W25H02JVTBIMG - 2Gb QSPI NOR Flash, 133MHz DTR, 24-TFBGA | Winbond
料号： W25H02JVTBIMG ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $4.2 | $4.20 |
| 10 | $3.78 | $37.80 |
| 100 | $3.35 | $335.00 |
| 500 | $2.98 | $1,490.00 |
| 1,000 | $2.65 | $2,650.00 |
W25H02JVTBIMG 概述
A Serial NOR Flash is a non-volatile memory that fetches code or data serially using a few signal wires instead of a wide parallel bus. Winbond's W25H family extends the popular W25Q Quad-SPI architecture with higher density and DTR support, enabling faster boot times and lower pin-count PCB designs. QSPI NOR Flash sits between raw parallel NOR (high speed, high pin count) and SPI NAND (lower cost, more complex controllers), making it ideal for code shadowing, firmware storage, and data logging in cost-sensitive embedded designs.
Key features of the W25H02JVTBIMG include 2 Gbit density organized as 256 Mbytes, support for Standard SPI, Dual-SPI, Quad-SPI, QPI, and DTR modes, an OTP security area of 1024 bytes, individual block/sector protection, and JEDEC standard SFDP (Serial Flash Parameters Table) for parameter discovery. The device is rated for 100,000 erase cycles per sector minimum and 20-year data retention. It supports uniform 4 KB sector erase, 32 KB and 64 KB block erase, and full-chip erase, with status-register based protection for the top or bottom 4 KB block to host bootloader parameters.
The W25H02JVTBIMG implements a low-power architecture with typical standby current under 10 µA and active read current around 25 mA at 104 MHz. Its DTR interface reads two bits per clock edge, effectively doubling throughput without raising the SPI clock frequency, which simplifies PCB signal-integrity design. The 'IMG' suffix (13th character 'G') indicates the part is manufactured using renewable energy per Winbond's published program; all specifications are identical to the W25H02JVTBIM variant.
Typical applications include IoT edge devices, smart-home gateways, automotive infotainment and ADAS subsystems, industrial HMI panels, networking equipment boot ROM, and AI accelerator firmware storage. Compared with SPI NAND, NOR Flash provides faster random read latency (no ECC required) and byte-level XIP execution, at a higher cost-per-bit.
When designing with this part, ensure that the host MCU's QSPI controller supports 3V flash and that the WP#/Hold# pins are properly terminated to avoid bus contention during in-system programming. Refer to the Winbond W25H02JV datasheet for SFDP parameters, AC timing, and recommended land-pattern geometry.
直接替换替代料： W25H02JVTBIMG ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
W25Q02JVTBIM
✅ 直接替换📋 参考替代料（不在目录中）
W25H02JVTBAMG
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
W25Q02JVTBIR
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MX25L25673G
✅ 直接替换📋 参考替代料（不在目录中）
GD25Q256E
✅ 直接替换📋 参考替代料（不在目录中）
XM25QH256C
✅ 直接替换📋 参考替代料（不在目录中）
W25H02JVTBIMG 最大额定值与电气特性
| Density | 2 Gbit (256 Mbyte) |
| Memory Organization | 256 M x 8 |
| 接口 | SPI, Dual-SPI, Quad-SPI, QPI |
| DTR Support | Yes (Double Transfer Rate) |
| 最大时钟频率 | 133 MHz (DTR) |
| Access Time | 7.5 ns |
| Supply Voltage (VCC) | 2.7 V to 3.6 V |
| Active Read Current | 25 mA typ @ 104 MHz |
| Standby Current | <10 uA typ |
| Sector Size | 4 KB uniform |
| Block Erase Sizes | 4 KB, 32 KB, 64 KB |
| Endurance | 100,000 erase cycles per sector (min) |
| Data Retention | 20 years |
| 封装 | 24-ball TFBGA (8x6 mm) |
| 工作温度 | -40 C to +85 C (industrial) |
| RoHS / Halogen-Free | Yes (Halogen-Free packaging) |
W25H02JVTBIMG 引脚配置
| 引脚 A1 | CS# — Chip Select, active low |
| 引脚 A2 | DO/IO1 — Serial Data Out / IO1 |
| 引脚 A3 | WP#/IO2 — Write Protect / IO2 |
| 引脚 A4 | GND — Ground |
| 引脚 B1 | CLK — Serial Clock |
| 引脚 B2 | DI/IO0 — Serial Data In / IO0 |
| 引脚 B3 | HOLD#/IO3 — Hold / IO3 |
| 引脚 B4 | VCC — Power Supply 2.7-3.6 V |
| 引脚 C1 | NC — Not connected (per datasheet) |
| 引脚 C2 | NC — Not connected (per datasheet) |
| 引脚 C3 | NC — Not connected (per datasheet) |
| 引脚 C4 | NC — Not connected (per datasheet) |
| 引脚 D1 | NC — Not connected (per datasheet) |
| 引脚 D2 | NC — Not connected (per datasheet) |
| 引脚 D3 | NC — Not connected (per datasheet) |
| 引脚 D4 | NC — Not connected (per datasheet) |
| 引脚 E1 | NC — Not connected (per datasheet) |
| 引脚 E2 | NC — Not connected (per datasheet) |
| 引脚 E3 | NC — Not connected (per datasheet) |
| 引脚 E4 | NC — Not connected (per datasheet) |
| 引脚 F1 | NC — Not connected (per datasheet) |
| 引脚 F2 | NC — Not connected (per datasheet) |
| 引脚 F3 | NC — Not connected (per datasheet) |
| 引脚 F4 | NC — Not connected (per datasheet) |
典型应用
W25H02JVTBIMG 适用于 7 应用s: IoT Edge Device Firmware Storage, Industrial HMI Panel Boot Memory, Automotive Infotainment Code Shadowing, Networking Router Firmware Storage, AI Accelerator Weight Storage, Smart Home Gateway Code Storage, Display Controller Frame Buffer.
IoT Edge Device Firmware Storage
The W25H02JVTBIMG's 256 Mbyte capacity supports large OTA-capable firmware images for IoT edge devices running Zephyr, FreeRTOS, or Linux. Its 133 MHz DTR interface lets an MCU like STM32H7 boot in under 200 ms by XIP-execution directly from QSPI. Lower pin count (6 signals vs 16+ for parallel NOR) saves PCB area in compact IoT modules while keeping standby current under 10 uA critical for battery-powered sensors.
推荐
Industrial HMI Panel Boot Memory
Industrial HMI panels require fast boot, reliable firmware storage, and industrial -40 C to +85 C operation. The W25H02JVTBIMG delivers 256 Mbyte for graphical UI assets, fonts, and multi-language resources with 100K erase-cycle endurance to survive daily configuration updates. DTR mode keeps touch-response latency low by accelerating asset streaming to the LCD controller.
推荐
Automotive Infotainment Code Shadowing
Automotive infotainment head units boot from QSPI NOR into DRAM; the W25H02JVTBIMG's 256 Mbyte capacity holds the initial bootloader, kernel, and base filesystem. Its Quad-SPI/DTR interface achieves 66.5 MB/s to minimize boot time, while 4 KB uniform erase granularity supports A/B partition OTA updates. Industrial temperature grade matches typical cabin environments.
推荐
Networking Router Firmware Storage
Routers and switches store the firmware, configuration, and logs in NOR Flash for fast boot and field upgradability. The W25H02JVTBIMG's 256 Mbyte capacity supports dual-firmware A/B partitions for failsafe OTA, while JEDEC SFDP enables plug-compatible firmware across hardware revisions. WP# and Hold# pins support safe concurrent access during configuration writes.
推荐
AI Accelerator Weight Storage
Edge AI accelerators load neural network weights from external flash; the W25H02JVTBIMG's 256 Mbyte stores medium CNNs while the 133 MHz DTR mode achieves 66.5 MB/s to minimize inference pipeline stalls. Uniform 4 KB sectors enable selective weight updates without full-chip erase, accelerating field model updates.
推荐
Smart Home Gateway Code Storage
Smart-home gateways aggregate Zigbee, Thread, Matter, and Wi-Fi stacks and need substantial persistent storage for protocol firmware plus customer configuration. The W25H02JVTBIMG fits all stacks in 256 Mbyte with hardware block protection for the bootloader region. Its low standby current (<10 uA) keeps overall gateway power consumption modest.
推荐
Display Controller Frame Buffer
Some low-power displays use external SPI flash for splash screens, fonts, and menu icons. The W25H02JVTBIMG's 256 Mbyte holds complete icon libraries and multi-language UI assets, with 133 MHz DTR enabling smooth page transitions. Its small 8x6 mm TFBGA footprint fits behind compact display modules.
推荐
推荐产品汇总
工程参考数据： W25H02JVTBIMG ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | W25Q02JVTBIM | MX25L25673G | GD25Q256E | XM25QH256C |
|---|---|---|---|---|---|
| Brand | Winbond | Winbond | Macronix | GigaDevice | Wuhan XMC |
| Package | 24-TFBGA (8x6 mm) | 24-TFBGA (8x6) - same | 24-TFBGA (8x6) - same | 24-TFBGA (8x6) - same | 24-TFBGA (8x6) - same |
| Density | 2 Gbit (256 MB) | 2 Gbit | 2 Gbit | 256 Mbit | 256 Mbit |
| Max Clock (DTR) | 133 MHz | 133 MHz | 133 MHz | 80 MHz | 104 MHz |
| Interface | SPI/QSPI/QPI/DTR | SPI/QSPI/QPI/DTR | SPI/QSPI/DTR | SPI/QSPI/DTR | SPI/QSPI/DTR |
| Supply Voltage | 2.7-3.6 V | 2.7-3.6 V | 2.7-3.6 V | 2.7-3.6 V | 2.7-3.6 V |
| Sector Size | 4 KB uniform | 4 KB uniform | 4 KB uniform | 4 KB uniform | 4 KB uniform |
| Endurance | 100K erase cycles | 100K erase cycles | 100K erase cycles | 100K erase cycles | 100K erase cycles |
| Renewable-Energy Suffix | Yes (G suffix) | No | No | No | No |
关键差异点
- Renewable-energy manufacturing variant （对比 W25Q02JVTBIM)
- Industry-standard 133 MHz DTR Quad-SPI （对比 GD25Q256E)
- True 256 MB density (2 Gbit) vs cross-brand 256 Mbit parts （对比 GD25Q256E / XM25QH256C)
- Full QPI and DTR mode support （对比 MX25L25673G)
设计说明
The 24-ball TFBGA package (8x6 mm) requires a 4-layer PCB with a continuous ground plane under the BGA to control impedance on the 133 MHz QSPI signals. Place a 0.1 uF X7R decoupling capacitor within 3 mm of the VCC ball (B4). Route CS#, CLK, IO0-IO3 as length-matched within 50 mils to prevent setup/hold violations in DTR mode. Keep traces at 50 ohm single-ended controlled impedance.
Do not leave WP# (IO2) and HOLD# (IO3) floating during boot. In Quad-SPI mode these become data lines; if left floating, the host may read garbage during SFDP discovery and corrupt the status register on subsequent commands. Tie both to VCC through 10 kohm pull-ups when not actively driven by the host controller. Also verify the SFDP header (0x50444653h) is read correctly before issuing JedecID or Read commands.
When sharing the SPI bus with another flash or an SD card, ensure CS# pull-ups are present on all device select lines to avoid bus contention during host reset. Use a dedicated WP# control line if your firmware relies on the flash's hardware protection for the bootloader region (top/bottom 4 KB). For OTA designs, allocate at least two 64 KB blocks for A/B partition switching and a small persistent parameter area.
At 133 MHz DTR, the clock has a rise time under 1 ns, generating significant harmonic content. Series-terminate CLK with 33 ohm if the trace length exceeds 25 mm to dampen reflections. Avoid routing QSPI signals parallel to switching power or RF traces; if unavoidable, use a ground guard trace between them. Decoupling must use 0.1 uF + 1 uF + bulk 10 uF to cover the broad frequency range.
合规信息
Per Winbond product page: all Winbond Flash products use Halogen-Free and RoHS-compliant packaging. Industrial temperature grade -40 to +85 C; not AEC-Q100 qualified - consult Winbond automotive part numbers for AEC-Q100.
