5CSXFC6D6F31I7N - Cyclone V SX SoC FPGA, 110K LE | Intel
MPN: 5CSXFC6D6F31I7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $342.53 | $342.53 |
| 10 | $308.28 | $3,082.80 |
| 100 | $274.02 | $27,402.00 |
| 500 | $239.77 | $119,885.00 |
| 1,000 | $205.52 | $205,520.00 |
Drop-in alternatives for 5CSXFC6D6F31I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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5CSXFC6D6F31I7
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View Datasheet →5CSXFC6D6F31C7N
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View Datasheet →5CSXFC6D6F31A7N
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View Datasheet →5CSXFC5D6F31I7N
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$138.2 / Unit
View Datasheet →5CSXFC6D6F31I7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SX SoC FPGA |
| Logic Elements | 110,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 800 MHz |
| DSP Blocks (18x18 Multipliers) | 224 |
| Embedded Memory | approximately 5.5 Mbits |
| Maximum User I/O | 288 |
| Package | 896-FBGA (31x31 mm) |
| Process Technology | 28 nm low-power |
| Core Voltage | 1.1 V |
| Operating Temperature | -40C to +100C (Industrial) |
| Mounting Type | Surface Mount (FBGA) |
| RoHS Status | Compliant |
| MSL Level | 3 |
| Series | Cyclone V SX 5CSXC6 (F31) |
5CSXFC6D6F31I7N 896-fbga (31x31 mm) Pin Configuration Guide
Complete pinout information for 5CSXFC6D6F31I7N (896-fbga (31x31 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSXFC6D6F31I7N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSXFC6D6F31I7N is suitable for 8 applications: Industrial Motor Control and Factory Automation, Video Surveillance and Image Processing, Automotive Driver Assistance and Infotainment, Software Defined Radio (SDR) Baseband, Medical Imaging and Diagnostics, Military and Aerospace Ruggedized Systems, Industrial IoT Gateway and Edge Computing, Test and Measurement Instrumentation.
Industrial Motor Control and Factory Automation
The 5CSXFC6D6F31I7N's deterministic dual ARM Cortex-A9 HPS at 800 MHz combined with 110K logic elements makes it ideal for multi-axis motor control in factory automation. The fabric can implement time-critical PWM generators, encoder interfaces, and field-oriented control loops in parallel while the HPS runs Linux for OPC UA, EtherCAT, or PROFINET master stacks. 224 DSP blocks provide headroom for sensorless-FOC and Kalman-filter estimators, and the 288 user I/Os allow direct connection to multiple resolver or Hall-sensor channels. Industrial -40C to +100C rating ensures operation on the factory floor.
Recommended
Video Surveillance and Image Processing
In video surveillance designs the 5CSXFC6D6F31I7N delivers parallel pixel pipelines (Sobel, motion detection, H.264 pre-processing) in 110K logic elements while the dual ARM cores handle network streaming, ONVIF, and analytics at 800 MHz. The DDR controller in the HPS manages frame buffers without consuming fabric memory, and the 28nm low-power process keeps thermals manageable in sealed outdoor camera housings. Hardware CV-acceleration kernels in DSP blocks reduce CPU load for AI-driven intrusion detection.
Recommended
Automotive Driver Assistance and Infotainment
The 5CSXFC6D6F31I7N industrial temperature range and 800 MHz ARM cores support ADAS sensor fusion and infotainment HMI simultaneously. The FPGA fabric implements low-latency camera pre-processing (de-Bayering, lens correction) and CAN-FD gateways while the HPS runs QNX or Linux for HMI graphics, navigation, and over-the-air updates. Designers targeting AEC-Q100-qualified automotive builds should select the 'A7' speed-grade variant. 224 DSP blocks accelerate radar FFT preprocessing and lane-detection kernels.
Recommended
Software Defined Radio (SDR) Baseband
The 5CSXFC6D6F31I7N's 224 18x18 multipliers and ~5.5 Mbit embedded RAM are well suited to multi-channel SDR baseband processing - digital down-conversion, channelization, and demodulation can run in the FPGA at rates the Cortex-A9 HPS cannot match alone. The hard ARM cores then handle MAC-layer stacks, IP routing, and timing-sensitive control planes. Transceivers (where the SX device variant supports them) provide the multi-gigabit RF-to-digital interface, and the F31 896-FBGA breaks out ample LVDS pairs for ADC/DAC connections.
Recommended
Medical Imaging and Diagnostics
In ultrasound beamformers and portable patient monitors the 5CSXFC6D6F31I7N pairs parallel beamforming datapaths in fabric with deterministic ARM Cortex-A9 cores for DICOM networking, UI rendering, and signal processing supervision. The 288 user I/Os accept multiple analog front-end channels and high-speed ADC LVDS lanes, while 110K logic elements sustain real-time image reconstruction. Industrial temperature range and 28nm low-power process support fanless medical enclosures.
Recommended
Military and Aerospace Ruggedized Systems
With industrial -40C to +100C operating range, the 5CSXFC6D6F31I7N suits ruggedized man-portable radios, UAV flight controllers, and avionics datalinks. The dual ARM cores run flight management and crypto stacks while the FPGA fabric accelerates sensor fusion, MIL-STD-1553 bridges, and RS-422/485 links. The 896-FBGA F31 package provides extensive I/O for redundant sensor channels and the high pin density enables compact SWaP-optimized designs common in UAVs.
Recommended
Industrial IoT Gateway and Edge Computing
The 5CSXFC6D6F31I7N integrates networking, control, and analytic compute in a single chip for industrial IoT gateways. The ARM HPS runs Linux with containers for protocol translation (Modbus, OPC UA, MQTT), while 110K fabric logic elements accelerate edge-AI inference engines using the 224 DSP blocks. Multiple GbE, USB, and SD/eMMC interfaces in the HPS provide rich connectivity, and the 28nm process keeps thermal output low for sealed enclosures without forced cooling.
Recommended
Test and Measurement Instrumentation
In bench-top oscilloscopes, protocol analyzers, and arbitrary waveform generators the 5CSXFC6D6F31I7N's 800 MHz ARM cores manage UI, storage, and remote control while the FPGA fabric implements real-time DSP - FIR filtering, FFT, and trigger logic - at rates the processor cannot achieve alone. 288 user I/Os accept multiple high-speed ADC/DAC channels and the F31 896-FBGA breaks out sufficient LVDS for parallel data acquisition. Quartus Prime DSP Builder accelerates model-based design entry.
Recommended
Recommended Products Summary
Engineering reference data for 5CSXFC6D6F31I7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSXFC6D6F31I7 | 5CSXFC6D6F31C8N | 5CSXFC6D6F31C7N | 5CSXFC6D6F31C6N | 5CSXFC6D6F31A7N | 5CSXFC5D6F31I7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 896-FBGA (F31, 31x31 mm) | 896-FBGA (F31) - same | 896-FBGA (F31) - same | 896-FBGA (F31) - same | 896-FBGA (F31) - same | 896-FBGA (F31) - same | 896-FBGA (F31) - same |
| Logic Elements | 110,000 | 110,000 | 110,000 | 110,000 | 110,000 | 110,000 | 85,000 |
| Hard Processor System | Dual ARM Cortex-A9 800 MHz | Dual ARM Cortex-A9 800 MHz | Dual ARM Cortex-A9 800 MHz | Dual ARM Cortex-A9 800 MHz | Dual ARM Cortex-A9 800 MHz | Dual ARM Cortex-A9 800 MHz | Dual ARM Cortex-A9 800 MHz |
| DSP Blocks (18x18) | 224 | 224 | 224 | 224 | 224 | 224 | 174 |
| User I/Os | 288 | 288 | 288 | 288 | 288 | 288 | 288 |
| Speed Grade | I7 (industrial, fast) | I7 (industrial) | C8 (commercial) | C7 (commercial) | C6 (commercial, slowest) | A7 (automotive) | I7 (industrial) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Automotive (AEC-Q100) | Industrial |
| Unit Price (qty 1, as of 2026-09-06) | $342.53 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- High density in the 896-FBGA F31 footprint (vs 5CSXFC5D6F31I7N)
- Fastest industrial speed grade available (vs 5CSXFC6D6F31C8N)
- Industrial temperature screening with hard ARM Cortex-A9 (vs 5CSXFC6C6U23I7N)
- AES, JTAG, and partial reconfiguration support (vs 5CEBA4F23C8N (non-SoC Cyclone V E))
Design Notes
The 5CSXFC6D6F31I7N requires multiple supply rails (core 1.1V, HPS, transceiver, I/O, and PLL supplies) all sequenced per the Cyclone V device handbook. Use the dedicated Intel Enpirion or similar power management IC family that supports the prescribed power-up/power-down sequencing, and place decoupling capacitors within the package escape region for each rail. Estimated: a fully utilized C6 device can draw 3-5 W from the core rail alone, so plan thermal dissipation for industrial -40C to +100C operation.
For industrial deployments with sustained high fabric utilization, attach a heatsink or thermal interface material (TIM) to the top of the F31 896-FBGA package. The 28nm process reduces static power relative to prior 40/65 nm nodes but dynamic power at high toggle rates still drives junction temperature. Ensure airflow of at least 1 m/s in sealed enclosures, and verify with a thermal simulation using the actual toggle rate from your Quartus Prime power analyzer report. Estimated: junction-to-ambient theta_JA in still air is roughly 15-20 C/W for the F31 package - design for junction temperature below 100C in industrial environments.
The 896-FBGA F31 package requires a multilayer PCB with microvia (laser-drilled) stack-ups - it cannot be built on a 2-layer board because the 1.0 mm pitch BGA exceeds the manufacturability of through-hole vias. Use Intel's Cyclone V F31 package pin-out file to escape all 288 user I/Os and dedicate at least one inner layer to GND and another to a high-speed supply. Match DDR3 trace lengths to within 25 mils per the Cyclone V external memory interface guidelines.
Do not confuse F31 (896-FBGA 31x31 mm) with U23 (484-UBGA 23x23 mm) package codes when ordering - the speed and density suffixes are identical but the packages are not interchangeable and require different PCB layouts. Likewise, ensure your Quartus Prime device selection matches the exact ordering code including the 'N' (lead-free) suffix. Pin-compatible drop-in parts in this listing all use the F31 footprint, so swapping among them is safe.
Compliance Information
RoHS compliant per DigiKey product listing. 'I' suffix indicates industrial temperature grade (-40C to +100C), not AEC-Q100. For AEC-Q100 automotive, choose 5CSXFC6D6F31A7N. Halogen-free status not explicitly stated in verified data.
