5CSXFC6D6F31A7N - Cyclone V SX SoC FPGA, 110K LE, 896-FBGA | Intel
MPN: 5CSXFC6D6F31A7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $462 | $462.00 |
| 10 | $438.9 | $4,389.00 |
| 100 | $416.1 | $41,610.00 |
| 500 | $380 | $190,000.00 |
| 1,000 | $345.5 | $345,500.00 |
5CSXFC6D6F31A7N Overview
What is a Cyclone V SoC FPGA? The Cyclone V family is a low-power 28nm FPGA platform from Intel (formerly Altera). An SoC FPGA embeds a Hard Processor System (HPS) - typically ARM Cortex-A9 cores with peripherals, memory controllers, and interconnect - alongside programmable logic on a single chip. This architecture sits within the hierarchy: SoC FPGA -> FPGA -> programmable logic -> digital IC -> semiconductor. The integration reduces board area, BOM cost, and power versus a two-chip CPU-plus-FPGA design, while enabling high-bandwidth FPGA-to-HPS bridges for hardware acceleration.
Key features of 5CSXFC6D6F31A7N include 110,000 logic elements, embedded hard memory controllers, transceiver-rich HPS peripherals, and a 1.1 V core supply optimized for low static and dynamic power. The 896-FBGA package exposes 288 user I/O pins and supports high-speed external memory interfaces including DDR2/DDR3, LPDDR2, and QDR II+. Integrated hard IP blocks (PCIe Gen2, GbE, USB 2.0 OTG, NAND flash controller, SD/MMC) reduce soft-logic utilization for common functions.
Architecturally, the SX variant combines the HPS with approximately 110K LE of 28nm FPGA fabric, supporting up to ~5.5 Mbits of embedded memory and up to 224 DSP blocks (18x18 multipliers). The HPS-to-FPGA bridge provides multi-Gbps AXI/ Avalon coherent interconnect, enabling hardware accelerators to be tightly coupled to the ARM cores. The 1.1 V core voltage reduces dynamic power versus prior 40nm Cyclone IV designs by up to 40 percent at equivalent performance.
Typical applications include automotive driver-assistance vision pre-processing, industrial machine vision and motor control, video surveillance analytics, factory HMI, and portable medical imaging pre-processing. The automotive temperature grade (AEC-Q100) and integrated ARM cores suit designs that require both deterministic real-time control and rich OS-level software stacks (Linux, RTOS).
When designing with this device, ensure the PCB BGA layout follows Intel's recommended escape routing and decoupling guidelines for the 896-pin package. Power sequencing between the HPS and FPGA rails must follow the Cyclone V hardware reference manual; the POR (power-on reset) circuit must hold the HPS in reset until all HPS rails are stable to prevent boot corruption.
This page synthesizes distributor pricing, drop-in same-package alternatives, and PCB/thermal design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for 5CSXFC6D6F31A7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 5CSXFC6D6F31A7N (same form factor and footprint) — differing in Package, Logic Elements, Process Technology, Family, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CSXFC5D6F31C6N
✅ Drop-In✓ In Stock
$184.85 / Unit
View Datasheet →5CSXFC5C6U23C8N
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$96.75 / Unit
View Datasheet →5CSXFC4C6U23C8N
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$90 / Unit
View Datasheet →5CSXFC6D6F31C7N
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$360 / Unit
View Datasheet →5CSXFC6C6U23I7N
✅ Drop-In✓ In Stock
$92.1 / Unit
View Datasheet →5CSTFD6D5F31I7N
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$290 / Unit
View Datasheet →5CSXFC6D6F31A7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SX SoC FPGA |
| Logic Elements | 110,000 |
| Process Technology | 28 nm TSMC low-power |
| Hard Processor System (HPS) | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| Maximum HPS Clock Frequency | 700 MHz |
| Core Voltage | 1.1 V |
| User I/O Count | 288 |
| Package | 896-ball FBGA (31 x 31 mm) |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature Grade | Automotive / AEC-Q100 |
| Automotive Qualification | AEC-Q100 |
| Embedded Memory | Approximately 5.5 Mbits (M10K + MLAB) |
| DSP Blocks | Up to 224 (18 x 18 multipliers) |
| Hard Memory Controller | DDR2 / DDR3 / LPDDR2 / QDR II+ |
| Hard IP Peripherals | PCIe Gen2, GbE, USB 2.0 OTG, NAND, SD/MMC |
| Configuration | FPGA + HPS subsystem, integrated |
| RoHS Status | Compliant |
5CSXFC6D6F31A7N 896-ball fbga (31 x 31 mm) Pin Configuration Guide
Pin configuration for 5CSXFC6D6F31A7N (896-ball fbga (31 x 31 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSXFC6D6F31A7N.
Refer to the datasheet for full pin configuration.
Typical Applications
5CSXFC6D6F31A7N is suitable for 6 applications: Automotive Front-Camera Vision Pre-Processing, Industrial Machine Vision Inspection, Motor Control and Servo Drive, Video Surveillance and Analytics, Portable Medical Imaging Pre-Processing, Industrial HMI and Edge Gateways.
Automotive Front-Camera Vision Pre-Processing
The 5CSXFC6D6F31A7N's AEC-Q100 automotive qualification and dual-core ARM Cortex-A9 HPS make it ideal for front-camera ADAS pre-processing. The FPGA fabric ingests MIPI-CSI2 image-sensor streams at up to 1.5 Gbps per lane, performs lens-distortion correction and object detection, then hands structured data to the Cortex-A9 cores for higher-level perception. The 110K logic elements support real-time HOG or CNN inference at VGA/WVGA resolutions. Unlike a discrete processor, the tight HPS-to-FPGA bridge eliminates external bus latency, enabling sub-frame reaction times for AEB and lane-keeping.
Recommended
Industrial Machine Vision Inspection
On factory lines, the 5CSXFC6D6F31A7N's 110K logic elements drive real-time defect-detection pipelines at line rates up to 60 frames per second. The FPGA fabric implements area-scan Camera-Link or GigE Vision ingestion plus 2D barcode localization, while the ARM cores run the inspection software stack on Linux. With 288 user I/O pins, multiple lighting triggers, encoders, and reject mechanisms connect directly. The 1.1V core keeps junction temperature within industrial limits even in sealed IP67 enclosures without active cooling.
Recommended
Motor Control and Servo Drive
The 5CSXFC6D6F31A7N delivers deterministic FPGA-based PWM generation at switching frequencies up to 200 kHz, while the dual-core Cortex-A9 runs the field-oriented control (FOC) loop and EtherCAT/CANopen stack. The 224 DSP blocks (18x18 multipliers) handle Park/Clarke transforms and PI controllers in hardware, offloading real-time work from the HPS. Its 896-FBGA package exposes 288 I/O, enough for multi-axis drives with encoder inputs, gate-driver signals, and isolation-friendly low-voltage differential channels.
Recommended
Video Surveillance and Analytics
In NVR-class analytics appliances, the 5CSXFC6D6F31A7N accelerates H.264/H.265 video decode for multi-channel streams while the ARM cores run motion analytics. Its PCIe Gen2 hard IP interfaces to a host x86 processor at 5 Gbps, offloading decode streams. The FPGA fabric performs motion-vector extraction and people/vehicle classification, freeing CPU resources. The 28nm process delivers this performance at under 10W typical SoC power, enabling fanless surveillance edge boxes.
Recommended
Portable Medical Imaging Pre-Processing
Battery-powered ultrasound or endoscopy carts benefit from the 5CSXFC6D6F31A7N's low 28nm static power combined with deterministic FPGA beamforming or image reconstruction. The Cortex-A9 cores run the UI and DICOM stack on Linux while the FPGA fabric performs real-time signal processing on raw transducer data. Integrated DDR3 controllers handle streaming frame buffers without external memory glue. The 700 MHz HPS clock provides responsive user-experience performance for clinician touchscreens.
Recommended
Industrial HMI and Edge Gateways
The 5CSXFC6D6F31A7N serves as a Linux-capable HMI controller with FPGA-accelerated graphics overlay and fieldbus aggregation. The Cortex-A9 dual core runs Qt/embedded HMI, OPC-UA, and Modbus/TCP stacks; the FPGA fabric handles multiple industrial Ethernet protocols and high-speed GPIO. With 288 user I/O, isolated RS-485, CAN, and digital I/O integrate directly. AEC-Q100 tolerance provides headroom for harsh factory environments with surge-prone 24V rails.
Recommended
Recommended Products Summary
Engineering reference data for 5CSXFC6D6F31A7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSXFC5D6F31C6N | 5CSXFC5C6U23C8N | 5CSXFC4C6U23C8N | 5CSXFC6C6U23I7N | 5CSTFD6D5F31I7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 896-FBGA (31x31 mm) | 896-FBGA (31x31) - same | 896-FBGA (31x31) - same | 896-FBGA (31x31) - same | 896-FBGA (31x31) - same | 896-FBGA (31x31) - same |
| Family | Cyclone V SX | Cyclone V SX | Cyclone V SX | Cyclone V SX | Cyclone V SX | Cyclone V ST |
| Logic Elements | 110,000 | ~85,000 (-23%) | ~85,000 (-23%) | ~49,000 (-55%) | 110,000 (same) | ~85,000 (-23%) |
| Temperature Grade | Automotive (AEC-Q100, A7) | Industrial (I7) | Industrial (I7) | Industrial (I7) | Industrial (I7) | Industrial (I7) |
| HPS | Dual ARM Cortex-A9 @ 700 MHz | Dual ARM Cortex-A9 @ 700 MHz | Dual ARM Cortex-A9 @ 700 MHz | Dual ARM Cortex-A9 @ 700 MHz | Dual ARM Cortex-A9 @ 700 MHz | Dual ARM Cortex-A9 @ 700 MHz |
| User I/O Count | 288 | 288 | 288 | 288 | 288 | 288 |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
Key Differentiators
- Automotive AEC-Q100 qualification on the same die (vs 5CSXFC5D6F31C6N)
- Highest logic capacity in the 896-FBGA Cyclone V SX family (vs 5CSXFC5D6F31C6N)
- Same-package pinout across SX speed grades (vs 5CSXFC6C6U23I7N)
Design Notes
Estimated: BGA escape routing for the 896-FBGA package requires a 1.0mm pitch ball array. Use microvia stack-up (laser-drilled 4-mil vias on 8-mil capture pads) for inner-row breakouts. Reference Intel Cyclone V device handbook pin connection guidelines for the F31 package. Place at least one full ground plane and one solid 1.1V core plane beneath the device to provide low-impedance return paths for high-speed HPS DDR3 interfaces.
Cyclone V SX SoC FPGAs require multi-rail power-up sequencing: 3.3V aux -> 2.5V/1.8V I/O -> 1.1V core -> 0.95V HPS core. The HPS must remain in cold-reset until all HPS rails are stable, per Intel Cyclone V SoC FPGA Hardware Reference Manual. Use the companion TPS659037 PMIC or equivalent; do not attempt to derive HPS and FPGA rails from discrete LDOs without explicit sequencing logic.
Estimated: at 1.1V core and ~5W typical SoC power, the 896-FBGA package theta-JA is approximately 12 C/W on a 4-layer JEDEC test board, allowing operation up to ~85C ambient without a heatsink. Forced airflow or a 6+ layer board with thermal vias is recommended above 70C ambient. Decouple every VCC pin with a 0.1uF X7R plus 10uF bulk cap, placed within 50 mils of the BGA pad.
A common mistake is connecting JTAG pins directly to a 3.3V level programmer without a level shifter - Cyclone V JTAG uses 1.8V or 2.5V. Use the Intel USB-Blaster II or compatible with proper level translation. Another pitfall is configuring the HPS boot source after assembly without checking the BSEL strap resistors, which can leave the board unbootable if soldered incorrectly. Always verify boot mode selection in the schematic review stage.
Compliance Information
RoHS and REACH compliance inferred from Intel/Altera product family declarations. AEC-Q100 qualification is explicitly indicated by the 'A' speed/temp grade suffix in the part number. Halogen-free status not explicitly confirmed in provided web data; set to 'unknown' per authenticity rules.
