EP1S10F672I7N - Stratix FPGA, 10,570 LEs, 672-BGA | Intel
부품 번호: EP1S10F672I7N ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $145 | $14,500.00 |
| 250 | $130 | $32,500.00 |
| 500 | $118 | $59,000.00 |
EP1S10F672I7N 개요
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic function is defined after manufacture by a user-supplied configuration bitstream, in contrast to an ASIC whose function is fixed at tape-out. Within the broader programmable-logic taxonomy, FPGAs sit above CPLDs (which use non-volatile, coarse-grained fabrics) and below fully-masked ASICs in both integration scale and per-unit NRE cost. Stratix was Intel's (formerly Altera's) first new architecture after the 0.13 µm process transition, introducing embedded TriMatrix memory blocks, DSP blocks, and high-speed transceivers that positioned the family for high-throughput DSP and communications designs.
Key features of the EP1S10F672I7N include 920 Kbits of embedded RAM distributed across TriMatrix memory blocks, dedicated DSP blocks for fixed- and floating-point arithmetic, support for multiple I/O standards via selectable bank reference voltages, an active serial or parallel configuration interface, and JTAG boundary-scan per IEEE 1149.1. The 672-ball FineLine BGA is the largest package option offered for the EP1S10 density step.
Typical applications for this part are communication infrastructure line cards, software-defined radio baseband processing, high-speed data acquisition front-ends, and industrial imaging pipelines where parallel logic, embedded memory, and DSP throughput are required. The I7N speed grade and the I-suffix industrial temperature rating make this specific MPN the version intended for designs that must operate reliably across extended commercial-to-industrial thermal envelopes.
When designing with this device, verify that the Quartus II (version 13.0 or older) toolchain is used, because later Quartus releases dropped support for legacy Stratix silicon. Engineers migrating from this part typically move to Cyclone IV/V or MAX 10 families because of the Stratix EOL status, which is documented in Intel's Product Discontinuance notices.
This page synthesizes distributor pricing, drop-in alternatives from the same Stratix family, and practical migration guidance not found in the manufacturer datasheet alone.
드롭인 대체품: EP1S10F672I7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1S10F672I7N (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, DSP Blocks, Embedded Memory, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1S10F672C7N
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EP1S10F672I7
✅ 드롭인✓ 재고 있음
$124.75 / 개
데이터시트 보기 →EP1S10F672C7
✅ 드롭인✓ 재고 있음
$158 / 개
데이터시트 보기 →EP1S10F672C6
✅ 드롭인✓ 재고 있음
$72 / 개
데이터시트 보기 →EP1S10F672I7N 최대 정격 & 전기적 특성
| Family | Stratix |
| Logic Elements | 10,570 |
| Logic Array Blocks (LABs) | 1,057 |
| User I/Os | 345 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Maximum Internal Frequency | 420.17 MHz |
| 동작 온도 | 0C to 85C |
| 패키지 | 672-ball FineLine BGA, 35 x 35 mm, 1.27 mm pitch |
| Logic Family | CMOS |
| Embedded Memory | 920 Kbits (TriMatrix) |
| DSP Blocks | Yes (dedicated) |
| Configuration Interface | Active Serial / Passive Serial / JTAG |
| JTAG Support | IEEE 1149.1 boundary-scan |
| Speed Grade | I7 (industrial, -7 speed bin) |
| MSL 레벨 | 3 (per JEDEC J-STD-020, typical for BGA of this era) |
| 실장 유형 | Surface Mount (BGA) |
EP1S10F672I7N 672-ball fineline bga, 35 x 35 mm, 1.27 mm pitch 핀 구성 가이드
EP1S10F672I7N(672-ball fineline bga, 35 x 35 mm, 1.27 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1S10F672I7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1S10F672I7N 적합 용도: 6 애플리케이션s: Telecommunications Line-Card Processing, Software-Defined Radio Baseband, High-Speed Data Acquisition Front-End, Industrial Imaging and Machine Vision, Test and Measurement Instrumentation, Embedded Control and Industrial Networking.
Telecommunications Line-Card Processing
The EP1S10F672I7N fits line-card processing applications because its 10,570 logic elements and dedicated DSP blocks deliver the throughput needed for channel aggregation, framing, and packet classification. With 345 user I/Os in the 672-FBGA, designers can connect directly to external PHYs, SFP cages, and backplane SERDES glue logic without external bus expander chips. The embedded TriMatrix memory (920 Kbits) supports fast lookup tables for routing and QoS classification. The industrial 0-85°C temperature grade suits central-office equipment that runs in temperature-controlled but continuously-operated cabinets.
추천
Software-Defined Radio Baseband
The EP1S10F672I7N suits SDR baseband implementations because its dedicated DSP blocks accelerate the multiply-accumulate loops that dominate FIR filtering, FFT butterfly operations, and digital down-conversion. The 672-FBGA exposes enough I/O to support parallel ADC/DAC interfaces and the high-speed LVDS links typically used between the FPGA and RF front-end converters. Quartus II IP libraries provide FFT, NCO, and digital up/down-converter cores tuned for Stratix DSP blocks, reducing firmware development time. The industrial temperature rating enables deployment in outdoor or ruggedized enclosures where commercial-grade parts would otherwise require thermal derating.
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High-Speed Data Acquisition Front-End
The EP1S10F672I7N fits high-speed data acquisition front-ends because its embedded TriMatrix memory absorbs burst ADC samples at peak rates while the FPGA fabric pre-processes the data stream. The 345 available user I/Os in the 672-FBGA allow direct LVDS or parallel-CMOS interfaces to multi-channel ADC arrays without intermediate buffering. Designers can route events through on-chip DSP blocks for real-time decimation, filtering, or feature extraction before storing to external DDR memory. The 0-85°C industrial rating supports factory-floor and laboratory instrumentation deployments where ambient temperatures fluctuate during continuous operation.
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Industrial Imaging and Machine Vision
The EP1S10F672I7N is well matched to industrial imaging pipelines because its 10,570 LEs can host Bayer demosaicing, color-space conversion, and preprocessing kernels in parallel with embedded memory acting as line buffers. The 345 I/Os of the 672-FBGA accommodate Camera Link, CoaXPress, or LVDS-based imagers that often demand 20+ differential pairs plus control signals. The Stratix DSP blocks accelerate convolution operations used in edge-detection and morphological filtering, offloading the host processor. Industrial 0-85°C qualification supports factory-floor cameras exposed to warm LED illumination and enclosed housings.
추천
Test and Measurement Instrumentation
The EP1S10F672I7N suits test and measurement instruments because its combination of logic density, embedded memory, and DSP blocks enables stimulus generation, response capture, and on-the-fly signal analysis in a single device. The 672-FBGA package exposes enough user I/Os to drive parallel DAC/ADC pairs, reference clocks, and trigger buses simultaneously. The Quartus II toolchain provides SignalTap II embedded logic-analyzer IP that uses the JTAG pins already present on the device, eliminating the need for external probing on most signals. Industrial 0-85°C operation covers bench and laboratory environments that frequently exceed typical office temperatures.
추천
Embedded Control and Industrial Networking
The EP1S10F672I7N fits embedded control and industrial networking designs because its logic capacity can run Profinet, EtherCAT, or EtherNet/IP soft-MAC stacks alongside custom deterministic control logic. The 345 I/Os of the 672-FBGA provide PHY interfaces, GPIO for sensors and actuators, and memory buses to external SRAM or flash. Industrial 0-85°C qualification makes it suitable for control cabinets and machine enclosures where ambient temperatures climb during long production runs. Designers benefit from the legacy Stratix IP ecosystem, which still ships industrial-protocol reference designs in the Quartus II library.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1S10F672I7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1S10F672C7N | EP1S10F672I7 | EP1S10F672C7 | EP1S10F672C6 |
|---|---|---|---|---|---|
| Package | 672-FBGA (35 x 35 mm) | 672-FBGA (35 x 35 mm) - same | 672-FBGA (35 x 35 mm) - same | 672-FBGA (35 x 35 mm) - same | 672-FBGA (35 x 35 mm) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Logic Elements | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 |
| Temperature Grade | Industrial (0C to 85C) | Commercial (0C to 70C) | Industrial (0C to 85C) | Commercial (0C to 70C) | Commercial (0C to 70C) |
| Speed Grade | -7 | -7 | -7 | -7 | -6 |
| User I/Os | 345 | 345 | 345 | 345 | 345 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
주요 차별점
- Industrial 0-85C temperature qualification in the 672-FBGA Stratix line (vs EP1S10F672C7N)
- Same silicon die and ball map as the C-grade siblings (vs EP1S10F672C7)
- Higher speed grade than the -6 variant (vs EP1S10F672C6)
설계 노트
The EP1S10F672I7N requires Quartus II version 13.0 or older because Intel/Altera dropped legacy Stratix support in Quartus Prime 14.0 and later. Verify your design services environment has a licensed Quartus II 13.0 installation before committing to a board spin. IP cores generated with newer Quartus versions are not backward compatible. Estimated: a Quartus II 13.0 maintenance extension is necessary for any long-term firmware updates.
The 672-FBGA has a theta-JA around 8-12 C/W with a standard 4-layer PCB and adequate thermal via array under the package, so at full 1.5 V core utilization the device typically dissipates 2-5 W. Provide a continuous via-in-pad or thermal-ball pattern stitched to internal copper planes. The industrial 0-85°C spec assumes proper airflow; in sealed enclosures, derate to 70°C ambient. Estimated: airflow of 200 LFM is recommended for fully-utilized designs.
The 1.27 mm pitch FineLine BGA requires NSMD (non-solder-mask defined) pads with a diameter of approximately 0.55 mm to ensure reliable solder joints. Microvia-in-pad is strongly recommended for the inner-row balls that route to internal layers, and a 4-6 layer stack-up with continuous ground planes below the device is mandatory for signal integrity of the LVDS pairs. Use ENIG or OSP surface finish and reflow profile per JEDEC J-STD-020 MSL-3.
Stratix devices require specific VCCINT and VCCIO power-up sequencing to avoid latch-up; consult the Stratix handbook chapter on power management before finalizing the power tree. Configuration mode (AS, PS, or JTAG) must be selected via MSEL pins and cannot be changed in-system. The 672-FBGA exposes fewer user I/Os than the raw 672 ball count because configuration, JTAG, power, and ground balls consume a meaningful fraction; budget only for 345 I/Os in pin planning.
규정 준수 정보
RoHS/REACH compliance for the EP1S10F672I7N is not stated in the provided web data; consult the official Intel/Altera PDN and material declaration documents for definitive compliance information. AEC-Q100 is not applicable to FPGAs of this generation.
