H5CG44AGBDX018N - 16Gb DDR5-5600 SDRAM x4 | SK Hynix
MPN: H5CG44AGBDX018N ✓ Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for H5CG44AGBDX018N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
H5CG44AGBDX018
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$4.48 / Unit
View Datasheet →H5CG46AGBDX017N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$91.73 / Unit
View Datasheet →H5CG48AGBDX018N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$87.42 / Unit
View Datasheet →H5CG44AGBDX018N Maximum Ratings & Electrical Characteristics
| Memory Type | DDR5 SDRAM |
| Density | 16 Gb |
| Organization | 4G x 4 |
| Speed Grade | DDR5-5600 |
| Data Rate | 5600 MT/s |
| Package | FBGA |
| Mounting Type | Surface Mount |
| Interface | DDR5 (DQS strobe-aligned, on-die termination) |
| Bit Width per Die | 4 bit |
| Product Family | SK Hynix H5CG series DDR5 |
| Application Domain | Servers, computing modules, industrial controllers |
H5CG44AGBDX018N fbga Pin Configuration Guide
Complete pinout information for H5CG44AGBDX018N (fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for H5CG44AGBDX018N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H5CG44AGBDX018N is suitable for 6 applications: Server RDIMM Main Memory, Industrial Computing Modules, Firmware Boot and Embedded Logging Buffers, Data Storage Controllers, Workstation and Desktop Memory Modules, Replacement Sourcing and Server Refurbishment.
Server RDIMM Main Memory
The H5CG44AGBDX018N fits server registered DIMM designs where 16Gb x4 DDR5-5600 die are the industry-standard building block. Its x4 organization aligns with chipkill-class error protection on RDIMM/LRDIMM buses, and the 5600 MT/s speed grade supports current server memory-controller bandwidth of roughly 45 GB/s per channel at DDR5-5600. Sixteen packages deliver a 32 GB module; the FBGA footprint matches standard DDR5 die land patterns. Designers benefit from on-die termination and the DDR5 fly-by command/address topology, but must length-match data groups and validate training at full speed. Supply is quote-based through distributors such as PCXco and WIN Source as of 2026-09-05.
Recommended
Industrial Computing Modules
Embedded computing modules (COMs, edge servers, factory controllers) use the H5CG44AGBDX018N as soldered-down main memory where SODIMM sockets are undesirable. The 16Gb density gives 2 GB per package, so a 4 GB industrial design needs only two FBGA parts, saving board area and improving vibration reliability versus socketed modules. The DDR5-5600 rating provides headroom above typical industrial memory clocks, and DDR5's lower operating voltage reduces module heat in sealed enclosures. Designers must confirm the datasheet temperature range against enclosure ambient and enable controller training for the populated die. Distributor data explicitly lists industrial controllers as a target application for this part.
Recommended
Firmware Boot and Embedded Logging Buffers
Systems that boot firmware into DRAM and log operational data use the H5CG44AGBDX018N as a high-bandwidth working buffer ahead of non-volatile storage. The x4 16Gb die provides 2 GB of buffer space per package, enough to absorb burst log writes from industrial controllers before flushing to NAND or NOR flash. DDR5-5600 bandwidth (about 2.8 GB/s per x4 package) minimizes write-queue latency, and DDR5's bank-group architecture improves random-access efficiency for logging workloads. Pair the DRAM with an SPI NOR boot flash and a memory controller that supports DDR5 training, and size refresh-aware power states to conserve energy during idle logging periods.
Recommended
Data Storage Controllers
RAID controllers, NVMe switches, and enterprise storage processors rely on x4 DDR5 DRAM for write caches and metadata tables. The H5CG44AGBDX018N's x4 organization is preferred in storage controllers because narrow-width devices work best with strong error-correction coverage across wide buses; losing one device affects fewer bits and correction remains effective. At DDR5-5600, a 72-bit RDIMM-style bus built from these die moves about 50 GB/s, sufficient to saturate multi-port NVMe front ends. FBGA packaging supports the high layer counts typical of controller boards, and quote-based availability through IBS Electronics and Fusion Worldwide suits controller program volumes as of 2026-09-05.
Recommended
Workstation and Desktop Memory Modules
High-end desktop and workstation platforms using x4 die (via RDIMM-style or CUDIMM designs) benefit from the H5CG44AGBDX018N's DDR5-5600 speed grade, which matches mainstream Intel and AMD memory-controller support. Sixteen packages populate a 32 GB unbuffered or registered module, and the x4 organization keeps per-bit cost low for large-capacity configurations. DDR5's two independent 32-bit subchannels per module improve small-packet efficiency for content-creation workloads compared with DDR4's single 64-bit channel. Designers must verify the platform's QVL (qualified vendor list) accepts SK Hynix H5CG44 die and configure SPD data correctly for the populated module configuration.
Recommended
Replacement Sourcing and Server Refurbishment
Server repair, refurbishment, and second-source programs procure the H5CG44AGBDX018N to remanufacture or repair DDR5 modules whose original die were damaged or obsolete. Because the part is an active SK Hynix product with broker stock (HKInventory lists 50,000-unit offers as of 2026-09-05), refurbishers can match original die markings and preserve module qualification. The critical practice is matching the exact suffix code (N vs non-N) and date-code class to the original population to keep module SPD and vendor lists intact. XAIPART supports RFQ-based sourcing with traceability, which is essential for enterprise refurbishment contracts requiring component provenance documentation.
Recommended
Recommended Products Summary
Engineering reference data for H5CG44AGBDX018N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H5CG44AGBDX018 | H5CG46AGBDX017N | H5CG48AGBDX018N |
|---|---|---|---|---|
| Package | FBGA | FBGA - same | FBGA - same family | FBGA - same family |
| Brand | SK Hynix | SK Hynix | SK Hynix | SK Hynix |
| Memory Type | DDR5 SDRAM | DDR5 SDRAM | DDR5 SDRAM | DDR5 SDRAM |
| Density | 16 Gb | 16 Gb | [DATA_NEEDED] | [DATA_NEEDED] |
| Organization | 4G x 4 | 4G x 4 | x4 family | x4 family |
| Speed Grade | DDR5-5600 | DDR5-5600 | [DATA_NEEDED] | [DATA_NEEDED] |
| Data Rate | 5600 MT/s | 5600 MT/s | [DATA_NEEDED] | [DATA_NEEDED] |
| Lifecycle Status | active | active | active | active |
Key Differentiators
- Exact-die drop-in replacement within SK Hynix catalog (vs H5CG44AGBDX018)
- x4 organization for error-protected buses (vs H5CG48AGBDX018N)
- DDR5-5600 speed grade headroom (vs H5CG46AGBDX017N)
Design Notes
DDR5-5600 demands disciplined layout: length-match data groups (DQ/DM/DQS) within tight skew budgets, route command/address on the fly-by topology with per-DIMM termination, and maintain continuous reference planes under all DDR5 traces. Enable controller write leveling, read training, and per-rank VrefDQ training during bring-up; the H5CG44AGBDX018N's on-die termination values should be programmed per SK Hynix recommendations in the datasheet rather than copied from DDR4 designs, as DDR5 termination tables differ.
DDR5 operates at a lower supply voltage class than DDR4, and DDR5 modules place the PMIC on the module instead of the chipset. For soldered-down H5CG44AGBDX018N designs, provide a dedicated 1.1 V-class VDD rail with low-impedance decoupling at each FBGA ball group, plus separate VDDQ rails per the datasheet power-distribution table. Calculate total current from the number of populated packages; a 16-package 32 GB design requires proportionally more rail current and bulk capacitance than a 2-package embedded design.
Do not assume suffix interchangeability without qualification: H5CG44AGBDX018N and H5CG44AGBDX018 share the same die but the suffix encodes packaging attributes that some procurement contracts track. Also avoid mixing density/speed codes (H5CG46, H5CG48) within one memory channel, since memory training expects uniform populations. Finally, when sourcing from brokers, verify date codes and request traceability, as DRAM is a common counterfeit target in spot markets.
Compliance Information
Compliance status was not stated in the retrieved distributor data; request material declarations from SK Hynix via RFQ.
