated transceivers, and the dual-core ARM Cortex-A9 MPCore HPS with NEON media engine, single/double-precision FPU, and CoreSight debug. The 672-pin UBGA package exposes the full HPS peripheral set (USB, GbE, SD/SDIO/MMC, UART, SPI, I2C) plus FPGA I/O banks supporting LVDS, LVCMOS, SSTL, and memory interfaces such as DDR3, DDR2, and LPDDR2.
The architecture pairs the HPS subsystem with the FPGA logic through high-bandwidth AXI/ARM AMBA bridges, allowing peripherals to be placed in either domain. This lets designers offload latency-critical or parallel DSP functions to the FPGA while the HPS runs an operating system, simplifying PCB design by eliminating a separate processor chip.
Typical applications include industrial motor control, factory automation controllers, software-defined radio, medical imaging, broadcast video processing, and automotive ADAS prototyping. The Cyclone V SX SoC FPGA is well suited for designs that need a Linux-capable host CPU with deterministic FPGA acceleration in a single 28 nm low-power device.
When designing with the 5CSXFC6C6U23I7LN, ensure the 672-pin UBGA PCB footprint matches the 23x23 mm land pattern and that the multi-rail power supply (typically 0.85V/1.1V/1.5V/1.8V/2.5V/3.3V) follows the Intel Cyclone V power design guidelines. The HPS boot configuration (NAND/NOR/SD/eMMC) and pin multiplexing must be set up in the Quartus Prime Platform Designer before bitstream generation.
This page consolidates distributor stock, datasheet links, and drop-in alternative guidance drawn from Intel's Cyclone V device datasheet and live distributor listings, providing information not present in any single source.
直接替换替代料： 5CSXFC6C6U23I7LN ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 5CSXFC6C6U23I7LN （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, DSP Blocks, Logic Elements, Process Technology.
快速对比工具——选择替代料号进行并排对比：
5CSXFC6C6U23I7N
✅ 直接替换✓ 有现货
$92.1 / 个
查看数据手册 →5CSXFC6C6U23C8N
✅ 直接替换✓ 有现货
$445 / 个
查看数据手册 →5CSXFC6C6U23C7N
✅ 直接替换✓ 有现货
$215.8 / 个
查看数据手册 →5CSXFC6C6U23C6N
✅ 直接替换✓ 有现货
$285 / 个
查看数据手册 →5CSXFC6C6U23A7N
✅ 直接替换✓ 有现货
$328.75 / 个
查看数据手册 →5CSXFC6C6U23C8NES
✅ 直接替换✓ 有现货
$195 / 个
查看数据手册 →5CSXFC6C6U23I7LN 最大额定值与电气特性
| Family | Cyclone V SX SoC FPGA |
| Device Variant | 5CSXFC6C6U23 |
| Logic Elements | 110K |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum HPS Clock Frequency | 925 MHz |
| 封装 | 672-UBGA (23x23 mm) |
| 工作温度 | -40C to +100C (Industrial) |
| Process Technology | 28 nm low-power |
| DSP Blocks | Variable-precision, supports 18x18 and 27x27 multipliers |
| Transceivers | Integrated high-speed transceivers |
| HPS Peripherals | USB, GbE, SD/SDIO/MMC, UART, SPI, I2C |
| Memory Interfaces | DDR3, DDR2, LPDDR2 |
| I/O Standards | LVDS, LVCMOS, SSTL |
| Configuration | HPS boot from NAND/NOR/SD/eMMC; FPGA via Quartus Prime |
| RoHS 状态 | Compliant |
| 安装类型 | Surface Mount (BGA) |
5CSXFC6C6U23I7LN 672-ubga (23x23 mm) 引脚配置指南
5CSXFC6C6U23I7LN（672-ubga (23x23 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 5CSXFC6C6U23I7LN.
请参阅 数据手册 以查看完整引脚配置。
典型应用
5CSXFC6C6U23I7LN 适用于 6 应用s: Industrial Motor Control, Software Defined Radio (SDR), Medical Imaging Systems, Broadcast Video Processing, Automotive ADAS Prototyping, Factory Automation Controllers.
Industrial Motor Control
The 5CSXFC6C6U23I7LN fits industrial motor control designs because its 110K logic elements, variable-precision DSP blocks, and dual-core ARM Cortex-A9 HPS deliver deterministic FPGA acceleration for field-oriented control (FOC) and space-vector PWM while the HPS runs a real-time Linux or RTOS supervisory layer. The 925 MHz ARM cores handle communication stacks (EtherCAT, PROFINET, CAN) and the FPGA fabric runs encoder decode (EnDat, BISS, SSI) at hardware speeds. The -I7 industrial temperature grade (-40C to 100C) supports factory-floor enclosures, and the 672-UBGA package integrates transceivers for industrial Ethernet. Designers can prototype with the Cyclone V SoC Development Kit and migrate to production PCB.
推荐
Software Defined Radio (SDR)
The 5CSXFC6C6U23I7LN is well matched to SDR baseband processing because its 110K logic elements, variable-precision DSP blocks, and integrated transceivers deliver the GSample/s rates needed for digital up/down conversion, channelization, and modulation/demodulation. The dual-core ARM Cortex-A9 HPS runs the waveform application stack (GNURadio, srsLTE) while the FPGA fabric handles latency-critical DSP. The 28 nm low-power process keeps SDR boards thermally manageable even at full fabric utilization. The 672-UBGA package is the same as used in production SDR reference designs, simplifying board bring-up.
推荐
Medical Imaging Systems
The 5CSXFC6C6U23I7LN supports medical imaging (ultrasound, endoscopy, CT) by combining 110K logic elements for high-speed image pipeline processing with the dual-core ARM Cortex-A9 HPS for control plane, DICOM stack, and display composition. The FPGA fabric executes beamforming, FFT, and pixel interpolation at deterministic latency, while the HPS handles user interface and network connectivity. The -I7 industrial temperature grade meets hospital equipment requirements. The 672-UBGA package integrates transceivers for high-speed analog front-end digitizer links, reducing the BOM cost versus a discrete FPGA + processor approach.
推荐
Broadcast Video Processing
The 5CSXFC6C6U23I7LN suits broadcast video processing because its 110K logic elements and integrated transceivers support SDI I/O (3G-SDI, 6G-SDI, 12G-SDI) at full rate, while the dual-core ARM Cortex-A9 HPS runs video stack and ancillary data. The 28 nm low-power process keeps 4K/8K routing and multiviewer designs thermally manageable. The -I7 industrial temperature grade supports outdoor broadcast equipment. The 672-UBGA package provides the high I/O count required for multi-channel SDI plus Ethernet control.
推荐
Automotive ADAS Prototyping
The 5CSXFC6C6U23I7LN is a strong prototype platform for automotive ADAS because its 110K logic elements, dual-core ARM Cortex-A9 HPS, and integrated transceivers can run sensor fusion (camera, radar, LiDAR) at sample rates matching production silicon. The HPS executes the AUTOSAR-class application stack while the FPGA fabric handles low-latency perception. For production deployment, the AEC-Q100-qualified 5CSXFC6C6U23A7N (same 672-UBGA package) is the recommended migration path, since the standard -I7LN is qualified only to industrial standards. The 672-UBGA package integrates multiple high-speed sensor interfaces.
推荐
Factory Automation Controllers
The 5CSXFC6C6U23I7LN fits factory automation controllers (PLCs, PACs, machine vision) because its 110K logic elements can run EtherCAT, PROFINET, and EtherNet/IP slave stacks in hardware while the dual-core ARM Cortex-A9 HPS executes the IEC 61131-3 application logic and HMI. The 925 MHz ARM cores handle web server, OPC-UA, and MQTT connectivity, and the FPGA fabric accelerates machine vision preprocessing at line rate. The -I7 industrial temperature grade meets IEC 61131-2 industrial environmental specs. The 672-UBGA package provides ample I/O for multi-protocol industrial Ethernet plus legacy fieldbus.
推荐
推荐产品汇总
工程参考数据： 5CSXFC6C6U23I7LN ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 5CSXFC6C6U23I7N | 5CSXFC6C6U23C8N | 5CSXFC6C6U23C7N | 5CSXFC6C6U23C6N | 5CSXFC6C6U23A7N | 5CSXFC6C6U23C8NES |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 672-UBGA (23x23) | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same |
| Speed Grade | -I7 (industrial, 7 grade) | -I7 (industrial) | -C8 (commercial, slower) | -C7 (commercial) | -C6 (commercial, slowest) | -A7 (automotive) | -C8 (commercial) |
| Temperature Range | -40C to +100C (Industrial) | -40C to +100C | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +125C (automotive) | 0C to +85C |
| Logic Elements | 110K | 110K | 110K | 110K | 110K | 110K | 110K |
| HPS Frequency | 925 MHz | 925 MHz | 925 MHz | 925 MHz | 925 MHz | 925 MHz | 925 MHz |
| AEC-Q100 Qualified | No (Industrial only) | No | No | No | No | Yes | No |
| Lead-Free Finish | Yes (LN suffix) | Yes (standard finish) | Yes | Yes | Yes | Yes | Yes (RoHS) |
关键差异点
- Industrial temperature grade at -7 fabric speed （对比 5CSXFC6C6U23C8N)
- Lead-free finish (LN suffix) for RoHS markets （对比 5CSXFC6C6U23I7N (no LN suffix))
- Highest 110K LE density in the SX SoC family （对比 5CSXFC5C6U23I7N)
设计说明
The 672-UBGA package uses 0.8 mm ball pitch and requires a 23x23 mm PCB land pattern with via-in-pad or dog-bone fanout. Use a minimum 4-layer stackup with dedicated GND and 0.85V/1.1V/2.5V/3.3V power planes; place bulk decoupling (10uF ceramic per rail) within 5 mm of the BGA balls and high-frequency 0.1uF + 1nF capacitors adjacent to each power ball group. The Cyclone V device datasheet pin tables list per-bank power rail requirements, and Quartus Prime Early Power Estimator must be run before final stackup commit.
Estimated: at full HPS utilization (925 MHz dual core) plus 80% FPGA fabric utilization, the 5CSXFC6C6U23I7LN dissipates approximately 5-8 W depending on toggle rate. The 672-UBGA package has theta_JB of approximately 4 C/W per Altera thermal models; without airflow, junction-to-ambient thermal resistance reaches 15-20 C/W depending on PCB copper. For sustained >5 W operation, attach a heatsink via thermal interface material to the package top, or use a 4 oz copper innerlayer with thermal via array under the BGA thermal balls.
The HPS boot configuration must be set up in Quartus Prime Platform Designer before bitstream generation - failing to lock pin mux assignments (NAND/NOR/SD/eMMC, USB PHY modes, Ethernet PHY interface) results in HPS boot failure that mimics silicon damage. The 5CSXFC6C6U23I7LN requires separate power sequencing: 3.3V must ramp before 2.5V, which must ramp before 1.1V, which must ramp before 0.85V - a violation triggers inrush currents that can collapse the HPS core supply. Use the Altera Enpirion power solution reference designs to avoid sequencing violations.
合规信息
RoHS compliant per Altera product page (LN suffix indicates lead-free finish). Not AEC-Q100 qualified - for automotive production, use the 5CSXFC6C6U23A7N which carries AEC-Q100. Halogen-free status not stated in the verified data.