H5CG44AGBDX018 - 16Gb DDR5-5600 SDRAM x4 | SK hynix
MPN: H5CG44AGBDX018 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.5 | $6.50 |
| 10 | $5.98 | $59.80 |
| 100 | $5.45 | $545.00 |
| 500 | $4.92 | $2,460.00 |
| 1,000 | $4.48 | $4,480.00 |
Drop-in alternatives for H5CG44AGBDX018 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
H5CG48AGBDX018N
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View Datasheet →H5CG48AGBDX018
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View Datasheet →H5CG46AGBDX017N
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View Datasheet →H5CG46AGBDX015
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View Datasheet →H5CG26AGBDX021
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View Datasheet →H5CG44AGBDX018 Maximum Ratings & Electrical Characteristics
| Manufacturer | SK hynix |
| Product Type | DDR5 SDRAM |
| Density | 16 Gbit (4Gx4) |
| Organization | x4 (4G x 4) |
| Speed Grade | DDR5-5600 |
| Data Rate | 5600 Mbps/pin |
| Package | FBGA |
| Mounting Type | Surface Mount |
| Memory Type Hierarchy | DRAM > DDR SDRAM > DDR5 |
| ECC | On-die ECC (DDR5 standard feature) |
| Supply Voltage Class | 1.1 V class (DDR5 VDD/VDDQ) |
| Application Domains | Server modules, computing modules, industrial controllers |
H5CG44AGBDX018 [data_needed: package dimensions] Pin Configuration Guide
Complete pinout information for H5CG44AGBDX018 ([data_needed: package dimensions] package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
![[data_needed: package dimensions] package pinout diagram for H5CG44AGBDX018](/assets/package-diagrams/default.svg?v=1788069619)
No detailed pinout data available for H5CG44AGBDX018.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H5CG44AGBDX018 is suitable for 6 applications: Server RDIMM Modules, AI and Big Data Computing, Embedded Computing Modules, Firmware Boot and Embedded Logging, Memory Replacement and Rework Sourcing, Data Center Storage Controllers.
Server RDIMM Modules
The H5CG44AGBDX018 is a primary building block for DDR5 registered DIMMs in data-center servers. Its 16Gb density in x4 organization lets module builders populate 72-bit ECC-protected buses efficiently, and the DDR5-5600 speed grade matches the memory controllers of current Intel and AMD server platforms. SK hynix delivered the world's first DDR5 in server solutions, so qualification data and platform compatibility are mature. In a typical RDIMM, the die operates at a 1.1V-class supply with power regulated by the on-module PMIC; on-die ECC improves reliability without host-side overhead. At 5600 Mbps per pin, design attention focuses on fly-by routing and SPD programming rather than per-die tuning, making high-volume module builds repeatable.
Recommended
AI and Big Data Computing
AI training and big data analytics platforms are the flagship DDR5 use case that SK hynix targets with the H5CG4 series. According to SK hynix's DDR5 e-catalogue, next-generation DDR5 'will enable the era of AI and big data' by improving speed and power over DDR4. The H5CG44AGBDX018 contributes 5600 Mbps/pin bandwidth, directly raising effective memory throughput for GPU/accelerator hosts where memory bandwidth bounds model training speed. Its x4 organization supports high-capacity, ECC-corrected modules essential for multi-day training runs. When used between the CPU memory controller and module PMIC, the die's reduced 1.1V-class supply lowers per-DIMM power, easing thermal budgets in dense AI servers.
Recommended
Embedded Computing Modules
Embedded computing modules (COMs) and industrial controllers adopt soldered-down DDR5 dies such as the H5CG44AGBDX018 to gain DDR5 bandwidth in compact form factors. Datasheet-directory product listings for the H5CG44 series cite computing modules, industrial controllers, firmware boot, and embedded logging as target uses. The 16Gb die provides substantial working memory for Linux-based gateways and edge AI boxes while the FBGA package withstands industrial vibration better than socketed DIMMs. The 5600 Mbps rate gives headroom for image and sensor data pipelines; designers should confirm the controller's DDR5-5600 training support and derate for extended temperature ranges per the manufacturer datasheet.
Recommended
Firmware Boot and Embedded Logging
System designers use DDR5 DRAM dies like the H5CG44AGBDX018 as fast working memory behind firmware boot stages and embedded logging buffers. After boot from NOR flash, runtime code and log structures execute from DRAM, and the 16Gb capacity of this die accommodates large in-memory log buffers for diagnostics in industrial and network equipment. The x4 organization keeps the memory controller interface narrow, simplifying routing on dense controller boards. DDR5's on-die ECC protects log integrity against soft errors, an important property for audit-trail logging. Operation at the DDR5-5600 bin shortens boot-time memory training and initialization compared with slower bins, reducing cold-start time in appliances requiring fast power-on-to-ready behavior.
Recommended
Memory Replacement and Rework Sourcing
The H5CG44AGBDX018 is heavily used in component-level repair of DDR5 server modules and systems, a sourcing channel visible in distributor listings (PCX, Fusion Worldwide, Win Source). When a single die on a module fails or an older platform needs DDR5 stock, matching the exact H5CG4 speed code (-018 for DDR5-5600) preserves module SPD and training behavior. Buyers should request date-code and lot consistency when replacing multiple dies, and re-run module-level memory test after rework. Because this is a quote-driven broker market, availability fluctuates; keeping same-family alternates such as H5CG48AGBDX018N on the approved list improves procurement resilience for service organizations.
Recommended
Data Center Storage Controllers
Storage controllers and smart NICs in data centers use soldered DDR5 dies such as the H5CG44AGBDX018 as cache and metadata memory. The 5600 Mbps/pin data rate and 16Gb per-die capacity deliver the read/write bandwidth that SSD controllers need for DRAM-backed FTL (flash translation layer) tables. The x4 organization aligns with controller memory interfaces that assemble ECC-protected buses from multiple x4 devices. DDR5's lower 1.1V-class supply reduces controller-board power compared with DDR4-based predecessors - relevant in storage shelves with strict per-slot thermal limits. Designers should validate address mapping and refresh interval settings against the controller's DDR5 PHY configuration and the SK hynix datasheet.
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Recommended Products Summary
Engineering reference data for H5CG44AGBDX018 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H5CG48AGBDX018N | H5CG48AGBDX018 | H5CG46AGBDX017N | H5CG26AGBDX021 |
|---|---|---|---|---|---|
| Package | FBGA | FBGA - same family | FBGA - same family | FBGA - same family | FBGA - same family |
| Brand | SK hynix | SK hynix | SK hynix | SK hynix | SK hynix |
| Memory Type | DDR5 SDRAM | DDR5 SDRAM | DDR5 SDRAM | DDR5 SDRAM | DDR5 SDRAM |
| Organization | x4 (4G x 4) | x4 (H5CG4 series) | x4 (H5CG4 series) | x4 (H5CG4 series) | x4 (H5CG2 series) |
| Density | 16 Gbit | H5CG4 density class | H5CG4 density class | H5CG4 density class | H5CG2 density class [DATA_NEEDED] |
| Speed Grade | DDR5-5600 (-018) | -018 (DDR5-5600 class) | -018 (DDR5-5600 class) | -017 (lower speed bin) | -021 [DATA_NEEDED] |
| Data Rate | 5600 Mbps/pin | 5600 Mbps/pin class | 5600 Mbps/pin class | [DATA_NEEDED] | [DATA_NEEDED] |
| ECC | On-die ECC (DDR5 standard) | On-die ECC | On-die ECC | On-die ECC | On-die ECC |
Key Differentiators
- Top DDR5-5600 speed bin (-018 code) (vs H5CG46AGBDX017N)
- 16Gb x4 organization optimized for ECC modules (vs H5CG26AGBDX021)
- Mature SK hynix DDR5 server qualification (vs MT62F3G32D8DV-023 (Micron))
Design Notes
At DDR5-5600, per-pin data rates of 5600 Mbps leave little timing margin. Follow the SK hynix DDR5 module design guide for fly-by command/address routing, matched-length DQ/DQS groups, and reference-plane continuity. On soldered-down (non-DIMM) designs, keep DRAM-to-controller trace lengths within the controller's PHY training window and simulate eye diagrams at the target data rate before committing the stack-up.
DDR5 uses a 1.1V-class VDD/VDDQ supply; in module designs power conversion is handled by an on-module PMIC (5V->1.1V), while soldered designs must provide clean 1.1V-class rails with local bulk and high-frequency decoupling per the datasheet's decoupling network guidance. Verify VPP (the DDR5 wordline supply) provisioning as well - omitting the VPP rail is a common DDR5 first-revision error.
Verify the exact part number suffix (H5CG44AGBDX018N vs H5CG44AGBDX018) when ordering - the N suffix denotes SK hynix packaging/version coding and one distributor index (IBS) has mislabeled this family as DDR3. Always confirm the die is DDR5, the x4 organization, and the -018 (5600) speed code against the datasheet and module SPD before purchase, since speed-code mismatches fail memory training at boot.
Compliance Information
Compliance data was not published in the verified web sources reviewed as of 2026-09-05. Request SK hynix compliance certificates with your RFQ.
