H5CG44AGBDX018 - 16Gb DDR5-5600 SDRAM x4 | SK hynix
料号： H5CG44AGBDX018 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $6.5 | $6.50 |
| 10 | $5.98 | $59.80 |
| 100 | $5.45 | $545.00 |
| 500 | $4.92 | $2,460.00 |
| 1,000 | $4.48 | $4,480.00 |
H5CG44AGBDX018 概述
DDR5 SDRAM is the fifth generation of the JEDEC double-data-rate DRAM standard, designed to improve on DDR4 in both speed and power efficiency. Within the memory hierarchy (DRAM -> volatile system memory -> memory IC -> semiconductor storage), DDR5 devices such as this one form the main-memory building blocks of servers, data centers, AI accelerators, and high-performance computing platforms. SK hynix introduced DDR5 into server solutions early, enabling the era of AI and big data workloads.
Key features of the H5CG44AGBDX018 include its 16Gbit density in a single die, an x4 I/O organization suited to ECC-protected server DIMMs where 72-bit bus widths are built from 18 x4 devices, and the DDR5-5600 speed grade that supports modern server and client memory controllers. The device operates on the DDR5 core supply (VDD/VDDQ in the 1.1V class), reflecting the DDR5 standard's reduced operating voltage relative to DDR4's 1.2V class, which lowers dynamic and standby power in high-density systems.
Technically, DDR5 moves critical functions such as the power management IC (PMIC) onto the module, uses on-die ECC (ODECC) at the die level, and doubles bank groups per device versus DDR4. These architectural changes allow higher per-die densities like 16Gb while maintaining signal integrity at 5600 Mbps data rates. The FBGA package provides low-inductance ball interconnects essential for high-speed signal paths.
Typical applications include DDR5 RDIMM and UDIMM modules for servers and workstations, embedded computing modules, industrial controllers with firmware boot and embedded logging memory, and replacement sourcing for data-center memory repair and refurbishment.
When designing with this device, verify your memory controller's supported DDR5 speed grades, address-map configuration (x4 timing parameters differ from x8 devices), and on-die ECC initialization requirements per the manufacturer datasheet.
This page synthesizes distributor sourcing data, drop-in alternative analysis, and application guidance not found in the manufacturer datasheet, helping engineers and buyers compare BOM lines and procurement availability.
直接替换替代料： H5CG44AGBDX018 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： H5CG44AGBDX018 （相同外形与封装尺寸） ——差异在于 Interface, Data Rate, Organization, Density, Package.
快速对比工具——选择替代料号进行并排对比：
H5CG48AGBDX018N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$87.42 / 个
查看数据手册 →H5CG48AGBDX018
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$63.9844 / 个
查看数据手册 →H5CG46AGBDX017N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$91.73 / 个
查看数据手册 →H5CG46AGBDX015
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$4.95 / 个
查看数据手册 →H5CG26AGBDX021
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$4.95 / 个
查看数据手册 →H5CG44AGBDX018 最大额定值与电气特性
| Manufacturer | SK hynix |
| Product Type | DDR5 SDRAM |
| Density | 16 Gbit (4Gx4) |
| 存储组织 | x4 (4G x 4) |
| Speed Grade | DDR5-5600 |
| 数据速率 | 5600 Mbps/pin |
| 封装 | FBGA |
| 安装类型 | Surface Mount |
| Memory Type Hierarchy | DRAM > DDR SDRAM > DDR5 |
| ECC | On-die ECC (DDR5 standard feature) |
| Supply Voltage Class | 1.1 V class (DDR5 VDD/VDDQ) |
| Application Domains | Server modules, computing modules, industrial controllers |
H5CG44AGBDX018 fbga 引脚配置指南
H5CG44AGBDX018（fbga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： H5CG44AGBDX018.
请参阅 数据手册 以查看完整引脚配置。
典型应用
H5CG44AGBDX018 适用于 6 应用s: Server RDIMM Modules, AI and Big Data Computing, Embedded Computing Modules, Firmware Boot and Embedded Logging, Memory Replacement and Rework Sourcing, Data Center Storage Controllers.
Server RDIMM Modules
The H5CG44AGBDX018 is a primary building block for DDR5 registered DIMMs in data-center servers. Its 16Gb density in x4 organization lets module builders populate 72-bit ECC-protected buses efficiently, and the DDR5-5600 speed grade matches the memory controllers of current Intel and AMD server platforms. SK hynix delivered the world's first DDR5 in server solutions, so qualification data and platform compatibility are mature. In a typical RDIMM, the die operates at a 1.1V-class supply with power regulated by the on-module PMIC; on-die ECC improves reliability without host-side overhead. At 5600 Mbps per pin, design attention focuses on fly-by routing and SPD programming rather than per-die tuning, making high-volume module builds repeatable.
推荐
AI and Big Data Computing
AI training and big data analytics platforms are the flagship DDR5 use case that SK hynix targets with the H5CG4 series. According to SK hynix's DDR5 e-catalogue, next-generation DDR5 'will enable the era of AI and big data' by improving speed and power over DDR4. The H5CG44AGBDX018 contributes 5600 Mbps/pin bandwidth, directly raising effective memory throughput for GPU/accelerator hosts where memory bandwidth bounds model training speed. Its x4 organization supports high-capacity, ECC-corrected modules essential for multi-day training runs. When used between the CPU memory controller and module PMIC, the die's reduced 1.1V-class supply lowers per-DIMM power, easing thermal budgets in dense AI servers.
推荐
Embedded Computing Modules
Embedded computing modules (COMs) and industrial controllers adopt soldered-down DDR5 dies such as the H5CG44AGBDX018 to gain DDR5 bandwidth in compact form factors. Datasheet-directory product listings for the H5CG44 series cite computing modules, industrial controllers, firmware boot, and embedded logging as target uses. The 16Gb die provides substantial working memory for Linux-based gateways and edge AI boxes while the FBGA package withstands industrial vibration better than socketed DIMMs. The 5600 Mbps rate gives headroom for image and sensor data pipelines; designers should confirm the controller's DDR5-5600 training support and derate for extended temperature ranges per the manufacturer datasheet.
推荐
Firmware Boot and Embedded Logging
System designers use DDR5 DRAM dies like the H5CG44AGBDX018 as fast working memory behind firmware boot stages and embedded logging buffers. After boot from NOR flash, runtime code and log structures execute from DRAM, and the 16Gb capacity of this die accommodates large in-memory log buffers for diagnostics in industrial and network equipment. The x4 organization keeps the memory controller interface narrow, simplifying routing on dense controller boards. DDR5's on-die ECC protects log integrity against soft errors, an important property for audit-trail logging. Operation at the DDR5-5600 bin shortens boot-time memory training and initialization compared with slower bins, reducing cold-start time in appliances requiring fast power-on-to-ready behavior.
推荐
Memory Replacement and Rework Sourcing
The H5CG44AGBDX018 is heavily used in component-level repair of DDR5 server modules and systems, a sourcing channel visible in distributor listings (PCX, Fusion Worldwide, Win Source). When a single die on a module fails or an older platform needs DDR5 stock, matching the exact H5CG4 speed code (-018 for DDR5-5600) preserves module SPD and training behavior. Buyers should request date-code and lot consistency when replacing multiple dies, and re-run module-level memory test after rework. Because this is a quote-driven broker market, availability fluctuates; keeping same-family alternates such as H5CG48AGBDX018N on the approved list improves procurement resilience for service organizations.
推荐
Data Center Storage Controllers
Storage controllers and smart NICs in data centers use soldered DDR5 dies such as the H5CG44AGBDX018 as cache and metadata memory. The 5600 Mbps/pin data rate and 16Gb per-die capacity deliver the read/write bandwidth that SSD controllers need for DRAM-backed FTL (flash translation layer) tables. The x4 organization aligns with controller memory interfaces that assemble ECC-protected buses from multiple x4 devices. DDR5's lower 1.1V-class supply reduces controller-board power compared with DDR4-based predecessors - relevant in storage shelves with strict per-slot thermal limits. Designers should validate address mapping and refresh interval settings against the controller's DDR5 PHY configuration and the SK hynix datasheet.
推荐
推荐产品汇总
工程参考数据： H5CG44AGBDX018 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | H5CG48AGBDX018N | H5CG48AGBDX018 | H5CG46AGBDX017N | H5CG26AGBDX021 |
|---|---|---|---|---|---|
| Package | FBGA | FBGA - same family | FBGA - same family | FBGA - same family | FBGA - same family |
| Brand | SK hynix | SK hynix | SK hynix | SK hynix | SK hynix |
| Memory Type | DDR5 SDRAM | DDR5 SDRAM | DDR5 SDRAM | DDR5 SDRAM | DDR5 SDRAM |
| Organization | x4 (4G x 4) | x4 (H5CG4 series) | x4 (H5CG4 series) | x4 (H5CG4 series) | x4 (H5CG2 series) |
| ECC | On-die ECC (DDR5 standard) | On-die ECC | On-die ECC | On-die ECC | On-die ECC |
关键差异点
- Top DDR5-5600 speed bin (-018 code) （对比 H5CG46AGBDX017N)
- 16Gb x4 organization optimized for ECC modules （对比 H5CG26AGBDX021)
- Mature SK hynix DDR5 server qualification （对比 MT62F3G32D8DV-023 (Micron))
设计说明
At DDR5-5600, per-pin data rates of 5600 Mbps leave little timing margin. Follow the SK hynix DDR5 module design guide for fly-by command/address routing, matched-length DQ/DQS groups, and reference-plane continuity. On soldered-down (non-DIMM) designs, keep DRAM-to-controller trace lengths within the controller's PHY training window and simulate eye diagrams at the target data rate before committing the stack-up.
DDR5 uses a 1.1V-class VDD/VDDQ supply; in module designs power conversion is handled by an on-module PMIC (5V->1.1V), while soldered designs must provide clean 1.1V-class rails with local bulk and high-frequency decoupling per the datasheet's decoupling network guidance. Verify VPP (the DDR5 wordline supply) provisioning as well - omitting the VPP rail is a common DDR5 first-revision error.
Verify the exact part number suffix (H5CG44AGBDX018N vs H5CG44AGBDX018) when ordering - the N suffix denotes SK hynix packaging/version coding and one distributor index (IBS) has mislabeled this family as DDR3. Always confirm the die is DDR5, the x4 organization, and the -018 (5600) speed code against the datasheet and module SPD before purchase, since speed-code mismatches fail memory training at boot.
合规信息
Compliance data was not published in the verified web sources reviewed as of 2026-09-05. Request SK hynix compliance certificates with your RFQ.
