5CSXFC4C6U23C6N - Cyclone V SX SoC FPGA 40K LE | Intel
MPN: 5CSXFC4C6U23C6N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $265.5 | $2,655.00 |
| 100 | $242 | $24,200.00 |
| 250 | $228.75 | $57,187.50 |
| 500 | $215.4 | $107,700.00 |
Drop-in alternatives for 5CSXFC4C6U23C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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5CSXFC4C6U23A7N
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View Datasheet →5CSXFC2C6U23I7N
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View Datasheet →5CSXFC4C6U23A7N
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View Datasheet →5CSXFC2C6U23I7LN
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View Datasheet →5CSXFC4C6U23C6N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SX |
| Series | Cyclone V SoC FPGA |
| Device Type | System On Chip (SoC) FPGA |
| Architecture | MCU, FPGA (HPS + Logic) |
| Logic Elements | 40,000 |
| Maximum User I/O | 224 |
| Processor Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Frequency | 925 MHz |
| Process Technology | 28 nm TSMC low-power |
| Core Voltage | 1.1 V |
| Package | 672-UBGA (UFBGA) 23x23 mm |
| Mounting Type | Surface Mount (BGA) |
| Speed Grade | C6 (commercial, -6) |
| Operating Temperature | 0C to +85C (commercial) |
| Packaging | Tray |
| RoHS Status | Compliant |
5CSXFC4C6U23C6N 672-ubga (ufbga) 23x23 mm Pin Configuration Guide
Complete pinout information for 5CSXFC4C6U23C6N (672-ubga (ufbga) 23x23 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSXFC4C6U23C6N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSXFC4C6U23C6N is suitable for 6 applications: Industrial Machine Vision Systems, Motor Control and Servo Drives, Software-Defined Radio Front Ends, Factory Automation PLCs, Smart Energy and Grid Gateways, Medical Imaging and Diagnostics.
Industrial Machine Vision Systems
The 5CSXFC4C6U23C6N suits industrial machine vision because its 40K logic elements provide ample fabric for image preprocessing pipelines (Sobel filters, color space conversion, Bayer demosaic) while the dual ARM Cortex-A9 HPS at 925 MHz handles Linux-based object detection and communication. The 672-UBGA package exposes up to 224 user I/Os, sufficient for parallel image sensor interfaces (LVDS, sub-LVDS, MIPI CSI-2 with bridge). The 28 nm low-power process keeps thermal dissipation manageable in sealed factory enclosures. Compared to discrete CPU + FPGA solutions, the integrated HPS reduces latency between preprocessing and decision logic via the FPGA-to-HPS bridge, critical for real-time reject loops on production lines.
Recommended
Motor Control and Servo Drives
The 5CSXFC4C6U23C6N integrates ARM Cortex-A9 cores with FPGA fabric, ideal for high-performance motor control where FPGA handles PWM generation, encoder feedback decoding, and field-oriented control (FOC) at sub-microsecond loop times while the HPS runs the velocity/torque control loops and EtherCAT or CANopen stack. The 40K logic elements accommodate multi-axis servo controllers with hardware-accelerated Park/Clarke transforms. Industrial temperature variants in the same package (5CSXFC2C6U23I7N) extend operating range to -40C to +100C for factory-floor deployment. The C6 speed grade provides deterministic timing closure for safety-critical motion control.
Recommended
Software-Defined Radio Front Ends
The 5CSXFC4C6U23C6N serves SDR applications where the FPGA fabric implements DDC/DUC, channelization filters, and modulation/demodulation while the dual Cortex-A9 HPS handles protocol stacks, network interfaces, and spectrum management software. With 40K logic elements, the device supports multi-channel narrowband receivers or single-channel wideband processing. The 27x27 DSP blocks enable efficient FFT-based spectrum analysis, and the M10K memory blocks buffer ADC samples at high throughput. The C6 speed grade ensures timing closure at high DSP utilization, and external DDR3 controllers provide the bandwidth needed for wideband capture.
Recommended
Factory Automation PLCs
The 5CSXFC4C6U23C6N powers programmable logic controllers (PLCs) where the dual ARM Cortex-A9 HPS runs the IEC 61131-3 runtime and Modbus/Profinet/EtherNet/IP stacks while FPGA fabric implements deterministic I/O scanning at microsecond resolution. The 224 user I/Os support direct connection to digital and analog field wiring, while the C6 speed grade ensures deterministic cycle times for high-speed counter and PWM outputs. The 28 nm process reduces power compared to Cyclone IV predecessors, important for DIN-rail mounted controllers in control cabinets with limited airflow.
Recommended
Smart Energy and Grid Gateways
The 5CSXFC4C6U23C6N fits smart-grid gateways where the HPS runs Linux with secure communication stacks (TLS, IEC 61850, DNP3) and the FPGA fabric accelerates cryptographic operations (AES, SHA, ECC) for grid authentication. The 40K logic elements accommodate hardware-accelerated metering algorithms, while the 224 I/Os interface with current/voltage sensors and communication PHYs (RS-485, Ethernet, cellular modems). The Cortex-A9 NEON engine accelerates signal processing for power quality monitoring. The 672-UBGA industrial-rated package withstands substation temperature swings.
Recommended
Medical Imaging and Diagnostics
The 5CSXFC4C6U23C6N supports medical imaging modalities (ultrasound front-end processing, endoscopy image pipelines, patient monitoring aggregation) where the dual Cortex-A9 HPS provides secure OS isolation while the FPGA fabric implements real-time beamforming, image reconstruction, or DSP filter chains. The 40K logic elements and DSP blocks deliver the throughput needed for mid-tier ultrasound systems, while DDR3 controllers handle raw RF data buffering. The HPS supports IEC 62304-compliant software architectures with the FPGA providing deterministic hardware isolation for safety-critical paths. The integrated SoC architecture reduces BOM compared to separate MCU + FPGA designs.
Recommended
Recommended Products Summary
Engineering reference data for 5CSXFC4C6U23C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSXFC4C6U23A7N | 5CSXFC2C6U23C6N | 5CSXFC2C6U23C7N | 5CSXFC2C6U23I7N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 672-UBGA 23x23 mm | 672-UBGA 23x23 mm - same | 672-UBGA 23x23 mm - same | 672-UBGA 23x23 mm - same | 672-UBGA 23x23 mm - same |
| Logic Elements | 40,000 | 40,000 | ~25,000-30,000 | ~25,000-30,000 | ~25,000-30,000 |
| HPS Frequency | 925 MHz | 925 MHz | 925 MHz | 925 MHz | 925 MHz |
| Speed Grade | C6 (-6 commercial) | A7 (-7, slower) | C6 (-6) | C7 (-7, slower) | I7 (-7 industrial) |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Industrial (-40C to +100C) |
| Transceivers | [DATA_NEEDED: per SX variant] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Approx. Unit Price (USD) | 285.00 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Process Technology | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm |
Key Differentiators
- Higher logic density (40K LE) in same 672-UBGA footprint vs SX C2 density parts (vs 5CSXFC2C6U23C6N)
- C6 speed grade provides tighter timing margin over A7/C7 variants (vs 5CSXFC4C6U23A7N)
- Industrial temperature variant available in same package for harsh environments (vs 5CSXFC2C6U23I7N)
Design Notes
The Cyclone V SX 5CSXFC4C6U23C6N requires multiple supply rails: 1.1 V core, 2.5 V/3.3 V I/O banks, dedicated HPS PLL supplies, and DDR PHY supplies. Sequence HPS power rails before FPGA fabric supplies to prevent latch-up. Use Intel's Cyclone V PowerPlay Early Power Estimator (EPE) spreadsheet to estimate worst-case power before committing to PCB thermal design. Decoupling requires 0.1 uF X7R capacitors within 100 mil of every VCC pin and bulk 220 uF polymer tantalum at the regulator outputs.
Estimated: at full HPS utilization (both Cortex-A9 cores at 925 MHz) plus 70% logic utilization with toggle activity at 12.5%, total power reaches ~3-4 W. The 672-UBGA package's exposed die paddle (EDP) must be soldered to a 6x6 thermal via array (0.3 mm drill, 1.0 mm pitch) to a 4-layer PCB inner copper plane. Without adequate thermal vias, junction temperature can exceed 100C and trigger thermal throttling. Industrial applications should select the I7 temperature-grade 5CSXFC2C6U23I7N instead.
The 672-UBGA at 23x23 mm uses a 1.0 mm ball pitch, requiring 0.4 mm laser-drilled microvias for BGA breakout. Maintain 50 ohm controlled impedance on HPS DDR3 traces (length-matched within 25 mil across byte lanes) and 90 ohm differential on LVDS pairs. Use the Intel Cyclone V SX board design guidelines (AN 754) as a checklist; signal integrity issues on HPS-FPGA bridge interfaces (AXI) are common failure points.
Common pitfalls: (1) forgetting to instantiate the HPS peripheral pin multiplexing in Platform Designer/QSYS, leading to non-functional boot; (2) selecting wrong boot mode (MSEL pins) for NAND/SD/eMMC boot, causing the HPS to not boot from FPGA fabric configuration; (3) underestimating configuration time during cold-boot design. Always validate boot sequence on actual hardware before committing to final PCB layout.
Compliance Information
RoHS and REACH compliance per Intel/Altera product declarations. Not AEC-Q100 qualified (industrial-grade SoC FPGA, not automotive). Lead-free reflow per JEDEC J-STD-020.
