EP1S10F672I7N - Stratix FPGA, 10,570 LEs, 672-BGA | Intel
料号： EP1S10F672I7N ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $145 | $14,500.00 |
| 250 | $130 | $32,500.00 |
| 500 | $118 | $59,000.00 |
EP1S10F672I7N 概述
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic function is defined after manufacture by a user-supplied configuration bitstream, in contrast to an ASIC whose function is fixed at tape-out. Within the broader programmable-logic taxonomy, FPGAs sit above CPLDs (which use non-volatile, coarse-grained fabrics) and below fully-masked ASICs in both integration scale and per-unit NRE cost. Stratix was Intel's (formerly Altera's) first new architecture after the 0.13 µm process transition, introducing embedded TriMatrix memory blocks, DSP blocks, and high-speed transceivers that positioned the family for high-throughput DSP and communications designs.
Key features of the EP1S10F672I7N include 920 Kbits of embedded RAM distributed across TriMatrix memory blocks, dedicated DSP blocks for fixed- and floating-point arithmetic, support for multiple I/O standards via selectable bank reference voltages, an active serial or parallel configuration interface, and JTAG boundary-scan per IEEE 1149.1. The 672-ball FineLine BGA is the largest package option offered for the EP1S10 density step.
Typical applications for this part are communication infrastructure line cards, software-defined radio baseband processing, high-speed data acquisition front-ends, and industrial imaging pipelines where parallel logic, embedded memory, and DSP throughput are required. The I7N speed grade and the I-suffix industrial temperature rating make this specific MPN the version intended for designs that must operate reliably across extended commercial-to-industrial thermal envelopes.
When designing with this device, verify that the Quartus II (version 13.0 or older) toolchain is used, because later Quartus releases dropped support for legacy Stratix silicon. Engineers migrating from this part typically move to Cyclone IV/V or MAX 10 families because of the Stratix EOL status, which is documented in Intel's Product Discontinuance notices.
This page synthesizes distributor pricing, drop-in alternatives from the same Stratix family, and practical migration guidance not found in the manufacturer datasheet alone.
直接替换替代料： EP1S10F672I7N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP1S10F672I7N （相同外形与封装尺寸） ——差异在于 Operating Temperature, Package, DSP Blocks, Embedded Memory, Mounting Type.
快速对比工具——选择替代料号进行并排对比：
EP1S10F672C7N
✅ 直接替换✓ 有现货
$171 / 个
查看数据手册 →EP1S10F672I7
✅ 直接替换✓ 有现货
$124.75 / 个
查看数据手册 →EP1S10F672C7
✅ 直接替换✓ 有现货
$158 / 个
查看数据手册 →EP1S10F672C6
✅ 直接替换✓ 有现货
$72 / 个
查看数据手册 →EP1S10F672I7N 最大额定值与电气特性
| Family | Stratix |
| Logic Elements | 10,570 |
| Logic Array Blocks (LABs) | 1,057 |
| User I/Os | 345 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Maximum Internal Frequency | 420.17 MHz |
| 工作温度 | 0C to 85C |
| 封装 | 672-ball FineLine BGA, 35 x 35 mm, 1.27 mm pitch |
| Logic Family | CMOS |
| Embedded Memory | 920 Kbits (TriMatrix) |
| DSP Blocks | Yes (dedicated) |
| Configuration Interface | Active Serial / Passive Serial / JTAG |
| JTAG Support | IEEE 1149.1 boundary-scan |
| Speed Grade | I7 (industrial, -7 speed bin) |
| MSL 等级 | 3 (per JEDEC J-STD-020, typical for BGA of this era) |
| 安装类型 | Surface Mount (BGA) |
EP1S10F672I7N 672-ball fineline bga, 35 x 35 mm, 1.27 mm pitch 引脚配置指南
EP1S10F672I7N（672-ball fineline bga, 35 x 35 mm, 1.27 mm pitch 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP1S10F672I7N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP1S10F672I7N 适用于 6 应用s: Telecommunications Line-Card Processing, Software-Defined Radio Baseband, High-Speed Data Acquisition Front-End, Industrial Imaging and Machine Vision, Test and Measurement Instrumentation, Embedded Control and Industrial Networking.
Telecommunications Line-Card Processing
The EP1S10F672I7N fits line-card processing applications because its 10,570 logic elements and dedicated DSP blocks deliver the throughput needed for channel aggregation, framing, and packet classification. With 345 user I/Os in the 672-FBGA, designers can connect directly to external PHYs, SFP cages, and backplane SERDES glue logic without external bus expander chips. The embedded TriMatrix memory (920 Kbits) supports fast lookup tables for routing and QoS classification. The industrial 0-85°C temperature grade suits central-office equipment that runs in temperature-controlled but continuously-operated cabinets.
推荐
Software-Defined Radio Baseband
The EP1S10F672I7N suits SDR baseband implementations because its dedicated DSP blocks accelerate the multiply-accumulate loops that dominate FIR filtering, FFT butterfly operations, and digital down-conversion. The 672-FBGA exposes enough I/O to support parallel ADC/DAC interfaces and the high-speed LVDS links typically used between the FPGA and RF front-end converters. Quartus II IP libraries provide FFT, NCO, and digital up/down-converter cores tuned for Stratix DSP blocks, reducing firmware development time. The industrial temperature rating enables deployment in outdoor or ruggedized enclosures where commercial-grade parts would otherwise require thermal derating.
推荐
High-Speed Data Acquisition Front-End
The EP1S10F672I7N fits high-speed data acquisition front-ends because its embedded TriMatrix memory absorbs burst ADC samples at peak rates while the FPGA fabric pre-processes the data stream. The 345 available user I/Os in the 672-FBGA allow direct LVDS or parallel-CMOS interfaces to multi-channel ADC arrays without intermediate buffering. Designers can route events through on-chip DSP blocks for real-time decimation, filtering, or feature extraction before storing to external DDR memory. The 0-85°C industrial rating supports factory-floor and laboratory instrumentation deployments where ambient temperatures fluctuate during continuous operation.
推荐
Industrial Imaging and Machine Vision
The EP1S10F672I7N is well matched to industrial imaging pipelines because its 10,570 LEs can host Bayer demosaicing, color-space conversion, and preprocessing kernels in parallel with embedded memory acting as line buffers. The 345 I/Os of the 672-FBGA accommodate Camera Link, CoaXPress, or LVDS-based imagers that often demand 20+ differential pairs plus control signals. The Stratix DSP blocks accelerate convolution operations used in edge-detection and morphological filtering, offloading the host processor. Industrial 0-85°C qualification supports factory-floor cameras exposed to warm LED illumination and enclosed housings.
推荐
Test and Measurement Instrumentation
The EP1S10F672I7N suits test and measurement instruments because its combination of logic density, embedded memory, and DSP blocks enables stimulus generation, response capture, and on-the-fly signal analysis in a single device. The 672-FBGA package exposes enough user I/Os to drive parallel DAC/ADC pairs, reference clocks, and trigger buses simultaneously. The Quartus II toolchain provides SignalTap II embedded logic-analyzer IP that uses the JTAG pins already present on the device, eliminating the need for external probing on most signals. Industrial 0-85°C operation covers bench and laboratory environments that frequently exceed typical office temperatures.
推荐
Embedded Control and Industrial Networking
The EP1S10F672I7N fits embedded control and industrial networking designs because its logic capacity can run Profinet, EtherCAT, or EtherNet/IP soft-MAC stacks alongside custom deterministic control logic. The 345 I/Os of the 672-FBGA provide PHY interfaces, GPIO for sensors and actuators, and memory buses to external SRAM or flash. Industrial 0-85°C qualification makes it suitable for control cabinets and machine enclosures where ambient temperatures climb during long production runs. Designers benefit from the legacy Stratix IP ecosystem, which still ships industrial-protocol reference designs in the Quartus II library.
推荐
推荐产品汇总
工程参考数据： EP1S10F672I7N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP1S10F672C7N | EP1S10F672I7 | EP1S10F672C7 | EP1S10F672C6 |
|---|---|---|---|---|---|
| Package | 672-FBGA (35 x 35 mm) | 672-FBGA (35 x 35 mm) - same | 672-FBGA (35 x 35 mm) - same | 672-FBGA (35 x 35 mm) - same | 672-FBGA (35 x 35 mm) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Logic Elements | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 |
| Temperature Grade | Industrial (0C to 85C) | Commercial (0C to 70C) | Industrial (0C to 85C) | Commercial (0C to 70C) | Commercial (0C to 70C) |
| Speed Grade | -7 | -7 | -7 | -7 | -6 |
| User I/Os | 345 | 345 | 345 | 345 | 345 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
关键差异点
- Industrial 0-85C temperature qualification in the 672-FBGA Stratix line （对比 EP1S10F672C7N)
- Same silicon die and ball map as the C-grade siblings （对比 EP1S10F672C7)
- Higher speed grade than the -6 variant （对比 EP1S10F672C6)
设计说明
The EP1S10F672I7N requires Quartus II version 13.0 or older because Intel/Altera dropped legacy Stratix support in Quartus Prime 14.0 and later. Verify your design services environment has a licensed Quartus II 13.0 installation before committing to a board spin. IP cores generated with newer Quartus versions are not backward compatible. Estimated: a Quartus II 13.0 maintenance extension is necessary for any long-term firmware updates.
The 672-FBGA has a theta-JA around 8-12 C/W with a standard 4-layer PCB and adequate thermal via array under the package, so at full 1.5 V core utilization the device typically dissipates 2-5 W. Provide a continuous via-in-pad or thermal-ball pattern stitched to internal copper planes. The industrial 0-85°C spec assumes proper airflow; in sealed enclosures, derate to 70°C ambient. Estimated: airflow of 200 LFM is recommended for fully-utilized designs.
The 1.27 mm pitch FineLine BGA requires NSMD (non-solder-mask defined) pads with a diameter of approximately 0.55 mm to ensure reliable solder joints. Microvia-in-pad is strongly recommended for the inner-row balls that route to internal layers, and a 4-6 layer stack-up with continuous ground planes below the device is mandatory for signal integrity of the LVDS pairs. Use ENIG or OSP surface finish and reflow profile per JEDEC J-STD-020 MSL-3.
Stratix devices require specific VCCINT and VCCIO power-up sequencing to avoid latch-up; consult the Stratix handbook chapter on power management before finalizing the power tree. Configuration mode (AS, PS, or JTAG) must be selected via MSEL pins and cannot be changed in-system. The 672-FBGA exposes fewer user I/Os than the raw 672 ball count because configuration, JTAG, power, and ground balls consume a meaningful fraction; budget only for 345 I/Os in pin planning.
合规信息
RoHS/REACH compliance for the EP1S10F672I7N is not stated in the provided web data; consult the official Intel/Altera PDN and material declaration documents for definitive compliance information. AEC-Q100 is not applicable to FPGAs of this generation.
