5CSXFC6C6U23I7LN - Cyclone V SX SoC FPGA 110K LE | Altera 5CSXFC6C6U23I7LN von Altera - elektronisches Bauteil
Altera

5CSXFC6C6U23I7LN - Cyclone V SX SoC FPGA 110K LE | Altera

Teilenummer: 5CSXFC6C6U23I7LN ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
LVDS, LVCMOS, SSTL Rds(on) 672-UBGA (23x23 mm) Package 925 MHz Speed DDR3, DDR2, LPDDR2 Memory
Ab $119.55 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-09-05
Mengenpreise
Menge Stückpreis Gesamt
1 $180.24 $180,24
10 $162.21 $1.622,10
100 $144.19 $14.419,00
500 $130.67 $65.335,00
1.000 $119.55 $119.550,00
ℹ️ Alle Preise sind in USD
Datenblatt anzeigen (PDF) Alternativen ansehen

5CSXFC6C6U23I7LN Übersicht

The Altera (Intel) 5CSXFC6C6U23I7LN is a Cyclone V SX System-on-Chip FPGA integrating 110K logic elements with a dual-core ARM Cortex-A9 MPCore hard processor system (HPS) and CoreSight debug fabric, housed in a 672-pin UBGA package measuring 23x23 mm with industrial -40C to 100C temperature grade. The device combines a low-power FPGA fabric built on TSMC's 28 nm process with the HPS subsystem, achieving up to 925 MHz ARM core frequency and configurable FPGA performance that suits cost-sensitive embedded applications.

A System-on-Chip FPGA is a single silicon device that combines a general-purpose microprocessor subsystem with a programmable FPGA fabric, allowing hardware accelerators and I/O peripherals to be customized while the processor runs application software. In the broader taxonomy, an SoC FPGA sits between pure FPGAs (logic only) and Application Processors (software only), offering the best of both: deterministic hardware parallelism plus the flexibility of an ARM Cortex-A9 Linux-capable host. Cyclone V SX devices are positioned in the low-power segment of Intel's FPGA portfolio, targeting applications that need a balance of functionality, flexibility, and power efficiency.

Key features of the 5CSXFC6C6U23I7LN include 110K logic elements, 5,140 Kbits of embedded memory, variable-precision DSP blocks supporting 18x18 and 27x27 multipliers, integrated transceivers, and the dual-core ARM Cortex-A9 MPCore HPS with NEON media engine, single/double-precision FPU, and CoreSight debug. The 672-pin UBGA package exposes the full HPS peripheral set (USB, GbE, SD/SDIO/MMC, UART, SPI, I2C) plus FPGA I/O banks supporting LVDS, LVCMOS, SSTL, and memory interfaces such as DDR3, DDR2, and LPDDR2.

The architecture pairs the HPS subsystem with the FPGA logic through high-bandwidth AXI/ARM AMBA bridges, allowing peripherals to be placed in either domain. This lets designers offload latency-critical or parallel DSP functions to the FPGA while the HPS runs an operating system, simplifying PCB design by eliminating a separate processor chip.

Typical applications include industrial motor control, factory automation controllers, software-defined radio, medical imaging, broadcast video processing, and automotive ADAS prototyping. The Cyclone V SX SoC FPGA is well suited for designs that need a Linux-capable host CPU with deterministic FPGA acceleration in a single 28 nm low-power device.

When designing with the 5CSXFC6C6U23I7LN, ensure the 672-pin UBGA PCB footprint matches the 23x23 mm land pattern and that the multi-rail power supply (typically 0.85V/1.1V/1.5V/1.8V/2.5V/3.3V) follows the Intel Cyclone V power design guidelines. The HPS boot configuration (NAND/NOR/SD/eMMC) and pin multiplexing must be set up in the Quartus Prime Platform Designer before bitstream generation.

This page consolidates distributor stock, datasheet links, and drop-in alternative guidance drawn from Intel's Cyclone V device datasheet and live distributor listings, providing information not present in any single source.

Drop-in-Alternativen für 5CSXFC6C6U23I7LN – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit 5CSXFC6C6U23I7LN (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, DSP Blocks, Logic Elements, Process Technology.

Intel
Operating Temperature: -40C to +100C (industrial, I7)
DSP Blocks: 224 (18x19 variable-precision multipliers)
Logic Elements: 85 K
Vergleichen mit 5CSXFC6C6U23I7LN →
Intel
Package: 672-pin UBGAFBGA (23 x 23 mm)
Operating Temperature: Automotive grade (per part number decode A)
Logic Elements: 110,000
Vergleichen mit 5CSXFC6C6U23I7LN →
Intel
Package: 672-UBGA (UFBGA) 23x23 mm
Operating Temperature: 0 C to +85 C (commercial)
DSP Blocks: approximately 112
Vergleichen mit 5CSXFC6C6U23I7LN →
Intel
Operating Temperature: 0C to 85C (commercial)
Logic Elements: 110,000
Vergleichen mit 5CSXFC6C6U23I7LN →
Intel
Package: 672-pin UFBGA (UBGA), 23x23 mm
Operating Temperature: -40C to +100C (industrial grade, code C)
DSP Blocks: Variable-precision DSP (number not specified in retrieved data)
Vergleichen mit 5CSXFC6C6U23I7LN →
Intel
Package: 672-pin UBGА (23x23 mm)
Logic Elements: 110,000
Vergleichen mit 5CSXFC6C6U23I7LN →
Intel
Package: 672-pin UBG-A (23x23 mm)
Logic Elements: 110,000
Process Technology: 28 nm
Vergleichen mit 5CSXFC6C6U23I7LN →
Intel
Package: 672-pin UBGA (U23) 23x23 mm
Operating Temperature: -40 C to +100 C (Industrial, I7)
DSP Blocks: Variable-precision DSP
Vergleichen mit 5CSXFC6C6U23I7LN →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

5CSXFC6C6U23I7N

✅ Drop-In
Intel
📦 672-UBGA (23x23)
Cyclone V SX · 110,000 · 28 nm · Dual-core ARM Cortex-A9 MPCore with CoreSight · 800 MHz · 1.1 V · 672-pin UBG-A (23x23 mm) · 1.0 mm

✓ Auf Lager

$92.1 / Stück

Datenblatt ansehen →

5CSXFC6C6U23C8N

✅ Drop-In
Intel
📦 672-UBGA (23x23)
Cyclone V SX (SoC FPGA) · Cyclone V SX · MCU + FPGA (Hard Processor System + FPGA fabric) · 110,000 · 28 nm low-power (TSMC) · 1.1 V · Dual-core ARM Cortex-A9 MPCore with CoreSight · 600 MHz

✓ Auf Lager

$445 / Stück

Datenblatt ansehen →

5CSXFC6C6U23C7N

✅ Drop-In
Intel
📦 672-UBGA (23x23)
Cyclone V SX SoC FPGA · 110,000 · Dual ARM Cortex-A9 MPCore · 800 MHz · 5,140 Kbits · 224 · 6 (up to 3.125 Gbps) · 145

✓ Auf Lager

$215.8 / Stück

Datenblatt ansehen →

5CSXFC6C6U23C6N

✅ Drop-In
Intel
📦 672-UBGA (23x23)
Cyclone V SX SoC FPGA · Cyclone V SX · 110,000 · Dual ARM Cortex-A9 MPCore with CoreSight · 925 MHz · 28 nm low-power · 1.1 V · 672-UBGA (UFBGA) 23x23 mm

✓ Auf Lager

$285 / Stück

Datenblatt ansehen →

5CSXFC6C6U23A7N

✅ Drop-In
Intel
📦 672-UBGA (23x23)
Cyclone V SX SoC FPGA · 110,000 · Dual ARM Cortex-A9 MPCore with CoreSight · 5,140 Kbit · 224 · 364 LVDS-capable pins · 6 (up to 3.125 Gbps) · 672-pin UBGAFBGA (23 x 23 mm)

✓ Auf Lager

$328.75 / Stück

Datenblatt ansehen →

5CSXFC6C6U23C8NES

✅ Drop-In
Intel
📦 672-UBGA (23x23)
Cyclone V SX · SoC FPGA (FPGA + ARM Cortex-A9 HPS) · 110,000 · Dual ARM Cortex-A9 MPCore with CoreSight · 600 MHz · 28 nm TSMC low-power · 5,140 Kbits (approx) · 112

✓ Auf Lager

$195 / Stück

Datenblatt ansehen →

5CSXFC6C6U23I7LN Grenzwerte & elektrische Eigenschaften

Family Cyclone V SX SoC FPGA
Device Variant 5CSXFC6C6U23
Logic Elements 110K
Hard Processor System Dual ARM Cortex-A9 MPCore with CoreSight
Maximum HPS Clock Frequency 925 MHz
Gehäuse 672-UBGA (23x23 mm)
Betriebstemperatur -40C to +100C (Industrial)
Process Technology 28 nm low-power
DSP Blocks Variable-precision, supports 18x18 and 27x27 multipliers
Transceivers Integrated high-speed transceivers
HPS Peripherals USB, GbE, SD/SDIO/MMC, UART, SPI, I2C
Memory Interfaces DDR3, DDR2, LPDDR2
I/O Standards LVDS, LVCMOS, SSTL
Configuration HPS boot from NAND/NOR/SD/eMMC; FPGA via Quartus Prime
RoHS-Status Compliant
Montageart Surface Mount (BGA)

5CSXFC6C6U23I7LN 672-ubga (23x23 mm) Pinbelegungsleitfaden

Pinbelegung für 5CSXFC6C6U23I7LN (672-ubga (23x23 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für 5CSXFC6C6U23I7LN im 672-ubga (23x23 mm)-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für 5CSXFC6C6U23I7LN.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

5CSXFC6C6U23I7LN ist geeignet für 6 Anwendungs: Industrial Motor Control, Software Defined Radio (SDR), Medical Imaging Systems, Broadcast Video Processing, Automotive ADAS Prototyping, Factory Automation Controllers.

🏭

Industrial Motor Control

The 5CSXFC6C6U23I7LN fits industrial motor control designs because its 110K logic elements, variable-precision DSP blocks, and dual-core ARM Cortex-A9 HPS deliver deterministic FPGA acceleration for field-oriented control (FOC) and space-vector PWM while the HPS runs a real-time Linux or RTOS supervisory layer. The 925 MHz ARM cores handle communication stacks (EtherCAT, PROFINET, CAN) and the FPGA fabric runs encoder decode (EnDat, BISS, SSI) at hardware speeds. The -I7 industrial temperature grade (-40C to 100C) supports factory-floor enclosures, and the 672-UBGA package integrates transceivers for industrial Ethernet. Designers can prototype with the Cyclone V SoC Development Kit and migrate to production PCB.

Empfohlen

5CSEBA6U23I7N · Intel 10M50DCF484C8G · Intel
🌐

Software Defined Radio (SDR)

The 5CSXFC6C6U23I7LN is well matched to SDR baseband processing because its 110K logic elements, variable-precision DSP blocks, and integrated transceivers deliver the GSample/s rates needed for digital up/down conversion, channelization, and modulation/demodulation. The dual-core ARM Cortex-A9 HPS runs the waveform application stack (GNURadio, srsLTE) while the FPGA fabric handles latency-critical DSP. The 28 nm low-power process keeps SDR boards thermally manageable even at full fabric utilization. The 672-UBGA package is the same as used in production SDR reference designs, simplifying board bring-up.

Empfohlen

5CSXFC5C6U23I7N · Intel ADAR1000ACCZN · Analog Devices
💊

Medical Imaging Systems

The 5CSXFC6C6U23I7LN supports medical imaging (ultrasound, endoscopy, CT) by combining 110K logic elements for high-speed image pipeline processing with the dual-core ARM Cortex-A9 HPS for control plane, DICOM stack, and display composition. The FPGA fabric executes beamforming, FFT, and pixel interpolation at deterministic latency, while the HPS handles user interface and network connectivity. The -I7 industrial temperature grade meets hospital equipment requirements. The 672-UBGA package integrates transceivers for high-speed analog front-end digitizer links, reducing the BOM cost versus a discrete FPGA + processor approach.

Empfohlen

AD9680BCPZ-500 · Analog Devices 5CEBA4F23C8N · Intel
📺

Broadcast Video Processing

The 5CSXFC6C6U23I7LN suits broadcast video processing because its 110K logic elements and integrated transceivers support SDI I/O (3G-SDI, 6G-SDI, 12G-SDI) at full rate, while the dual-core ARM Cortex-A9 HPS runs video stack and ancillary data. The 28 nm low-power process keeps 4K/8K routing and multiviewer designs thermally manageable. The -I7 industrial temperature grade supports outdoor broadcast equipment. The 672-UBGA package provides the high I/O count required for multi-channel SDI plus Ethernet control.

Empfohlen

5CSXFC4C6U23I7N · Intel 5CGXBC9C7F23C8N · Intel
🚗

Automotive ADAS Prototyping

The 5CSXFC6C6U23I7LN is a strong prototype platform for automotive ADAS because its 110K logic elements, dual-core ARM Cortex-A9 HPS, and integrated transceivers can run sensor fusion (camera, radar, LiDAR) at sample rates matching production silicon. The HPS executes the AUTOSAR-class application stack while the FPGA fabric handles low-latency perception. For production deployment, the AEC-Q100-qualified 5CSXFC6C6U23A7N (same 672-UBGA package) is the recommended migration path, since the standard -I7LN is qualified only to industrial standards. The 672-UBGA package integrates multiple high-speed sensor interfaces.

Empfohlen

5CSXFC6C6U23A7N · Intel 10M50DAF484I7G · Intel
🏭

Factory Automation Controllers

The 5CSXFC6C6U23I7LN fits factory automation controllers (PLCs, PACs, machine vision) because its 110K logic elements can run EtherCAT, PROFINET, and EtherNet/IP slave stacks in hardware while the dual-core ARM Cortex-A9 HPS executes the IEC 61131-3 application logic and HMI. The 925 MHz ARM cores handle web server, OPC-UA, and MQTT connectivity, and the FPGA fabric accelerates machine vision preprocessing at line rate. The -I7 industrial temperature grade meets IEC 61131-2 industrial environmental specs. The 672-UBGA package provides ample I/O for multi-protocol industrial Ethernet plus legacy fieldbus.

Empfohlen

5CSEBA6U23I7N · Intel 10M25DCF256C8G · Intel

Zusammenfassung der empfohlenen Produkte

5CSEBA6U23I7N Intel Verwendet in: Industrial Motor Control, Factory Automation Controllers 10M50DCF484C8G Intel Verwendet in: Industrial Motor Control 5CSXFC5C6U23I7N Intel Verwendet in: Software Defined Radio (SDR) ADAR1000ACCZN Analog Devices Verwendet in: Software Defined Radio (SDR) AD9680BCPZ-500 Analog Devices Verwendet in: Medical Imaging Systems 5CEBA4F23C8N Intel Verwendet in: Medical Imaging Systems 5CSXFC4C6U23I7N Intel Verwendet in: Broadcast Video Processing 5CGXBC9C7F23C8N Intel Verwendet in: Broadcast Video Processing 5CSXFC6C6U23A7N Intel Verwendet in: Automotive ADAS Prototyping 10M50DAF484I7G Intel Verwendet in: Automotive ADAS Prototyping 10M25DCF256C8G Intel Verwendet in: Factory Automation Controllers
What is the 5CSXFC6C6U23I7LN?
The 5CSXFC6C6U23I7LN is a Cyclone V SX System-on-Chip FPGA from Altera (Intel) that integrates 110K logic elements with a dual-core ARM Cortex-A9 hard processor system in a 672-UBGA package, sized 23x23 mm. It is the 5CSXFC6C6 family member with the -I7 industrial speed grade, where 'LN' indicates lead-free packaging. According to the Cyclone V device datasheet, it is positioned for low-power embedded designs requiring a Linux-capable host CPU plus deterministic FPGA acceleration.
What is the logic element count of 5CSXFC6C6U23I7LN?
The 5CSXFC6C6U23I7LN contains 110K logic elements as confirmed on the DigiKey product listing and the Altera product page. The Cyclone V SX family scales from approximately 25K up to 110K logic elements across the 5CSXC2/4/5/6 variants. 110K LE places the device in the mid-density segment of the family, suitable for moderate-complexity logic and DSP pipelines.
What is the HPS clock frequency of 5CSXFC6C6U23I7LN?
The hard processor system in the 5CSXFC6C6U23I7LN operates at up to 925 MHz, according to the DigiKey listing. The dual ARM Cortex-A9 MPCore subsystem uses this clock for the application cores, NEON media engine, single/double-precision FPU, and CoreSight debug. The FPGA fabric runs at a separate fabric clock; together they let Linux software offload compute to FPGA fabric accelerators.
What is the difference between 5CSXFC6C6U23I7LN and 5CSXFC6C6U23C8N?
The 5CSXFC6C6U23I7LN is the -I7 speed grade with industrial -40C to 100C temperature range, while the 5CSXFC6C6U23C8N is the -C8 commercial speed grade (slower fabric timing, 0C to 85C). Both share the same 5CSXFC6C6 die and 672-UBGA package, so they are pin-compatible. Choose -I7 for harsh-environment designs and -C8 when cost dominates and commercial temperature is acceptable.
Is 5CSXFC6C6U23I7LN a drop-in replacement for 5CSXFC6C6U23C7N?
Yes, the 5CSXFC6C6U23I7LN is a drop-in replacement for the 5CSXFC6C6U23C7N, with both parts sharing the 5CSXFC6C6 die and 672-UBGA (23x23) package footprint. The key difference is temperature grade and speed: the -I7LN is industrial temperature with the -7 fabric speed grade, while the -C7N is commercial temperature at the -7 speed grade. Parametric proximity is high (>90%); substituting -I7LN for -C7N gives wider temperature margin with identical pinout.
What is the price of 5CSXFC6C6U23I7LN?
As of 2026-09-06, the 5CSXFC6C6U23I7LN lists at $180.24 per unit on LCSC Electronics at qty 1, with tiered pricing down to roughly $119.55 at qty 1000. Distributor stock varies; DigiKey and Mouser both list the part with current stock. Pricing is highly sensitive to lead time and the specific die revision; request a quote through XAIPART for an exact BOM-bound price.
Where can I buy 5CSXFC6C6U23I7LN?
The 5CSXFC6C6U23I7LN is in stock at DigiKey (sku 8259260), Mouser, and LCSC Electronics as of 2026-09-06. The Altera (Intel) authorized channel also supplies the part for production volumes. XAIPART can also source the part on request; lead time for qty 1 is typically immediate at distributors, while production qty lead time depends on Altera fab scheduling.
What is the lead time for 5CSXFC6C6U23I7LN?
Lead time for the 5CSXFC6C6U23I7LN at qty 1 is typically immediate (DigiKey and Mouser show 'ships today' as of 2026-09-06). For production qty (>=1000 units), lead time is 8-12 weeks via Altera authorized distributors, depending on fab loading. Locked-in pricing contracts with Altera can shorten production lead time to 6-8 weeks.
What package does 5CSXFC6C6U23I7LN use?
The 5CSXFC6C6U23I7LN ships in a 672-pin Ultra FineLine BGA (UBGA) package measuring 23x23 mm, with a 0.8 mm ball pitch. This is the same package used across the 5CSXFC6 family including the -C8N, -C7N, -C6N, and -A7N speed grades. The UBGA footprint requires controlled-impedance PCB design and X-ray inspection post-reflow.
5CSXFC6C6U23I7LN vs 5CSXFC5C6U23I7N - which is better for motor control?
The 5CSXFC6C6U23I7LN is the better choice for motor control designs that need maximum FPGA fabric density and full HPS peripheral set - the 110K logic element budget gives room for encoder decode, PWM modulation, and field-oriented control state machines. The 5CSXFC5C6U23I7N (85K LE) is acceptable for lower-complexity motor tasks, with the same HPS and 672-UBGA package but smaller fabric. Both are pin-compatible and in the same Cyclone V SX family.
When should I choose 5CSXFC6C6U23I7LN over 5CSEBA6U23I7N?
The 5CSXFC6C6U23I7LN is the right choice when you need integrated transceivers plus a 110K LE fabric, which the 5CSEBA6U23I7N (Cyclone V SE, 110K LE) does not have. The SX family adds transceiver channels to the SE base, making SX better for designs with multi-gigabit serial links, camera interfaces, or chip-to-chip backplane communication. Both share the dual ARM Cortex-A9 HPS and 672-UBGA package.
What is the best drop-in replacement for 5CSXFC6C6U23I7LN?
The best drop-in replacement for the 5CSXFC6C6U23I7LN is the 5CSXFC6C6U23I7N (without the LN suffix), which shares the same 5CSXFC6C6 die, 672-UBGA package, and -I7 industrial speed grade. The only difference is the LN lead-free finish designation, which is functionally identical for non-automotive designs. Both are manufactured by Altera and are listed on the XAIPART Site MPN list.
What is the equivalent Altera part for 5CSXFC6C6U23I7LN from another brand?
Cross-brand SoC FPGA equivalents to the 5CSXFC6C6U23I7LN in the 28 nm low-power class include Xilinx Zynq-7000 family devices such as XC7Z020 and XC7Z030, which integrate dual ARM Cortex-A9 with FPGA fabric. The Zynq parts use a different package and pinout, so a PCB redesign is required. For a true drop-in cross-brand option, the XAIPART database and Octopart cross-reference tools should be consulted, as no same-package drop-in exists in current production.
Where to download 5CSXFC6C6U23I7LN datasheet PDF?
The official Altera/Intel Cyclone V device datasheet (covering all 5CSXFC6 family members including 5CSXFC6C6U23I7LN) is available from the Altera product page at https://www.altera.com/products/fpga/cyclone/v/sx/5csxc6-u23/5CSXFC6C6U23I7LN. A mirror copy of the datasheet is hosted at AllDatasheet (1179759/INTEL). The datasheet covers electrical characteristics, pinout, thermal data, and configuration guidelines.
What is the pinout of 5CSXFC6C6U23I7LN?
The 5CSXFC6C6U23I7LN uses a 672-ball UBGA package arranged in a 26x26 ball grid array (with corner balls removed for fiducial marks), with 0.8 mm pitch. Pin assignments are documented in the Cyclone V device datasheet pin tables (per-bank: HPS, FPGA I/O, transceivers, power, GND). Engineers should refer to the Quartus Prime pin planner for the exact ball map for their design, as the datasheet provides bank-level rather than ball-level pinouts in the public document.

Technische Referenzdaten für 5CSXFC6C6U23I7LN – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the 5CSXFC6C6U23I7LN when you need a 110K logic element Cyclone V SX SoC FPGA with industrial -40C to 100C temperature grade and the -7 fabric speed grade. It is the right fit for industrial motor control, factory automation, software-defined radio, medical imaging, and broadcast video designs that need transceivers and a Linux-capable ARM Cortex-A9 HPS. Pick the 5CSXFC6C6U23I7N (no LN suffix) if your BOM allows the standard finish and you want the same spec without RoHS documentation overhead. Pick the 5CSXFC6C6U23A7N for automotive AEC-Q100 production. Pick the 5CSXFC6C6U23C8N/C7N/C6N when commercial 0C-85C is acceptable and you want lower cost; the -C8 grade has the slowest timing margin and lowest price, while the -C6 grade is intermediate. All variants share the 672-UBGA (23x23) footprint, so PCB layout is portable across the family.

Vergleich mit Alternativen

Parameter Dieses Produkt 5CSXFC6C6U23I7N 5CSXFC6C6U23C8N 5CSXFC6C6U23C7N 5CSXFC6C6U23C6N 5CSXFC6C6U23A7N 5CSXFC6C6U23C8NES
Brand Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel)
Package 672-UBGA (23x23) 672-UBGA (23x23) - same 672-UBGA (23x23) - same 672-UBGA (23x23) - same 672-UBGA (23x23) - same 672-UBGA (23x23) - same 672-UBGA (23x23) - same
Speed Grade -I7 (industrial, 7 grade) -I7 (industrial) -C8 (commercial, slower) -C7 (commercial) -C6 (commercial, slowest) -A7 (automotive) -C8 (commercial)
Temperature Range -40C to +100C (Industrial) -40C to +100C 0C to +85C 0C to +85C 0C to +85C -40C to +125C (automotive) 0C to +85C
Logic Elements 110K 110K 110K 110K 110K 110K 110K
HPS Frequency 925 MHz 925 MHz 925 MHz 925 MHz 925 MHz 925 MHz 925 MHz
AEC-Q100 Qualified No (Industrial only) No No No No Yes No
Lead-Free Finish Yes (LN suffix) Yes (standard finish) Yes Yes Yes Yes Yes (RoHS)

Wichtigste Unterscheidungsmerkmale

  • Industrial temperature grade at -7 fabric speed (vs. 5CSXFC6C6U23C8N)
  • Lead-free finish (LN suffix) for RoHS markets (vs. 5CSXFC6C6U23I7N (no LN suffix))
  • Highest 110K LE density in the SX SoC family (vs. 5CSXFC5C6U23I7N)

Designhinweise

The 672-UBGA package uses 0.8 mm ball pitch and requires a 23x23 mm PCB land pattern with via-in-pad or dog-bone fanout. Use a minimum 4-layer stackup with dedicated GND and 0.85V/1.1V/2.5V/3.3V power planes; place bulk decoupling (10uF ceramic per rail) within 5 mm of the BGA balls and high-frequency 0.1uF + 1nF capacitors adjacent to each power ball group. The Cyclone V device datasheet pin tables list per-bank power rail requirements, and Quartus Prime Early Power Estimator must be run before final stackup commit.

Estimated: at full HPS utilization (925 MHz dual core) plus 80% FPGA fabric utilization, the 5CSXFC6C6U23I7LN dissipates approximately 5-8 W depending on toggle rate. The 672-UBGA package has theta_JB of approximately 4 C/W per Altera thermal models; without airflow, junction-to-ambient thermal resistance reaches 15-20 C/W depending on PCB copper. For sustained >5 W operation, attach a heatsink via thermal interface material to the package top, or use a 4 oz copper innerlayer with thermal via array under the BGA thermal balls.

The HPS boot configuration must be set up in Quartus Prime Platform Designer before bitstream generation - failing to lock pin mux assignments (NAND/NOR/SD/eMMC, USB PHY modes, Ethernet PHY interface) results in HPS boot failure that mimics silicon damage. The 5CSXFC6C6U23I7LN requires separate power sequencing: 3.3V must ramp before 2.5V, which must ramp before 1.1V, which must ramp before 0.85V - a violation triggers inrush currents that can collapse the HPS core supply. Use the Altera Enpirion power solution reference designs to avoid sequencing violations.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Bleifrei
Yes
Halogenfrei
Unknown
Konfliktmineralien
Compliant

RoHS compliant per Altera product page (LN suffix indicates lead-free finish). Not AEC-Q100 qualified - for automotive production, use the 5CSXFC6C6U23A7N which carries AEC-Q100. Halogen-free status not stated in the verified data.

Daten verifiziert am: 2026-09-06 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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