5CSXFC6D6F31C7N - Cyclone V SX SoC FPGA, 110K LE, 896-FBGA | Intel
MPN: 5CSXFC6D6F31C7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $465 | $4,650.00 |
| 100 | $425 | $42,500.00 |
| 500 | $395 | $197,500.00 |
| 1,000 | $360 | $360,000.00 |
Drop-in alternatives for 5CSXFC6D6F31C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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5CSXFC6D6F31C6N
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View Datasheet →5CSXFC6D6F31A7N
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View Datasheet →5CSXFC5C6U23C7N
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View Datasheet →5CSXFC6D6F31C7N Maximum Ratings & Electrical Characteristics
| Series | Cyclone V SX |
| Family | Cyclone V SoC FPGA |
| Logic Elements | 110K |
| Process Technology | 28 nm low-power |
| Core Voltage | 1.1 V |
| HPS Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Max Frequency | 800 MHz |
| Package | 896-FBGA (31 x 31 mm) |
| Temperature Grade | Commercial (0C to +85C) |
| Speed Grade | 7 |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount |
| MSL Level | 3 |
| HPS DDR Controller | DDR3 up to 1066 Mbps, 32-bit |
| Transceivers | Up to 3.125 Gbps (channel count package-dependent) |
5CSXFC6D6F31C7N 896-fbga (31 x 31 mm) Pin Configuration Guide
Complete pinout information for 5CSXFC6D6F31C7N (896-fbga (31 x 31 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSXFC6D6F31C7N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSXFC6D6F31C7N is suitable for 6 applications: Industrial Motor Control and Drive, Machine Vision and Smart Camera, Video Surveillance and Analytics Gateway, Automotive Driver Assistance (ADAS) Prototyping, Military and Aerospace Signal Processing, Industrial IoT and Protocol-Bridging Gateways.
Industrial Motor Control and Drive
The 5CSXFC6D6F31C7N's 110K logic elements and dual ARM Cortex-A9 HPS running Linux make it ideal for industrial motor-control and servo-drive platforms. The HPS handles real-time Ethernet protocols (EtherCAT, PROFINET) and safety logic, while FPGA fabric accelerates field-oriented control loops at sub-microsecond PWM update rates. With up to 9 transceivers and PCIe Gen2 hard IP, the device can also aggregate feedback from multiple encoders, motor-position sensors, and adjacent drive axes in a multi-axis machine cabinet.
Recommended
Machine Vision and Smart Camera
The combination of dual ARM Cortex-A9 cores (800 MHz) plus 110K LE of variable-precision DSP fabric lets the 5CSXFC6D6F31C7N ingest MIPI or parallel image-sensor data, run edge-AI inference, and stream processed video over Gigabit Ethernet in a single chip. HPS runs the OS and TCP/IP stack while FPGA fabric performs Bayer demosaic, HDR merge, and CNN convolution at full sensor frame rate. The 32-bit DDR3 controller supports the bandwidth needs of 1080p60 and higher-resolution sensors without external memory.
Recommended
Video Surveillance and Analytics Gateway
The 5CSXFC6D6F31C7N's HPS can host an embedded Linux distribution running ONVIF / RTSP server stacks while the FPGA fabric handles H.264/H.265 encode acceleration and motion-detection pipelines for multiple IP-camera streams. With up to 9 transceiver channels, designers can route multiple GigE Vision streams into the device and use PCIe Gen2 hard IP to offload analytics to a host CPU or companion x86 module. The commercial 0C-85C grade suits indoor NVR and edge-aggregation chassis.
Recommended
Automotive Driver Assistance (ADAS) Prototyping
For ADAS prototyping and pre-production platforms, the 5CSXFC6D6F31C7N's SX SoC architecture allows fusion of camera, radar, and LiDAR sensor data with Linux running on the HPS and low-latency object-detection pipelines on FPGA fabric. Hard PCIe Gen2 IP enables pairing with a host vehicle computer, while 9 transceivers support automotive Ethernet (100BASE-T1 / 1000BASE-T1) and CAN-FD bridging. Designers should note that production automotive deployments should migrate to the 5CSXFC6D6F31A7N AEC-Q100 qualified variant for full automotive temperature and reliability compliance.
Recommended
Military and Aerospace Signal Processing
The 5CSXFC6D6F31C7N serves well in ruggedized signal-processing subsystems where an integrated ARM host simplifies system architecture and FPGA fabric handles high-rate ADC/DAC interfacing, FFTs, and digital down-conversion. Designers can pair the device with FPGAs in mezzanine cards using the transceiver channels for backplane fabrics, while the HPS runs VxWorks or a custom RTOS for control-plane tasks. For deployment in extreme environments, the 5CSXFC6D6F31I7N industrial variant extends the operating temperature range to -40C to +100C without PCB rework.
Recommended
Industrial IoT and Protocol-Bridging Gateways
The 5CSXFC6D6F31C7N is well suited to industrial IoT gateways that must bridge legacy fieldbus (Modbus, Profibus, CAN) to modern Ethernet-based protocols (OPC-UA, MQTT, TSN). The HPS handles encrypted cloud connectivity and TLS termination, while FPGA fabric implements the deterministic real-time side of the gateway with hard transceivers for industrial Ethernet and serial protocols. The 896-FBGA package exposes the full HPS peripheral set (USB, EMAC, SD/MMC, NAND) for direct connection to flash memory, Wi-Fi modules, and cellular modems.
Recommended
Recommended Products Summary
Engineering reference data for 5CSXFC6D6F31C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSXFC6D6F31C6N | 5CSXFC6D6F31A7N | 5CSXFC6D6F31I7N | 5CSXFC5D6F31C7N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 896-FBGA (31x31) | 896-FBGA (31x31) - same | 896-FBGA (31x31) - same | 896-FBGA (31x31) - same | 896-FBGA (31x31) - same |
| Logic Elements | 110K LE | 110K LE | 110K LE | 110K LE | 85K LE |
| HPS | Dual Cortex-A9 800 MHz | Dual Cortex-A9 800 MHz | Dual Cortex-A9 800 MHz | Dual Cortex-A9 800 MHz | Dual Cortex-A9 800 MHz |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Automotive (-40C to +125C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| Speed Grade | 7 | 6 | 7 | 7 | 7 |
| AEC-Q100 | No | No | Yes | No | No |
| Process | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power |
Key Differentiators
- Same-footprint speed-grade flexibility (vs 5CSXFC6D6F31C6N)
- Industrial temperature variant available (vs 5CSXFC6D6F31I7N)
- Automotive qualified option (vs 5CSXFC6D6F31A7N)
Design Notes
The 896-FBGA package has a relatively low thermal resistance, but high-utilization Cyclone V SX designs can still dissipate 5 to 10 W. Provide a thermal pad on the top-side PCB footprint if the package variant supports it, and use a 12-layer stack-up with internal ground/power planes spreading heat from the BGA footprint. Forced-air cooling is recommended for enclosed industrial chassis where ambient exceeds 50C. Estimate (not a datasheet figure): at full logic utilization with HPS active, junction-to-ambient thermal rise can exceed 35C without airflow.
Route the 896-FBGA at 0.8 mm pitch using a high-density interconnect stack-up with microvia and via-in-pad technology; a 1 oz copper outer layer is mandatory for adequate current handling on transceiver power rails. Match-length the DDR3 traces to within +/-25 ps and length-match the transceiver differential pairs per Intel's pinout guidelines. Keep decoupling capacitors within 100 mils of the relevant power pins and use a star-ground topology with the BGA thermal/ground balls stitched directly to an internal ground plane.
Transceiver channels on the 5CSXFC6D6F31C7N require controlled-impedance routing (typically 100 ohm differential) with reference planes continuous under the entire trace. AC-coupling capacitors should be placed as close to the receiver pins as possible, with biasing per the Cyclone V Transceiver User Guide. For HPS DDR3 interfaces, follow the read/write leveling and fly-by topology specified in the External Memory Interface Handbook - deviation can cause intermittent training failures at temperature extremes.
A common design pitfall is leaving the Cyclone V SX configuration pins (nCONFIG, nSTATUS, CONF_DONE) floating - always tie them through the recommended pull resistors as specified in the configuration chapter of the Cyclone V Device Handbook. Another frequent issue is forgetting to power-down unused transceiver channels in software, which can add several hundred milliwatts of unnecessary quiescent dissipation. Finally, validate that the Quartus Prime pin assignments match the final PCB schematic before tape-out - last-minute pin swaps on a 896-ball BGA require costly re-spin.
Compliance Information
RoHS and REACH compliant per Intel Cyclone V product family documentation. C7N commercial variant is NOT AEC-Q100 qualified - choose 5CSXFC6D6F31A7N for AEC-Q100 automotive designs. Conflict-mineral statement available from Intel product compliance page.
