FPGA & CPLD
Products (6358)
EP1S25F672C8N - Stratix 25K LE FPGA, 672-FBGA, 1.5V | Intel
The Intel EP1S25F672C8N is a member of the original Stratix FPGA family, integrating 25,660 logic elements, 1,944 Kbit of embedded memory, and dedicated DSP blocks within a 672-ball FineLine BGA package. Manufactured on a 130 nm CMOS process and supplied from a 1.5 V core rail, the device delivers up to 357 MHz internal operation and is offered in a commercial 0 °C to 85 °C temperature grade. The 'C8' speed grade denotes a -8 speed bin, and the 'N' suffix indicates a lead-free, RoHS-compliant package. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows engineers to implement arbitrary digital logic through SRAM-based configuration cells. Within the broader taxonomy, an FPGA belongs to programmable logic -> logic IC -> integrated circuit -> semiconductor. The Stratix family was Intel's (formerly Altera's) first high-end FPGA family built on a 1.5 V core, introducing embedded TriMatrix memory, DSP blocks, and high-speed transceivers in a single fabric. These architectural elements positioned Stratix as the predecessor to Stratix II, III, and the modern Stratix 10 families. Key features of the EP1S25F672C8N include 25,660 logic elements (LEs), 1,944 Kbit of embedded RAM (in three memory block sizes), twelve embedded DSP blocks optimized for multiplication and multiply-accumulate operations, six phase-locked loops (PLLs), and up to 426 user I/O pins depending on the package's I/O bank count. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, with eight I/O banks that allow flexible voltage reference selection. Architecturally, the Stratix core combines a multi-level routing hierarchy (LAB, MegaLAB) with embedded memory, multipliers, and PLL resources distributed throughout the fabric. The 1.5 V core is paired with selectable I/O voltages per bank via VREF pins, allowing the same die to interface with 1.5 V, 1.8 V, 2.5 V, or 3.3 V peripherals without level shifters. The configuration scheme supports passive serial (PS), passive parallel synchronous/asynchronous (PPS/PPA), JTAG, and Altera's EPC configuration devices. Typical applications include high-throughput digital signal processing (software-defined radio, video processing), custom protocol bridging and packet processing in telecom line cards, ASIC prototyping and emulation, high-speed data acquisition front-ends, and industrial imaging pipelines. The DSP-rich fabric makes it particularly attractive for digital filters, FFT engines, and baseband processing in mid-2000s-generation designs. When designing with this part, verify Quartus II version support for the EP1S25 family before starting firmware work. Modern toolchains (Quartus II v13.x) still support Stratix but may not include the latest security patches; users targeting new designs should evaluate Stratix II or Cyclone IV for active tool support, while existing EP1S25 boards may rely on legacy Quartus flows for long-term maintenance. This page synthesizes distributor stock, parametric comparisons against other Stratix density points, and practical design notes (decoupling, JTAG, configuration) not consolidated on any single manufacturer or distributor page.
EP1S25F672I7 - Stratix FPGA 25660 LE, 672-FBGA | Intel / Altera
The Intel (formerly Altera) EP1S25F672I7 is a member of the Stratix FPGA family delivering 25,660 logic elements, 1,944,576 bits of embedded RAM, and 473 user I/O pins in a 672-ball FineLine BGA package. Built on a 0.13 µm CMOS process, this device integrates 2,566 LABs/CLBs, up to 6 embedded DSP blocks, and high-speed serial interfaces suited for data-path intensive designs. A Field Programmable Gate Array (FPGA) is a programmable semiconductor device whose logic fabric, interconnect, and I/O cells can be configured after manufacture to implement arbitrary digital functions ranging from glue logic to full system-on-chip prototypes. FPGAs sit between fixed-function ASICs and software-driven processors in the design hierarchy, offering hardware-timed parallelism for DSP, communications, and protocol bridging. The Stratix family specifically targets high-performance applications with embedded multipliers, memory blocks, and dedicated clock management circuitry, positioning it within the broader class of programmable logic devices (PLDs) under the semiconductor category. Key features include 473 maximum user I/O pins, a 1.5 V core supply voltage, 1.27 mm ball pitch, and industrial-grade operating temperature range of -40 °C to +100 °C (industrial) per datasheet, with 0 °C to +85 °C noted in some distribution listings. The device supports in-system programmability via JTAG, dedicated configuration circuitry, and multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL through dedicated I/O banks. Typical applications include telecom baseband processing, high-speed serial protocol bridging, software-defined radio, video processing pipelines, and ASIC prototyping. Its combination of dense logic, embedded RAM, and high I/O count makes it well suited for designs requiring parallel datapath implementation alongside flexible I/O configuration. When designing with this device, ensure PCB layout accommodates the 672-ball FBGA with controlled-impedance routing for high-speed LVDS pairs and adequate decoupling per Altera's Stratix hardware reference design. The device's obsolete lifecycle status means new designs should consider Cyclone IV/V or Stratix IV/V successors; existing designs should source from authorized distributors carrying traceable stock. This page synthesizes distributor pricing, drop-in alternatives, and engineering notes not consolidated elsewhere.
EP1S25F672I7N - 25,660 LE Stratix FPGA, 672-FBGA | Intel / Altera
The Intel (formerly Altera) EP1S25F672I7N is a member of the original Stratix FPGA family, integrating 25,660 logic elements, 1.9 Mbits of embedded TriMatrix memory, and DSP blocks in a 672-ball FineLine BGA package. Fabricated on a 1.5 V, 0.13 µm CMOS process, the device supports embedded multipliers, high-speed I/O, and up to 473 user I/O pins at user-defined I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The industrial speed grade -7 variant operates across 0 °C to 85 °C junction range. An FPGA (Field Programmable Gate Array) is a reconfigurable digital logic device that allows hardware designers to implement arbitrary digital functions after PCB assembly. Stratix devices occupy the high-density, feature-rich tier of the Altera/Intel programmable logic hierarchy, sitting above Cyclone (cost-optimized) and below Stratix GX (transceiver-equipped) and Stratix II/GX (next-generation). Within a power management or embedded system, FPGAs serve as hardware accelerators, protocol bridges, glue logic, and signal-processing engines. FPGAs differ from MCUs in that logic and interconnect are user-defined rather than fetched from firmware, enabling deterministic parallel throughput. Key features of the EP1S25F672I7N include up to 25,660 logic elements, 1.9 Mbit embedded TriMatrix memory, dedicated 18×18 multipliers for DSP, support for high-speed external memory interfaces such as DDR SDRAM, QDR SRAM, and ZBT SRAM, and dedicated serial configuration support via passive serial, fast passive parallel, and JTAG. The 672-pin FineLine BGA package measures 35 × 35 mm with 1.27 mm pitch and is optimized for high pin-count, multi-layer PCB layouts. Architecturally, the Stratix family introduced the TriMatrix memory architecture with three block sizes (M512, M4K, M-RAM) to optimize silicon area across distributed and buffer-style memory requirements. The 1.5 V core supply is supported by on-chip voltage regulation requiring only a single external supply input, simplifying power tree design compared to earlier 2.5 V / 3.3 V core architectures. Typical applications include telecom line-card packet processing, military/aerospace signal processing, medical imaging accelerators, industrial machine vision, and ASIC prototyping. The wide DSP block density also suits software-defined radio baseband and digital video broadcasting infrastructure. When designing with this device, allocate 1.5 V core and dedicated PLL/IO supply rails with decoupling placed close to each BGA quadrant. Use Altera Quartus II (legacy) or Intel Quartus Prime for synthesis, place-and-route, and timing closure. Note that this part is mature legacy silicon; new designs should consider Stratix IV/V or Cyclone families for active long-term supply. This page synthesizes distributor availability, same-family Stratix drop-in alternatives, and practical configuration guidance not collected in the original manufacturer datasheet alone.
EP1S25F780C5 - Stratix I FPGA, 25,660 LEs, 597 I/O, 780-FBGA | Altera / Intel
The Altera (now Intel) EP1S25F780C5 is a member of the Stratix I family of SRAM-based Field-Programmable Gate Arrays, integrating 25,660 Logic Elements, 2,566 Logic Array Blocks (LABs), and 1,944,576 bits of embedded RAM in a 780-ball FineLine BGA (FBGA) package with 597 user I/O pins. Built on a 0.13 µm process, the device is organized around Altera's MultiTrack interconnect and embedded TriMatrix memory architecture, delivering up to 7.6 Gbps LVDS performance and dedicated DSP blocks for high-throughput arithmetic. An FPGA (Field-Programmable Gate Array) is a programmable logic device in the semiconductor hierarchy: FPGA -> programmable logic -> ASIC-class device -> integrated circuit. FPGAs are used to implement custom digital logic, glue logic, signal processing pipelines, and high-speed interfaces after the PCB has been fabricated, enabling late-stage design changes and accelerating time to market versus a full ASIC. Stratix I FPGAs were Altera's first generation to combine embedded multipliers, large TriMatrix memory blocks, and high-speed LVDS transceivers on a single die. Key differentiating features include 80 (typical) embedded DSP blocks for 9x9-bit to 36x36-bit multiplication, 14 clock networks with up to 8 PLLs per device, support for external memory interfaces such as DDR SDRAM, QDR SRAM, and ZBT SRAM, and 1.5 V core operation. The 780-FBGA package exposes 597 user I/O across 8 banks, providing abundant LVDS pairs and routing flexibility for memory-rich and I/O-intensive designs. The architecture is well suited to telecom line cards, digital video broadcasting equipment, and high-speed serial interfaces where a large logic budget plus embedded multipliers reduce external component count. The 'C5' speed grade trades absolute Fmax for lower static power, making the C5 variant a typical choice for industrial-grade designs that prioritize thermal margin over raw clock rate. Typical applications include telecom baseband processing, software-defined radio (SDR), high-end image processing, and ASIC prototyping platforms. Designers should pay particular attention to power estimation with the Quartus II PowerPlay tool because the static current scales strongly with VCCINT and junction temperature.
EP1S25F780C5N - 25K LE Stratix FPGA 780-FBGA | Intel
The Intel EP1S25F780C5N is a high-density Stratix-family Field-Programmable Gate Array (FPGA) built on a 130 nm CMOS process and packaged in a 780-ball FineLine BGA (FBGA) measuring 29 x 29 mm with a 1.0 mm ball pitch. It integrates 25,660 logic elements across 2,566 Logic Array Blocks (LABs) and provides up to 597 user I/O pins, making it one of the largest members of the first-generation Stratix family. The device operates from a 1.5 V core supply and supports commercial-extended temperature grades (0 to 85 C). An FPGA is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs) connected by programmable interconnect. The bitstream stored in on-chip SRAM configures both the logic function of each block and the routing between them. FPGAs are widely used for high-performance parallel processing, glue logic, prototyping, and ASIC replacement where time-to-market matters more than per-unit cost. The Stratix family in particular was the first Intel/Altera platform to embed dedicated DSP blocks, TriMatrix memory, and high-speed transceivers on-chip. Key features of the EP1S25F780C5N include up to 1.92 Mbits of embedded TriMatrix memory, dedicated DSP blocks for fixed- and floating-point arithmetic, support for multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS, LVPECL), and 4 phase-locked loops (PLLs) for clock management. The 597 user I/O pins are organized into 12 I/O banks, supporting a wide range of single-ended and differential interfaces including PCI, PCI-X, DDR, and RapidIO. The 780-pin FBGA package enables high signal density for complex board designs. The device supports configuration via passive serial, passive parallel synchronous, passive parallel asynchronous, and JTAG modes. Configuration bitstreams are stored in external EEPROM or flash and loaded into on-chip SRAM at power-up. The 130 nm process provides a mature, well-characterized fabric with proven reliability for telecom, industrial, and military applications. Typical applications include high-throughput digital signal processing (radar, software-defined radio, video processing), telecom line cards, ASIC prototyping, industrial control systems, and high-speed serial interface bridging. The combination of large logic capacity and dedicated DSP blocks makes the EP1S25 well suited for data-path intensive designs where parallel arithmetic performance is critical. When designing with this device, pay close attention to power sequencing and decoupling. The 780-FBGA package requires a multi-layer PCB with continuous power and ground planes. Use the Quartus II design software (version 5.x or later, as required for the Stratix family) for synthesis, place-and-route, and timing closure. Note that the EP1S25 series is end-of-life as newer Stratix/Cyclone generations have superseded it; consult the Intel/Altera Product Discontinuance notices before committing to long-lifecycle designs. This page synthesizes current distributor pricing, lifecycle status, drop-in same-package alternatives, and Quartus II design considerations not found in the original manufacturer datasheet alone. Engineers evaluating the EP1S25F780C5N should cross-reference part numbers EP1S25F672I7N, EP1S20F780C5N, and EP1S10F780C5N as same-package and same-family drop-in alternatives already catalogued on this site.
EP1S25F780C6 - Stratix FPGA 25K LE, 597 I/O, 780-FBGA | Altera
The Altera EP1S25F780C6 is a member of the original Stratix FPGA family built on a 130 nm CMOS process, integrating 25,660 logic elements, 1,944,576 bits of embedded RAM, and 597 user I/O in a 780-ball FineLine BGA package. Operating from a 1.5 V core supply (with multi-volt I/O support), the device delivers up to 450 MHz internal performance and is rated for the commercial 0C to 85C temperature range (the "C6" speed grade). What is a Stratix FPGA? The Stratix family is Altera's first-generation high-performance FPGA architecture (introduced 2002), combining programmable logic, embedded memory blocks (TriMatrix), embedded multipliers (DSP blocks), and high-speed transceivers in a single device. FPGAs sit at the top of the programmable-logic hierarchy - above CPLDs - and below ASICs - giving engineers a reconfigurable alternative to custom silicon. Stratix devices were widely adopted in telecom line cards, military signal processing, and high-speed serial-link prototypes during the mid-2000s. Key features include dedicated DSP blocks for high-throughput multiply-accumulate operations, support for external memory interfaces including DDR SDRAM and QDR SRAM via dedicated DQS circuitry, embedded PLLs for clock management, and configuration via passive serial, fast passive parallel, or JTAG modes. The 780-pin FBGA package exposes the full I/O count and supports multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS, LVPECL) on a per-pin basis, enabling direct interfacing to parallel buses, memory chips, and differential signaling links. Technical depth: the EP1S25 is fabricated in 1.5 V 130 nm CMOS with copper interconnect, contains 2,566 LABs (logic array blocks), and offers TriMatrix memory architecture (MRAM, M4K, M512 blocks). The 1.5 V core combined with selectable I/O voltages (1.5/1.8/2.5/3.3 V) allows bridging between legacy 5 V-TTL peripherals and modern low-voltage memory. Typical applications include telecom line-card interface logic, military/aerospace signal processing, custom DSP pipelines, bus-bridging glue logic between processors and peripherals, and prototype ASIC verification using the Stratix logic density. When designing with this legacy device, note that new designs should generally target Cyclone or Arria families; the EP1S25F780C6 is best reserved for sustaining production of existing Stratix-based boards where proven firmware and proven PCB layouts must be preserved.
EP1S25F780C6N - Stratix 25K LE FPGA, 597 I/O, 780-BGA | Altera
The Altera (now Intel) EP1S25F780C6N is a Stratix family Field Programmable Gate Array (FPGA) built on a 130nm process, offering 25,660 logic elements and 1,944,576 bits of embedded memory in a 780-ball FineLine BGA (FC-FBGA) package. It provides 597 user I/O pins and is rated for commercial temperature operation (0C to +85C). The device includes 80 DSP blocks and 12 PLLs, making it suitable for high-performance digital signal processing and high-speed serial interfacing. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O cells that allow engineers to implement arbitrary digital logic. FPGAs occupy the high-performance tier above microcontrollers and CPLDs in the programmable logic hierarchy, delivering parallel processing, deterministic timing, and the ability to be re-programmed in-system. The Stratix family, introduced by Altera in 2002, was the company's first FPGA family built on a 0.13 micron process and was positioned for high-end DSP, communications infrastructure, and ASIC prototyping applications. Key features include support for up to 12 channels of high-speed transceivers depending on die variant, embedded TriMatrix memory blocks distributed throughout the fabric, and up to 80 DSP blocks optimized for high-throughput multiplication-accumulation operations. The 780-FBGA package exposes 597 user I/O pins and supports vertical migration within the Stratix family, allowing engineers to design PCBs that accommodate EP1S10, EP1S20, and EP1S25 density points on a single footprint. Architecture-wise, the EP1S25F780C6N integrates a network of LUT-based logic elements, embedded array blocks (EABs), and a hierarchical interconnect fabric routed by Altera's Quartus II design software. The on-chip PLLs provide clock multiplication, division, and phase shifting for high-speed synchronous designs. Configuration is supported via JTAG, passive serial, or passive parallel modes through dedicated configuration pins. Typical applications include high-speed data acquisition cards, telecommunications switching fabric, ASIC prototyping, video broadcast equipment, and military/aerospace signal processing. The wide I/O count and high logic density make it well suited for multi-channel DSP systems and complex state machines. When designing with this part, ensure that your PCB layout respects the FBGA ball pitch requirements and that thermal management accounts for the higher power dissipation typical of Stratix devices at full utilization. Use Altera Quartus II design software (version 13.0 or earlier for legacy support) for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP1S25F780C7 - Stratix 25K LEs, 780-BGA FPGA | Intel / Altera
The Intel / Altera EP1S25F780C7 is a Stratix family Field Programmable Gate Array (FPGA) fabricated on a 130 nm CMOS process, delivering 25,660 logic elements, 597 user I/Os, and 1,944,576 bits of embedded memory. It is housed in a 780-ball FineLine BGA (FC-FBGA) package measuring 29 x 29 mm with 1 mm ball pitch, and operates from a 1.5 V core supply at up to 420.17 MHz internal performance. A Stratix FPGA is a SRAM-based, look-up-table-driven programmable logic device that integrates configurable logic blocks (CLBs / LEs), embedded memory arrays, DSP blocks, high-speed transceiver circuitry, and a programmable interconnect fabric on a single die. Stratix sits in the FPGA hierarchy as: FPGA > programmable logic device > SRAM-based FPGA > high-performance FPGA. The architecture targets high-bandwidth, compute-intensive digital systems where deterministic timing and parallel processing are required. The EP1S25F780C7 includes 2,566 LABs (Logic Array Blocks) each containing ten logic elements, embedded DSP blocks for fixed- and floating-point arithmetic, TriMatrix on-chip memory (MRAM blocks), and up to 12 channels of high-speed 840 Mbps LVDS signaling per device. The 'F' suffix indicates the FineLine BGA package, '780' denotes the 780-ball pinout, 'C7' indicates the commercial temperature grade (0C to +85C) and speed grade 7. The device supports configuration via passive serial, fast passive parallel, JTAG, or Altera EPC configuration devices. Typical applications for the EP1S25F780C7 include telecom line cards, high-performance DSP pipelines, baseband signal processing in wireless infrastructure, network switches and routers, broadcast video processing, and ASIC prototyping. The high LE count combined with embedded DSP blocks and multi-gigabit transceivers makes the device particularly suited to data-plane applications requiring deterministic parallel throughput. When designing with the EP1S25F780C7, ensure proper decoupling on each power rail (VCCINT, VCCIO, VCC_PLL, VCCA) using 0.1 uF and 10 uF ceramic capacitors placed close to the BGA balls. Plan PCB escape routing carefully: 1 mm pitch BGA requires microvia or via-in-pad technology on 6+ layer stack-ups. The device is now mature and was last produced in the original Stratix generation - for new designs, evaluate Cyclone 10, Arria 10, or Agilex families for active lifecycle support. This page synthesizes distributor pricing, drop-in speed-grade alternatives, package data, and practical design notes that complement the official datasheet.
EP1S25F780C7N - 25K LE Stratix FPGA, 597 I/O, 780-BGA | Intel
The Intel (Altera) EP1S25F780C7N is a member of the original Stratix FPGA family, delivering 25,660 logic elements, 1,944,576 bits of embedded memory, and 597 user I/O in a 780-ball FineLine BGA (FBGA) package. Built on a 1.5 V, 130 nm CMOS process, it integrates up to 420 MHz DSP blocks, embedded TriMatrix memory, and high-speed transceivers for digital signal processing and datapath-intensive designs. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor that lets designers implement arbitrary digital logic, memory, and I/O protocols in a single device. FPGAs sit within the broader taxonomy of programmable logic devices (PLD) -> complex programmable logic devices (CPLD) -> FPGAs -> high-density FPGAs -> SoC FPGAs, occupying the high-end segment where ASIC-class performance and flexibility are required. Key features of the EP1S25F780C7N include 2,566 LABs (Logic Array Blocks), dedicated DSP blocks delivering up to 4.29 GMACS performance, 12 embedded PLLs for clock management, and configurable I/O standards including LVDS, SSTL, and HSTL. The device supports both passive serial and fast passive parallel configuration schemes through dedicated JTAG and configuration pins. The Stratix architecture combines a hierarchical interconnect with embedded SRAM, distributed logic, and DSP multipliers, enabling high-throughput pipelined datapaths for DSP, communications, and image processing. The 780-ball FBGA package provides ample signal integrity for high-speed differential interfaces and offers a robust thermal path via the substrate. Typical applications include telecom baseband processing, software defined radio, high-speed image and video processing, ASIC prototyping, and PCI Express endpoint designs. The combination of high logic density, embedded multipliers, and high pin count makes it well suited to multi-channel DSP pipelines and protocol bridging subsystems. When designing with this device, plan configuration scheme (AS, PS, FPP, JTAG) up front, allocate enough decoupling (10 uF bulk + 0.1 uF per VCC/GND pair), and reserve clock and PLL pins early in the pin planner to avoid costly re-routes. Refer to the Stratix Device Handbook for board layout and signal-integrity guidelines. This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single reference for sourcing, replacement, and PCB-level integration decisions.
EP1S25F780I6 - Stratix 25K LE FPGA, 780-BGA, Industrial | Altera
The Altera (Intel) EP1S25F780I6 is a member of the original Stratix FPGA family, built on a 1.5 V, 0.13 µm all-layer copper SRAM process and packaged in a 780-ball FineLine BGA (29 x 29 mm, 1 mm pitch). The device integrates 25,660 logic elements organized as 2,566 Logic Array Blocks (LABs) and backed by approximately 1,944,576 bits of embedded SRAM, giving designers a balanced fabric for parallel datapaths, FIFOs and on-chip buffering. A total of 597 user I/O pins are brought out, supported by up to 28 DSP blocks containing dedicated 9-bit x 9-bit multipliers for high-throughput fixed-point arithmetic. An FPGA (Field Programmable Gate Array) is a programmable logic device whose configurable logic blocks, interconnect and I/O cells are defined by an SRAM configuration bitstream loaded at power-up. FPGAs sit at the top of the programmable logic hierarchy - above CPLDs in density and below ASICs in per-unit cost - and dominate applications requiring hardware-level parallelism such as DSP, baseband processing, high-speed serial protocol bridging, and ASIC prototyping. The Stratix family in particular introduced embedded memory blocks, DSP blocks and high-speed transceivers as hard IP inside the fabric, accelerating arithmetic-heavy designs that previously had to be built from soft multipliers. Key features of the EP1S25F780I6 include 25,660 logic elements, 1,944,576 RAM bits, 597 user I/Os and 28 DSP blocks. The -I6 speed/temperature grade targets the industrial 0 °C to +85 °C window and operates at the core VCCINT of 1.5 V typical, with separate VCCIO banks supporting common single-ended I/O standards. Configuration is handled via the dedicated JTAG (IEEE 1149.1) interface plus the Altera Passive Serial or Fast Passive Parallel configuration schemes supported by the Stratix configuration controller. Typical applications for the EP1S25F780I6 are telecom line-card datapaths, ASIC and SoC prototyping, custom DSP co-processors, high-speed serial protocol bridging, and industrial control / test-and-measurement backplanes. The combination of 28 DSP blocks and 597 I/Os makes the part particularly suited to designs that need both significant glue-logic capacity and arithmetic density on a single device. When designing with this device, ensure the PCB has at least 6 controlled-impedance layers, decoupling on every VCC/VCCINT/VCCIO ball cluster, and thermal vias under the BGA thermal slug; full configuration and JTAG chains must be planned at board level before layout. The Stratix configuration controller requires a valid configuration bitstream at power-up - do not leave configuration pins floating. This page synthesizes distributor availability, cross-reference alternatives and design notes that supplement the official Stratix device family datasheet, with values verified against live distributor data as of 2026-09-07.
EP1S25F780I6N - Stratix 25,660-LE FPGA, 780-BBGA, Industrial | Altera/Intel
The Intel (formerly Altera) EP1S25F780I6N is a high-density Stratix FPGA from the original Stratix family, integrating 25,660 logic elements across 2,566 logic array blocks (LABs) in a 780-ball FineLine BGA package (29 x 29 mm, 1.0 mm pitch). The device is built on a 1.5 V, 130 nm CMOS process and exposes 597 user I/O pins for high-bandwidth parallel interfaces. What is a Stratix FPGA? A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device organized as a grid of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O cells. The Stratix family was Altera's first high-end family built on a 1.5 V core with embedded TriMatrix memory blocks and DSP blocks, sitting in the hierarchy: programmable logic -> FPGA -> programmable logic device (PLD) -> digital semiconductor. Key features of the EP1S25F780I6N include 1,944,576 total RAM bits of distributed and block memory, dedicated hardware multipliers for DSP, support for LVDS I/O at up to 840 Mbps, and embedded PLL clock management. The 'I6' speed grade with industrial temperature range (0C to 85C) makes it suitable for commercial and industrial designs, while the 780-BBGA FineLine BGA package supports dense, high-pin-count routing. Architecturally, the Stratix device family introduced the TriMatrix memory architecture with three sizes of embedded RAM blocks (M512, M4K, M-RAM), enabling efficient on-chip data buffering. The DSP blocks support 9-bit, 18-bit, and 36-bit signed arithmetic, allowing efficient implementation of FIR filters, FFTs, and other DSP functions without consuming general-purpose logic. Typical applications include high-speed networking line cards, telecom baseband processing, military and aerospace signal processing, ASIC prototyping, and high-performance DSP coprocessing. The 597 user I/Os and abundant memory make it suitable for protocol bridging, packet processing, and image/video preprocessing. When designing with this part, pay close attention to decoupling strategy (the Stratix family datasheet recommends multiple bulk and high-frequency capacitors across each supply pin), and use the Quartus II design software (version 13.0 or older) since later Quartus releases dropped Stratix support. This page synthesizes real-time distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers validate second-source options and lifecycle risk for a long-lived design.
EP1S30B956C6 - Stratix 32K LE FPGA, 956-BGA, 130nm | Altera
The Altera EP1S30B956C6 is a member of the original Stratix FPGA family, fabricated on a 130 nm CMOS process and housed in a 956-ball FineLine BGA (FCBGA, 40 x 40 mm, 1.27 mm pitch) package. It integrates 32,470 logic elements (LEs), 3,317,184 bits of embedded RAM, and 683 user I/O pins, and is specified for the 0 to 85 C commercial operating range. The suffix C6 indicates the device speed grade and the C designator places the part in the commercial temperature class. An FPGA (Field Programmable Gate Array) is a programmable logic device built from an array of configurable logic blocks (CLBs / LEs), embedded memory blocks, DSP blocks, and programmable interconnect, all controlled by SRAM-based configuration memory. Within the broader taxonomy, FPGA belongs to programmable logic, which sits alongside ASICs and CPLDs in the digital semiconductor hierarchy. The Stratix family introduced dedicated TriMatrix embedded memory, DSP blocks, and high-speed I/O to FPGAs, making them suitable for DSP, communications, and high-throughput data-path applications that previously required custom ASICs. Key features of the EP1S30B956C6 include 32,470 LEs organized into 3,247 LABs, 3.4 Mbits of TriMatrix memory distributed across MRAM/M4K/M512 blocks, dedicated DSP blocks for fixed-point multiplication and accumulation, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device also integrates up to 12 PLLs for clock management and supports the Altera Passive Parallel (PP), Passive Serial (PS), and JTAG configuration modes via dedicated configuration pins. At the architecture level, the Stratix die combines a row/column interconnect fabric with embedded memory columns and DSP columns, allowing designers to trade off logic, memory, and DSP resources per design. The 130 nm process node at 1.5 V core (VCCINT) provides a balance of static and dynamic power, while the C6 speed grade targets an internal operating frequency up to 450.05 MHz as published in the Stratix family datasheet. Configuration data is stored in an external configuration device (EPCS/EPC) or downloaded through JTAG, after which the device operates standalone with optional in-system reconfiguration. Typical applications include high-speed digital signal processing (filtering, FFT engines), telecommunications backplane protocol bridging, video and image processing pipelines, industrial control and test instrumentation, and ASIC prototyping for high-density logic designs. Designers often pair the EP1S30B956C6 with EPCS64 configuration memories and Altera Quartus II design software for synthesis, place-and-route, and timing closure. When designing with this device, carefully plan the 956-ball FCBGA escape routing, allocate sufficient PCB layers (typically 8+ layers with microvia or via-in-pad capability), and verify thermal management - the 130 nm Stratix family can dissipate several watts under typical workloads. Designers migrating to newer device families should treat the EP1S30B956C6 as NRND/EOL and evaluate Stratix II/III/IV or Cyclone IV/E families for new designs. This page synthesizes distributor pricing, drop-in alternatives from the Stratix family, and practical design notes not found in the manufacturer datasheet, helping engineers verify pinout, package, and life-cycle status in a single document.
EP1S30F1020C5 - Stratix 32K LE FPGA 1020-BGA | Intel
The Intel (formerly Altera) EP1S30F1020C5 is a member of the original Stratix FPGA family built on a 130 nm CMOS process, delivering 32,470 logic elements, 726 user I/O pins, and 3,317,184 bits of embedded memory in a 1020-ball FC-FBGA package. Operating from a 1.5 V core supply with commercial extended temperature grading, the device targets high-performance DSP, telecommunications, and parallel processing designs where Stratix' TriMatrix memory and DSP block architecture provide deterministic throughput. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP such as block RAM and DSP multipliers. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) and parallel-programmable ICs, and are positioned between fixed-function ASICs and software-programmable DSPs/microprocessors. The Stratix family, the first generation of high-end Altera FPGAs, replaced the APEX II family and was later superseded by Stratix II/III/IV/V families, but the EP1S30 retains a long-tail installed base in industrial, defense, and test-and-measurement equipment. Key features of the EP1S30F1020C5 include up to 500 MHz internal operation, dedicated DSP blocks for fixed- and floating-point math, embedded TriMatrix memory blocks totaling approximately 3.3 Mbits, and a high-speed I/O ring capable of interfacing to external DDR/DDR2/QDR SRAM. The 'C5' speed grade positions the part at a moderate performance bin suitable for cost-sensitive designs, and the 'F1020' suffix denotes the 1020-ball flip-chip BGA package with full I/O count. Architecturally, the device uses an SRAM-based configuration cell so the bitstream must be loaded from an external PROM or flash on every power-up. The logic element combines a 4-input look-up table (LUT), dedicated carry chain, and register; these LEs are clustered into Logic Array Blocks (LABs) with shared control signals. Hard multipliers, MRAM/M4K memory blocks, and a global/local interconnect fabric provide the structural backbone of Stratix. Typical applications include high-speed DSP pipelines (radar, software-defined radio), protocol bridging (telecom backhaul, SONET/SDH framers), ASIC prototyping, and industrial vision/imaging systems. The wide 1020-pin BGA provides ample LVDS pairs for parallel data acquisition, while the rich DSP/memory ratio enables high-bandwidth signal-processing pipelines. When designing with this part, plan for active thermal management: at 500 MHz the Stratix core can dissipate significant power, and the FC-FBGA demands a multi-layer PCB with via-in-pad and a heatsink path. Confirm Quartus II version support - Intel ended Quartus II subscription updates years ago, so legacy toolchains remain the only stable code path. This page synthesizes distributor inventory, drop-in alternative listings, and design notes not found in the standalone Altera datasheet, providing engineer-ready decision context for new designs, long-life-cycle maintenance, and obsolescence management.
EP1S30F1020C5N - 32K LE Stratix FPGA, 1020-BGA, 500MHz | Intel
The Intel (formerly Altera) EP1S30F1020C5N is a member of the original Stratix FPGA family, delivering 32,470 logic elements, 726 user I/O pins, and 3,317,184 bits of embedded memory in a 1020-ball fine-pitch BGA package. Built on a 130 nm CMOS process with a 1.5 V core supply, it provides up to 500 MHz internal operation and integrates DSP blocks, TriMatrix memory, and high-speed serial interfaces (LVDS). The 'C5' speed grade and 'N' suffix denote the commercial temperature range (0 C to 85 C). A Field Programmable Gate Array (FPGA) is a programmable logic device that allows hardware designers to configure digital logic at the design bench rather than at the semiconductor fab. FPGAs sit in the broader hierarchy: programmable logic -> logic IC -> integrated circuit -> semiconductor. Within that hierarchy, the Stratix family targets high-end, logic-, memory-, and DSP-intensive applications where ASIC NRE costs or time-to-market pressures make custom silicon unattractive. The EP1S30 is positioned as a mid-density member of the family, balancing logic capacity, block RAM, and I/O bandwidth for telecom, networking, and DSP prototyping systems. Key features include 32,470 logic elements arranged in 3,247 LABs, 3,317,184 bits of embedded TriMatrix memory (the largest density at launch for this family tier), up to 726 user I/O pins, dedicated DSP blocks for high-throughput multiplier-accumulators, support for multiple I/O standards including LVDS, and on-chip phase-locked loops for clock management. Per-pin slew-rate and drive-strength control are configurable through the Quartus development tool. Architecturally, the EP1S30 uses a sea-of-LABs layout with routing channels between rows and columns, dedicated multiplier blocks, and embedded RAM blocks of multiple depths. The 1020-ball FC-FBGA package exposes the full logic/memory/DSP fabric and is suitable for high-density boards with controlled-impedance routing. Configuration is typically via JTAG or a passive serial/parallel EPROM. Typical applications include high-performance DSP prototyping, telecom line-card processing, military/aerospace signal processing (commercial temp grade limits to benign environments), and test & measurement backplanes. It is also used in legacy industrial controller upgrades where Stratix I designs cannot be re-targeted. When designing, ensure the 1.5 V core and I/O bank supplies meet the sequencing requirement (VCCINT before VCCIO), use a configuration controller or EPC device for boot, and follow Altera's PCB layout guidelines for FC-FBGA escape routing and thermal pad connection. This page synthesizes distributor pricing for the EP1S30F1020C5N, drop-in Stratix I siblings in the 1020-BGA footprint, and practical design notes not found in the original datasheet.
EP1S30F1020C6 - Stratix FPGA 33K LE, 726 I/O, 1020-BBGA | Altera
The Altera (now Intel) EP1S30F1020C6 is a member of the Stratix family of FPGAs built on a 1.5 V, 0.13 micrometer, all-layer copper SRAM process. The device integrates 32470 logic elements (LEs), 3317184 bits of embedded RAM, 726 user I/O pins, and up to 28 DSP blocks with embedded multipliers. It is housed in a 1020-ball flip-chip BGA (FBGA) package suited for high-density logic and DSP designs. An FPGA (Field-Programmable Gate Array) is a semiconductor IC whose logic functionality is defined after manufacturing by loading a user-supplied configuration bitstream into on-chip SRAM cells. FPGAs sit in the wider hierarchy programmable logic device (PLD) -> programmable logic -> logic IC -> integrated circuit, and they are commonly chosen over ASICs for low-volume designs, fast time-to-market, and field-upgradable hardware. The Stratix family is positioned for high-performance DSP, communications, and signal-processing applications. Key features of the EP1S30F1020C6 include support for multiple I/O standards (LVDS, LVPECL, SSTL, HSTL, PCI, PCI-X), up to 12 clock management PLLs (depending on variant), True-LVDS with data rates up to several hundred Mbps, dedicated hardware multipliers for DSP, and TriMatrix memory architecture with three block RAM sizes (M512, M4K, M-RAM). The device also offers embedded hard IP for PCI, PCI-X, and external memory interfaces such as DDR SDRAM and QDR SRAM. The architecture combines a multi-level routing fabric, embedded DSP blocks for high-throughput arithmetic, and rich clocking with phase-locked loops and dedicated clock pins. This combination enables the device to sustain high DSP throughput on FIR filters and FFT pipelines, while the embedded transceivers (not present on EP1S30; transceiver support is on Stratix GX variants) are not applicable here, so designers rely on LVDS pairs for high-speed serial-style I/O. Typical applications include high-speed digital signal processing (FFT, FIR, encryption engines), telecom baseband processing, test and measurement instrumentation, video and imaging pipelines, and high-density glue logic in ASIC-prototype designs. The wide I/O count makes it well suited to systems that aggregate many parallel data buses. When designing with the EP1S30F1020C6, plan power distribution carefully: the 1.5 V core with multiple I/O banks requires multiple decoupling capacitors near the BGA balls. The 1020-ball FCBGA footprint demands PCB layers with microvia technology and matched-impedance routing for LVDS pairs. This page combines distributor pricing, drop-in Stratix same-die alternatives, and practical design notes that go beyond the original Altera datasheet. Compared with a bare parametric listing, it provides a clearer view of pin-compatible replacements and trade-offs.
EP1S30F1020C6N - 32,470 Logic Elements Stratix FPGA, 1020-BGA | Intel
The Intel EP1S30F1020C6N is a member of the Stratix Field Programmable Gate Array (FPGA) family, delivering 32,470 logic elements, 3,317,184 RAM bits, and 726 user I/O pins in a 1020-ball FC-FBGA package measuring 33x33 mm. Fabricated on a 130 nm CMOS process, the device supports a 1.5 V core supply and operates at up to 450 MHz system frequency, providing high-density programmable logic for ASIC prototyping, telecommunications, and high-performance digital signal processing. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected through programmable interconnect, allowing designers to implement custom digital logic functions after manufacturing. The Stratix family sits within the programmable logic device (PLD) hierarchy: FPGA -> programmable logic device -> logic IC -> integrated circuit. Compared with ASICs, FPGAs offer rapid time-to-market, in-field re-programmability, and the ability to update functionality over the product lifecycle without respinning silicon. Key features of the EP1S30F1020C6N include dedicated embedded multiplier blocks, embedded TriMatrix memory blocks for distributed and block RAM, four enhanced phase-locked loops (PLLs), and high-speed LVDS and DDR memory interfaces. The 1020-ball FC-FBGA package with 1.0 mm ball pitch allows the 30,740 typical gates to be placed in a single chip, with 726 user I/O enabling high-bandwidth parallel connectivity. The device supports multiple I/O standards including LVTTL, LVCMOS, PCI, PCI-X, LVDS, LVPECL, and HSTL for protocol-flexible board design. The Stratix architecture combines a fine-grained logic fabric with hardened memory and DSP blocks, allowing high-throughput pipelines without consuming general-purpose logic. The on-chip TriMatrix memory subsystem supports true dual-port RAM, FIFO buffers, and shift registers at hundreds of MHz. Four enhanced PLLs provide clock multiplication, division, phase shifting, and zero-delay buffering for high-speed synchronous designs. Typical applications include ASIC prototyping and emulation, high-speed telecom line cards, software defined radio, military radar signal processing, and high-end image processing. The combination of high logic density, embedded memory, and dedicated multipliers makes the EP1S30F1020C6N well-suited to designs that require both control logic and parallel DSP arithmetic on a single device. When designing with this part, pay close attention to the 1020-BGA layout: 1.0 mm pitch balls require multi-layer PCB with laser-drilled or micro-via stackups. Thermal management must consider the 33x33 mm body, and the configuration scheme (EPC16 or EPC4 configuration device) must be selected to match the design density. This page synthesizes distributor stock, current pricing, and practical FPGA migration guidance not found in the manufacturer datasheet alone.
EP1S30F1020C7 - Stratix 32K LE FPGA 726 I/O FC-FBGA-1020 | Intel
The Intel (formerly Altera) EP1S30F1020C7 is a Stratix family Field Programmable Gate Array (FPGA) IC built on a 130nm CMOS process, integrating 32,470 logic cells and 726 user I/Os in a 1020-ball flip-chip FineLine BGA (FC-FBGA) package measuring 33x33 mm with 1 mm pitch. It operates from a 1.5V core supply across the commercial 0 to 85 C temperature range, supporting a maximum internal clock frequency of approximately 420 MHz. An FPGA (Field Programmable Gate Array) is a class of programmable logic device (PLD) containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. In the system hierarchy FPGAs sit alongside ASICs and microcontrollers but are distinguished by their in-system re-programmability via SRAM configuration bitstreams. The Stratix family was Intel/Altera's first generation to combine hard IP multipliers and TriMatrix memory blocks with a scalable logic fabric, making it suitable for high-throughput DSP and datapath applications. Key features of the EP1S30F1020C7 include 3,247 Logic Array Blocks (LABs), embedded multiplier blocks for DSP, TriMatrix memory blocks for distributed and block RAM, dedicated clock management with PLLs, and configurable I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. Multiple I/O banks support mixed voltage signaling on a single device. The -C7 speed grade indicates a medium-speed bin, balancing performance against power for typical commercial designs. The device architecture incorporates a MultiTrack interconnect that minimizes routing congestion and supports predictable timing closure for wide datapaths. The FC-FBGA-1020 substrate uses flip-chip solder bumps for low-inductance power delivery, essential for high-fanout synchronous designs. Dedicated hardware blocks reduce logic cell consumption for FFTs, FIR filters, and protocol bridging workloads. Typical applications include high-speed digital signal processing (FFT cores, video processing), communications infrastructure (baseband processing, protocol bridging), ASIC prototyping, industrial imaging and machine vision, test and measurement equipment, and high-performance custom computing accelerators. The 726 I/O count and abundant DSP blocks make it well suited for parallel interface aggregation and bus-width conversion roles. When designing with this device, plan power distribution carefully: the FC-FBGA substrate requires a multilayer PCB with low-impedance core and I/O voltage planes, and decoupling must follow Altera's pin-out-specific guidelines. Configuration scheme selection (AS, AP, PS, JTAG) must be locked early in the schematic, as the EPC configuration device companion dictates board layout. The legacy Quartus II design tool supports this device but is no longer the latest vendor IDE. This page synthesizes distributor pricing, drop-in same-package alternatives, design notes, and selection guidance not found in a single datasheet table. Engineer-oriented pinout guidance, package drawings, and Q&A content are compiled from multiple verified sources to accelerate evaluation.
EP1S30F1020C7N - Stratix 32k LE FPGA, 1020-BGA, 420MHz | Intel
The Intel EP1S30F1020C7N is a Stratix-series Field Programmable Gate Array (FPGA) fabricated on a 130 nm CMOS process, offering 32,470 logic elements, 3,317,184 bits of embedded memory, and 726 user I/O pins in a 1020-ball FineLine BGA package (33 x 33 mm, 1 mm pitch). It operates from a 1.5 V core supply (range 1.425 V to 1.575 V), supports up to 420.17 MHz internal operation, and targets commercial/extended-temperature designs where high logic density and rich DSP and memory resources are required. An FPGA (Field Programmable Gate Array) is a type of programmable logic device that combines configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs sit within the broader semiconductor hierarchy as: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Unlike fixed-function ASICs, FPGAs can be reconfigured in the field to implement arbitrary digital logic, glue functions, signal-processing pipelines, and full system-on-chip prototypes. Key features include 3,244 Kbits (M4K) + 144 Kbits (M-RAM) of block RAM, dedicated DSP blocks for high-throughput arithmetic, up to 16 global clock networks with PLL support, and Stratix-tier I/O support including LVDS, SSTL, and HSTL standards. The 1020-pin FineLine BGA exposes 726 user I/Os, leaving the remaining balls for power, ground, configuration, and JTAG. The Stratix architecture combines a TriMatrix memory structure (MLAB + M4K + M-RAM) with DSP blocks optimized for finite-impulse-response (FIR) filters and complex FFT pipelines. The 130 nm process delivers an internal clock performance envelope of 420 MHz, making the part suitable for parallel DSP workloads, telecom channel cards, and prototyping of ASIC-class signal chains before tape-out. Typical applications include telecom baseband processing, high-speed data acquisition, software-defined radio (SDR), industrial motion control, ASIC prototyping, and military/aerospace signal processing where a high pin-count, high-density programmable fabric is required. The 1020-BGA footprint also supports multi-gigabit transceiver-rich boards when paired with companion clock devices. When designing with this device, provide at least six PCB layers, controlled-impedance routing for all high-speed signals, and a minimum of 1 oz copper on inner power planes for the 1.5 V core rail. Thermal management relies on the exposed-die BGA lid; heatsink or airflow is required when continuous logic utilization exceeds 70%. This page synthesizes distributor pricing, drop-in same-brand alternatives from the Stratix family, and practical design notes not aggregated in the manufacturer datasheet.
EP1S30F1020I6 - 32,470 Logic Elements Stratix FPGA | Intel
The Intel EP1S30F1020I6 is a member of the Stratix FPGA family, delivering 32,470 logic elements, 3,317,184 bits of embedded RAM, and 726 user I/O pins in a 1020-ball FineLine BGA package. Manufactured on a 130 nm CMOS process, the device integrates dedicated DSP blocks, TriMatrix memory, and high-speed transceivers, making it suitable for high-performance digital signal processing, telecom, and military/aerospace systems. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs occupy a unique position in the hierarchy between general-purpose microcontrollers and fixed-function ASICs: they offer hardware-timed parallelism, deterministic latency, and the ability to be reconfigured in the field. The Stratix family was Intel's (formerly Altera's) high-performance flagship before being succeeded by Stratix II/III/IV/V. Within the taxonomy, FPGAs sit under programmable logic devices (PLDs) within the broader semiconductor category. Key features of the EP1S30F1020I6 include 32,470 logic elements (LEs), 3,317,184 RAM bits organized as TriMatrix memory blocks, 144 embedded 18x18 multipliers for DSP, 6 phase-locked loops (PLLs), and 12 dedicated clock networks. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL via 726 user I/O pins on the 1020-ball FC-FBGA package. Architecturally, the Stratix EP1S30 uses a row-and-column structure with embedded DSP blocks interleaved between memory columns. The 130 nm process technology combined with a 1.5 V core supply and dedicated MultiTrack interconnect minimizes routing congestion and supports clock rates up to 450 MHz in DSP pipelines. Embedded memory and DSP blocks are hard-wired for predictable performance, while logic fabric handles glue logic and state machines. Typical applications include high-speed digital signal processing (FFT engines, baseband processing), telecom backplane interfacing, military radar systems, medical imaging accelerators, and ASIC prototyping. The combination of high logic density, generous on-chip memory, and embedded multipliers makes it ideal for datapath-heavy designs requiring deterministic throughput. When designing with this part, ensure your power budget accounts for the dynamic power of fast logic toggling - Intel provides the PowerPlay early power estimator tool. For the FC-FBGA-1020 package, PCB layout must use microvia technology and matched-length traces on high-speed LVDS pairs to maintain signal integrity. This page synthesizes distributor pricing, same-package drop-in alternatives, FPGA design considerations, and lifecycle context not consolidated in the manufacturer datasheet. As of 2026-09-07, the part remains in NRND status with limited authorized distribution.
EP1S30F1020I6GA - 32,470 LEs Stratix FPGA 726 I/O FBGA-1020 | Intel
The Intel (formerly Altera) EP1S30F1020I6GA is a Stratix family field-programmable gate array (FPGA) integrating 32,470 logic elements and 726 user I/O pins in a 1020-ball fine-pitch BGA package. It is fabricated on a 130 nm CMOS process, operates from a 1.5 V core supply, and is offered in the industrial temperature grade with -6 speed grade characteristics. According to the Stratix family datasheet, the device delivers up to 450 MHz internal operation and supports dedicated DSP blocks, embedded TriMatrix memory, and up to 4 PLLs for high-performance digital logic. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor whose logic function is defined by customer-loaded configuration bitstreams rather than by fixed mask layers. Architecturally, FPGAs sit alongside ASICs, CPLDs, and structured ASSPs in the programmable logic hierarchy; this Stratix part specifically belongs to the high-density end of that hierarchy, targeting ASIC prototyping, telecom line cards, and high-throughput DSP pipelines. The EP1S30 sits between the smaller EP1S10/EP1S25 and the larger EP1S40/EP1S60/EP1S80 in the Stratix lineup. Key features include 32,470 logic elements, 726 user I/O, dedicated embedded multipliers, distributed TriMatrix memory, four PLLs, and support for external memory interfaces such as DDR SDRAM. Per the Stratix family datasheet, the -6 speed grade targets high-end digital signal processing, while the 'I' suffix designates the industrial temperature range (-40C to +85C operating range for industrial-grade parts). The 'GA' suffix denotes a RoHS-compliant lead-free package. The architecture combines a high-performance lookup-table (LUT)-based logic fabric with embedded RAM, multipliers, and high-speed transceivers where present. This blend allows system designers to consolidate glue logic, memory, and DSP arithmetic into one device, simplifying board layout, lowering BOM cost, and shortening time-to-market versus a fixed-function ASIC. Typical applications include ASIC prototyping and emulation, high-speed DSP (FIR filters, FFT engines), telecom baseband processing, networking line cards, military/aerospace signal processing, and high-performance image processing pipelines. Industrial-grade parts are suitable for factory automation, test and measurement equipment, and medical imaging. When designing with this device, ensure that PCB power integrity is maintained across the four Stratix voltage rails (VCCINT, VCCIO, VCCPD, VCCA_PLL) and that JTAG pins TCK, TMS, TDI, TDO are routed cleanly. Configuration mode (AS, PS, JTAG) and clock architecture must be planned before PCB layout. This page synthesizes distributor pricing, drop-in alternatives within the Stratix family, and practical design notes that supplement the manufacturer datasheet.
EP1S30F1020I6N - Stratix FPGA, 3247 LABs, 726 I/O | Intel
The Intel (formerly Altera) EP1S30F1020I6N is a high-density Stratix FPGA from the first-generation Stratix family, integrating 3,247 Logic Array Blocks (LABs), 726 user I/O pins, and a 1.5 V core supply in a 33 x 33 mm flip-chip BGA-1020 package with 1 mm ball pitch. The part carries the industrial temperature grade designation ("I6") and a 6 speed grade, making it suitable for performance-oriented industrial systems that demand deterministic timing. An FPGA (Field-Programmable Gate Array) is a programmable logic device that allows engineers to implement custom digital circuits after PCB fabrication. FPGAs sit in the broader taxonomy of programmable logic devices -> programmable logic -> digital ICs -> semiconductors, and the Stratix family was Altera's flagship high-end family at launch, integrating logic, embedded memory blocks (TriMatrix), DSP blocks, and high-speed transceivers on a single die. Compared with CPLDs and ASICs, FPGAs offer higher logic density and on-chip parallelism while preserving reprogrammability. Key features of the EP1S30F1020I6N include up to 33,000+ equivalent logic elements organized across 3,247 LABs, embedded TriMatrix memory for distributed and block RAM, dedicated DSP blocks for high-throughput signal processing, and Stratix I/O structures supporting multiple single-ended and differential I/O standards. The 726 user I/O count enables wide parallel buses and rich memory interfaces, while the flip-chip BGA package provides the thermal and electrical headroom required for the high I/O density. Architecturally, Stratix devices use a 1.5 V core with dedicated PLL-based clock management, on-chip termination, and SerDes-ready I/O. The combination of TriMatrix memory and DSP blocks makes the EP1S30 well suited for DSP pipelines such as video processing, baseband signal processing, and protocol bridging. Industrial-grade (-40C to +85C) screening, indicated by the "I6" suffix, supports deployments outside controlled lab environments. Typical applications include high-speed data acquisition, telecom baseband processing, industrial imaging, military/aerospace prototyping, network interface cards, and ASIC prototyping platforms. The large logic capacity is particularly attractive for system-on-chip emulation and pre-silicon validation, where the 726 user I/O support wide memory and bus replication. When designing with the EP1S30F1020I6N, ensure the PCB land pattern strictly follows the 1 mm-pitch FCBGA-1020 footprint and that the supply network delivers the 1.5 V core with adequate decoupling. Thermal dissipation in FCBGA packages is dominated by the PCB; a continuous ground/power plane stack-up with thermal vias under the die is essential. Also note that the Stratix I family has reached End-of-Life for new designs; migration paths include the Stratix II/III/IV families and the Cyclone family for lower-cost replacements. This page synthesizes distributor pricing, drop-in Stratix-family alternatives, and PCB-layout design notes that complement but do not replace the official Stratix Device Handbook.
EP1S30F780C6 - Stratix FPGA, 32470 LEs, 597 I/O, FCBGA-780 | Altera
The Altera EP1S30F780C6 is a member of the original Stratix FPGA family, fabricated on a 1.5 V, 0.13 μm all-layer copper SRAM process and housed in a 780-ball FineLine BGA (FCBGA) package. Per the Altera datasheet, the device integrates 32,470 logic elements, 597 user I/Os, dedicated DSP blocks with embedded multipliers, and TriMatrix on-chip memory, making it suitable for high-performance DSP, communications, and signal-processing designs. The part is graded for commercial temperature operation (0 °C to 85 °C). A Field Programmable Gate Array (FPGA) is a programmable logic device (PLD) built on an SRAM process that lets engineers implement arbitrary digital logic, block RAM, DSP arithmetic, and high-speed serial transceivers on a single die. Stratix belongs to the hierarchy: FPGA → programmable logic device (PLD) → logic IC → integrated circuit → semiconductor. Within Altera's (now Intel FPGA) portfolio, the EP1S30F780C6 sits in the first-generation Stratix family, positioned between the smaller Stratix EP1S10/EP1S20 and the higher-density EP1S40/EP1S60/EP1S80 devices, and predates the Stratix II/GX/Cyclone lineages. Key features of the EP1S30F780C6 include up to 28 DSP blocks with up to 224 (9-bit × 9-bit) embedded multipliers for DSP pipelines, TriMatrix memory architecture with up to ~3.4 Mbits of RAM, support for multiple I/O standards including LVDS, and a configuration scheme based on SRAM cells loaded at power-up via passive serial, fast passive parallel, or JTAG. The 0.13 μm process and 1.5 V core deliver a balance of performance and power for early-2000s high-end designs. The architecture uses logic array blocks (LABs) composed of logic elements (LEs), each containing a 4-input look-up table (LUT), a programmable register, and a carry chain. Embedded memory blocks (M512, M4K, M-RAM) provide distributed and block RAM at multiple aspect ratios. PLLs provide clock conditioning and frequency synthesis for the global and regional clock networks, and dedicated high-speed I/O banks support external memory interfaces such as DDR SDRAM and QDR SRAM. Typical applications of the EP1S30F780C6 include high-throughput DSP (software-defined radio baseband, video processing), telecom line cards implementing protocol bridging and packet processing, ASIC prototyping, and industrial imaging pipelines. The 597 I/Os make it useful for designs that aggregate many parallel buses or external memory channels. When designing with this part, validate power sequencing of the 1.5 V core and the I/O bank supplies, and use Altera Quartus II (legacy version chain) for synthesis, place-and-route, and timing closure. Engineers should also note that this is a mature/EOL device line and plan second-source or migration paths to Cyclone/Stratix II families where possible. This page synthesizes distributor pricing, same-family drop-in alternatives from the Site MPN list (Stratix EP1S25 / EP1S20 / EP1S10 variants), and practical FPGA design notes that are not consolidated on the manufacturer datasheet alone, giving engineers a faster starting point for sourcing and PCB redesign decisions.
EP1S30F780C6GA - Stratix FPGA 32470 LEs 780-FBGA | Intel
The Intel EP1S30F780C6GA is a member of the original Stratix FPGA family, delivering 32,470 logic elements, 3,317,184 bits of embedded RAM, and 597 maximum user I/O pins in a 780-ball FineLine BGA (FBGA) package measuring 29 mm x 29 mm. Built on a 1.5 V core with 0.13 um process technology, it is positioned for high-performance digital logic, DSP, and embedded processing in communications, industrial, and computing systems. The device integrates dedicated DSP blocks, TriMatrix memory, and high-speed transceivers suited to baseband and protocol bridging workloads. A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated silicon IP such as block RAM, DSP slices, PLLs, and high-speed serial transceivers. FPGAs sit above fixed-function ASICs and microcontrollers in the silicon hierarchy because they offer hardware-level parallelism with the ability to be re-programmed in-system, placing them in the broader category of programmable logic devices (PLDs) within digital semiconductors. Key features of the EP1S30F780C6GA include 32,470 logic elements, 3,317,184 RAM bits, 597 maximum user I/O pins, embedded DSP blocks for high-throughput multiplication-accumulation, multiple phase-locked loops for clock management, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The 780-FBGA package exposes all user I/O through a high-density ball grid that supports dense board layouts. The EP1S30F780C6GA uses Altera's Stratix architecture with embedded memory and dedicated signal-processing blocks. Designers configure logic and routing through the Quartus II design software, which is also used for timing closure, floorplanning, and bitstream generation. The architecture targets high-throughput parallel processing where conventional processors would bottleneck. Typical applications include communications infrastructure such as base station baseband and protocol bridging, industrial automation controllers, high-speed data acquisition front-ends, and military/aerospace signal processing. The 597-I/O capacity also makes the device suitable for prototyping ASIC designs and for high-density test and measurement instrumentation. When designing with this part, pay close attention to power planning: the 1.5 V core supply must be tightly decoupled with bulk and ceramic capacitors close to each supply pin. The 780-BGA footprint requires careful PCB stack-up and via-in-pad or microvia technology for reliable assembly. Signal integrity must be simulated for high-speed LVDS pairs and external memory interfaces to maintain timing margins. This product page consolidates distributor pricing, parametric comparison, and a drop-in alternative list to streamline sourcing and design decisions, supplementing the official Intel datasheet.
EP1S30F780C6N - Stratix FPGA 32K LE 780-FBGA | Intel / Altera
The Intel (formerly Altera) EP1S30F780C6N is a member of the original Stratix FPGA family, delivering 32,470 logic elements, 3,317,184 bits of embedded memory, and 597 user I/O pins in a 780-ball flip-chip BGA package. Manufactured on a 130 nm CMOS process with a 1.5 V core supply, the device integrates up to 324,720 RAM bits per M512/M4K/M-RAM block, embedded DSP blocks for high-speed multiply-accumulate, and dedicated high-speed serial transceivers supporting multi-gigabit interfaces. The C6 speed grade balances performance and power, suitable for prototyping, legacy system support, and long-lifecycle industrial designs. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and transceivers. FPGAs occupy the top tier of programmable logic, sitting between standard microcontrollers and ASICs in the broader integrated-circuit hierarchy: logic cell -> logic array block -> LAB -> FPGA fabric -> programmable logic device -> semiconductor. Unlike an ASIC, an FPGA's function is defined post-manufacture via SRAM or flash configuration, allowing rapid design iteration and field upgrades. Key features of the EP1S30F780C6N include 3,819 Configurable Logic Blocks (CLBs), 252 (18x18) embedded multiplier blocks, 12 phase-locked loops, six clock networks, JTAG IEEE 1149.1 boundary-scan support, and a dedicated configuration interface supporting serial, parallel, and passive/active modes. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards with per-pin dynamic impedance control. Stratix devices also include TriMatrix memory architecture (M512, M4K, M-RAM blocks) that delivers high-bandwidth on-chip storage for buffering and packet processing. Architecturally, the Stratix family pioneered the embedded DSP block concept that subsequent Altera/Intel families (Stratix II/III/IV/V, Cyclone, Arria, Agilex) have refined. The 130 nm process places the EP1S30 in the legacy tier, but it remains supported in Intel Quartus design tools for several development flows, which is critical for industrial and defense programs with long product life cycles. Typical applications include telecom line-card aggregation, industrial motor control, military/aerospace signal processing, test and measurement instrumentation backplanes, and ASIC prototyping. The combination of high logic density, large memory, and 597 I/O makes the EP1S30 well-suited for parallel data-path designs such as multi-channel DSP, video processing, and protocol bridging. When designing with this device, allocate adequate power decoupling and thermal dissipation for the 29 mm x 29 mm FC-FBGA; the 780 balls at 1 mm pitch require standard BGA assembly processes. Configuration storage should use a compatible PROM (EPC16 or EPC8) or system-controller-based in-system programming. Signal integrity on the 597 user I/Os requires controlled-impedance PCB stack-up; SSTL/HSTL interfaces in particular need matched-length routing and proper VREF termination. This page synthesizes distributor pricing, FPGA fabric specifications, Stratix-family drop-in alternatives, and practical design notes not consolidated in any single manufacturer document, helping engineers compare options and accelerate design-in.