5CSXFC6D6F31C8N - Cyclone V SX SoC FPGA, 110K LE, Dual ARM Cortex-A9 | Intel
料号： 5CSXFC6D6F31C8N ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $462.5 | $4,625.00 |
| 100 | $425 | $42,500.00 |
| 500 | $388 | $194,000.00 |
| 1,000 | $355 | $355,000.00 |
5CSXFC6D6F31C8N 概述
A Cyclone V SoC FPGA is a heterogeneous compute device that combines a hardened application processor subsystem with programmable logic on a single die. In the broader taxonomy, the 5CSXFC6 sits within the Cyclone V family of low-power FPGAs and SoCs, positioned in Intel's FPGA portfolio below Arria 10 and Stratix 10. Compared with soft-core processor implementations in FPGA fabric, an SoC FPGA reduces BOM count, lowers system power by eliminating external processor-to-FPGA bridges, and shortens latency between ARM Cortex-A9 software and FPGA hardware accelerators through the AXI/FPGA-to-HPS bridge fabric.
Key features include dual ARM Cortex-A9 MPCore at up to 600 MHz with CoreSight debug, 110K logic elements, 6.144 Mb embedded SRAM, 224 variable-precision DSP blocks built on 18x19 multipliers, integrated transceivers on selected speed grades, hard memory controllers supporting DDR3 and LPDDR2, and a hardened PCI Express Gen2 x4 rootport/endpoint. The device supports the -40C to +85C extended industrial temperature range and operates from a 1.1 V core rail with multi-rail power management.
The 5CSXFC6D6F31C8N uses TSMC's low-power 28 nm process, allowing the HPS to be powered independently from the FPGA fabric for fine-grained power gating. Configuration is supported via active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG modes, with bitstream encryption and authentication available through the security block.
Typical applications include industrial motor control and machine vision, video surveillance and broadcast video processing, factory automation with EtherCAT/PROFIBUS, portable medical imaging, smart-grid substation controllers, and automotive ADAS pre-processing. The dual ARM cores offload Linux/OS tasks while the FPGA fabric accelerates deterministic DSP and image pipelines.
When designing with this device, plan power-rail sequencing (1.1 V core before 2.5/3.3 V I/O before 1.5 V DDR) and use the Quartus Prime PowerPlay analyzer for thermal budgeting. For new designs, verify the specific OPN suffix (C8 = commercial speed grade 8) matches your target operating profile.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
直接替换替代料： 5CSXFC6D6F31C8N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 5CSXFC6D6F31C8N （相同外形与封装尺寸） ——差异在于 Package, Family, Logic Elements, RoHS Status, Mounting Type.
快速对比工具——选择替代料号进行并排对比：
5CSXFC6D6F31I7N
✅ 直接替换✓ 有现货
$205.52 / 个
查看数据手册 →5CSXFC6D6F31A7N
✅ 直接替换✓ 有现货
$345.5 / 个
查看数据手册 →5CSXFC6D6F31C7N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$360 / 个
查看数据手册 →5CSXFC6D6F31C8N 最大额定值与电气特性
| Family | Cyclone V SX SoC FPGA |
| Device Variant | 5CSXFC6 |
| Logic Elements | 110K |
| Process Technology | 28 nm low-power (TSMC) |
| Core Voltage | 1.1 V |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 600 MHz |
| Embedded Memory | 6.144 Mb |
| DSP Blocks | 224 (variable-precision, 18x19 multipliers) |
| 封装 | 896-FBGA (31x31 mm, F31) |
| Configuration Modes | AS, PS, FPP, JTAG |
| Memory Controller | DDR3 / LPDDR2 (hardened) |
| PCI Express | Gen2 x4 (hardened rootport/endpoint) |
| Speed Grade | C8 (commercial) |
| RoHS 状态 | Compliant |
5CSXFC6D6F31C8N 896-fbga (31x31 mm, f31) 引脚配置指南
5CSXFC6D6F31C8N（896-fbga (31x31 mm, f31) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 5CSXFC6D6F31C8N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
5CSXFC6D6F31C8N 适用于 6 应用s: Industrial Motor Control, Machine Vision and Video Surveillance, Broadcast Video Processing, Factory Automation Controllers, Portable Medical Imaging, Smart-Grid Substation Controllers.
Industrial Motor Control
The 5CSXFC6D6F31C8N is purpose-built for industrial motor control and servo drives, where the dual ARM Cortex-A9 cores at 600 MHz run the EtherCAT/PROFINET communication stack and supervisory control loops, while the 224 variable-precision DSP blocks accelerate field-oriented control (FOC) algorithms. The hardened DDR3 controller simplifies interfacing to high-speed current/voltage ADCs, and the PCI Express Gen2 x4 enables integration with industrial PCs. The 28 nm low-power process keeps junction temperature manageable in sealed IP65 enclosures without active heatsinking, and the -40C to +85C commercial range supports factory floor deployment.
推荐
Machine Vision and Video Surveillance
The 5CSXFC6D6F31C8N drives machine vision pipelines where dual ARM Cortex-A9 cores run Linux + OpenCV preprocessing while the 110K logic elements accelerate image-processing kernels such as Sobel edge detection and Hough transforms in hardware. The 6.144 Mb embedded SRAM buffers full HD video frames at 60 fps without external memory pressure, and the PCI Express Gen2 x4 link delivers raw video to a host PC at line rate. Variable-precision DSP blocks accelerate FFT-based image registration, making the part suitable for multi-camera surveillance systems requiring real-time stitching.
推荐
Broadcast Video Processing
The 5CSXFC6D6F31C8N enables broadcast video processing equipment such as format converters, multiviewers, and SDI/HDMI bridges. The dual ARM Cortex-A9 cores handle audio mixing, metadata embedding (SMPTE 2022, closed captions), and IP-network control, while the FPGA fabric runs 3G-SDI/12G-SDI serializers and color-space conversion engines. The hardened DDR3 controller supports high-bandwidth frame buffers (1080p60 = ~3 Gb/s), and the Gen2 PCIe link provides a low-latency interface to host CPU for software-defined workflows.
推荐
Factory Automation Controllers
The 5CSXFC6D6F31C8N is used as the central controller in factory automation cells, where its dual ARM Cortex-A9 cores run real-time Linux plus EtherCAT/PROFIBUS/PROFINET masters, and the FPGA fabric executes deterministic logic for safety interlocks and high-speed I/O. The 896-FBGA F31 package provides sufficient I/O balls to interface directly to industrial sensors, encoders, and motor drivers without external bridge chips. Hardened PCI Express Gen2 enables integration with industrial PCs and HMI panels, while the 1.1 V core and 28 nm process minimize thermal design effort in DIN-rail mounted enclosures.
推荐
Portable Medical Imaging
The 5CSXFC6D6F31C8N powers portable ultrasound and bedside medical imaging carts where the dual ARM Cortex-A9 cores execute patient UI, DICOM networking, and battery management, while the FPGA fabric accelerates beamforming and Doppler signal processing. The 28 nm low-power process keeps battery drain low, and the 896-FBGA F31 footprint fits compact handheld form factors. PCI Express Gen2 enables raw image data transfer to a tethered display tablet, and the DDR3 controller supports high-bandwidth transducer-array memory. Operating temperature -40C to +85C supports emergency-room and field-deployment scenarios.
推荐
Smart-Grid Substation Controllers
The 5CSXFC6D6F31C8N serves as the substation controller in IEC 61850 smart-grid systems, where the dual ARM Cortex-A9 cores run the GOOSE messaging stack and DNP3/IEC 104 communications, while the FPGA fabric executes parallel synchrophasor computation per IEEE C37.118. The hardened DDR3 controller supports the high sampling rates of merging units (4.8 kHz nominal, 50+ kHz for traveling-wave applications). PCI Express Gen2 enables integration with protection relays, and the 896-FBGA F31 package supports the numerous Ethernet PHY interfaces required for substation LANs.
推荐
推荐产品汇总
工程参考数据： 5CSXFC6D6F31C8N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 5CSXFC6D6F31I7N | 5CSXFC6D6F31A7N | 5CSXFC6D6F31C7N | 5CSXFC5C6F27C7N | 5CEFA5F23C7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 896-FBGA (31x31 mm, F31) | 896-FBGA (31x31 mm, F31) - same | 896-FBGA (31x31 mm, F31) - same | 896-FBGA (31x31 mm, F31) - same | 672-FBGA (27x27 mm, F27) - different | 484-FBGA (23x23 mm, F23) - different |
| Logic Elements | 110K | 110K | 110K | 110K | approx 85K | 25K (no HPS) |
| HPS Frequency | 600 MHz | 600 MHz | 700 MHz | 600 MHz | 600 MHz | N/A (no HPS) |
| Speed Grade | C8 (commercial) | I7 (industrial) | A7 (700 MHz) | C7 (faster commercial) | C7 | C7 |
| Process / Core Voltage | 28 nm / 1.1 V | 28 nm / 1.1 V | 28 nm / 1.1 V | 28 nm / 1.1 V | 28 nm / 1.1 V | 28 nm / 1.1 V |
关键差异点
- Pin-compatible same-family variants enable footprint reuse （对比 5CSXFC6D6F31I7N)
- Higher HPS clock frequency than C8 （对比 5CSXFC6D6F31A7N)
- Full HPS + 110K LE on a single die （对比 5CEFA5F23C7N)
设计说明
Plan power-rail sequencing for the 5CSXFC6D6F31C8N: the 1.1 V core rail must come up before the 2.5/3.3 V I/O rails to prevent latch-up, and the 1.5 V or 1.35 V DDR3/LPDDR2 rail must stabilize before the HPS begins memory training. Use a multi-channel sequencer such as the LTC2984 or a small CPLD (e.g. EPM570T100C5N from the Site MPN list) to enforce the sequencing. Decoupling: 0402 0.1 uF X7R on every power pin plus 4-8 bulk 22-47 uF ceramic capacitors near the package perimeter. The 28 nm process benefits from split power planes - keep the HPS_VCC and FPGA_VCC on separate islands joined only at the ferrite bead for noise isolation.
Estimated: with 90% logic utilization and full HPS load at 600 MHz, the 5CSXFC6D6F31C8N dissipates approximately 5-7 W depending on toggle rate. The 896-FBGA (F31) has no exposed top heatspreader, so thermal relief relies on PCB copper. Provide at least 25 cm^2 of unbroken inner copper (4-6 layer board) connected through the BGA thermal balls. For continuous full-load operation in industrial environments above 60C ambient, add a small clip-on heatsink or specify the industrial speed grade I7 for guaranteed thermal margin.
The 896-ball FBGA F31 package uses a 1.0 mm ball pitch with a 31x31 mm body. Route with 4 mil traces and 4 mil space on the outermost signal layers, microvia-in-pad for the inner balls. Use the Cyclone V device handbook Pin Connection Guidelines PDF to identify no-connect balls and to plan differential pair routing for LVDS/MIPI channels. Place the DDR3 memory on the same side as the HPS balls to minimize trace length (target <50 mils to the SoC), and route clocks before data signals to keep the bus matched within 25 ps.
Do not assume the C8 speed grade covers industrial temperatures - the C8 is commercial (0C to +85C). For -40C to +100C deployment, choose the I7 suffix. Avoid leaving unused HPS balls floating - follow the Cyclone V device datasheet pin-connection guidelines to tie them to defined logic levels. Do not skip the configuration mode jumper or pull-up resistors on MSEL pins, or Quartus Prime will fail to configure the device. Finally, leave a permanent JTAG header accessible for field firmware updates.
合规信息
RoHS and REACH compliance per Intel product page. Not AEC-Q100 qualified - for automotive applications consider other Cyclone V variants or dedicated automotive FPGAs. C8 suffix is commercial speed grade.
