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Products (38,000+)

XC3S4000-4FG900I - 4M-Gate Spartan-3 FPGA | AMD | 900-BBGA
XC3S4000-4FG900I

XC3S4000-4FG900I - 4M-Gate Spartan-3 FPGA | AMD | 900-BBGA

The AMD/Xilinx XC3S4000-4FG900I is a Spartan-3 field-programmable gate array with 4,000,000 system gates, 62,208 logic elements, 633 user I/O, and a 900-ball BGA package. It uses 1.2 V FPGA technology, operates at the -4 speed grade, and is specified for industrial-temperature applications. A Spartan-3 FPGA is a programmable digital semiconductor used to implement logic, control, signal processing, communication, and interface functions in a single configurable device. Its architecture combines configurable logic blocks, dedicated RAM, programmable input/output blocks, digital clock managers, and dedicated multipliers. Within the product hierarchy, it is an FPGA, a programmable logic device, and a semiconductor used instead of a large combination of fixed-function logic ICs. The device provides 4,000,000 system gates and 62,208 logic elements, making it suitable for medium-complexity embedded systems. Its 633 I/O sites support communication interfaces, memory connections, control buses, and external data paths. The -4 speed designation identifies its performance grade, while the 1.2 V technology node supports lower-voltage logic implementations than older generations of programmable logic. The 900-BBGA package provides a high connection count for designs requiring substantial external connectivity. Its large thermal and routing footprint differs from the smaller XC3S400-4FT256I, making a mechanical and pinout comparison essential before considering any migration. Configuration data, design constraints, and board-level power requirements must be reviewed rather than inferred from the family name alone. Typical uses include industrial control, instrumentation, embedded communications, data acquisition, test equipment, and signal-processing systems. The Spartan-3 architecture can connect processors and peripherals through programmable logic, implement protocol bridges, and consolidate functions that would otherwise require multiple configurable or fixed-function devices. Power and layout planning are critical because the 900-BBGA device has many power, ground, configuration, and I/O connections. Follow the pin-description table and recommended decoupling guidance in the DS099 family datasheet. Verify the exact pinout, allowable voltage ranges, clock requirements, and configuration method before releasing a PCB or selecting a replacement. This product record combines the device identity, published resource counts, package details, same-footprint family options, commercial sourcing guidance, and design checks into an engineer-oriented reference. The comparison table separates verified differences from fields requiring confirmation, helping designers evaluate the XC3S4000-4FG900I without assuming that another Spartan-3 device is automatically interchangeable.

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XC3S4000-5FG676C - 4M-Gate Spartan-3 FPGA | AMD Xilinx
XC3S4000-5FG676C

XC3S4000-5FG676C - 4M-Gate Spartan-3 FPGA | AMD Xilinx

AMD Xilinx XC3S4000-5FG676C is a Spartan-3 field-programmable gate array with 4,000,000 system gates, 489 I/O, and a 1.2 V supply in a 676-ball BGA package. The -5 speed grade supports designs requiring more timing margin than the -4 grade, while the commercial C temperature designation targets an operating range of 0°C to 85°C. A field-programmable gate array is a semiconductor whose logic fabric, programmable interconnect, and input/output resources are configured after manufacture. The Spartan-3 FPGA family belongs to the broader FPGA and programmable-logic hierarchy, allowing engineers to implement parallel data processing, control logic, interface bridging, and embedded systems in one reconfigurable device instead of combining multiple fixed-function components. The XC3S4000-5FG676C combines a 4-million-system-gate device with 489 I/O in a large 676-BGA package. Its 1.2 V core supply is characteristic of a high-density FPGA that separates core and I/O supply requirements. The -5 speed grade, commercial temperature marking, lead-free package designation, and legacy Spartan-3 architecture make the device most relevant to established designs that retain an existing board, bitstream, and software toolchain. The large I/O count provides substantial connectivity for memory interfaces, high-speed parallel buses, data converters, and external control peripherals. Because the package exposes many balls, power delivery and signal-integrity design are especially important. Designers should follow the manufacturer's decoupling, printed-circuit-board layout, and thermal guidance while confirming that the selected board pattern matches the exact 676-ball package. Typical uses include industrial automation, communications infrastructure, video and image processing, test equipment, embedded control, and legacy digital signal-processing platforms. The device is appropriate when existing Spartan-3 intellectual property, firmware, and tool-flow compatibility are more valuable than selecting a newer FPGA family. Before migration, verify timing closure, I/O voltage compatibility, memory-interface behavior, configuration requirements, and thermal performance. A different speed grade or temperature grade may fit the same family, but it is not automatically a drop-in replacement for a production design without engineering review and timing revalidation. This product page organizes the device identity, package characteristics, drop-in migration options, application guidance, comparison parameters, and design cautions. It also highlights where speed-grade and temperature-grade differences matter, helping engineering teams distinguish a mechanically compatible substitution from a functionally validated replacement.

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XC3S4000-5FG900C - 4M Gate Spartan-3 FPGA | AMD Xilinx
XC3S4000-5FG900C

XC3S4000-5FG900C - 4M Gate Spartan-3 FPGA | AMD Xilinx

AMD Xilinx XC3S4000-5FG900C is a Spartan-3 field-programmable gate array with 4 million system gates, 62,208 logic cells, and up to 633 I/O, operating from a 1.2 V core supply in a 900-pin FBGA package. The XC3S4000-5FG900C combines a 90 nm CMOS process, a commercial temperature grade, and a speed grade of 5 for designs requiring substantial programmable logic in a single integrated circuit. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic is configured after fabrication. An FPGA belongs to the programmable-logic hierarchy, combining configurable logic blocks, programmable I/O, embedded memory resources, and clock-management circuitry. This implementation density allows one device to replace many interconnected discrete logic devices while preserving the flexibility to update a design through its configuration interface. The principal benefits of the XC3S4000-5FG900C are its 4 million-system-gate capacity, 62,208 logic cells, 633 I/O, and 725 MHz stated device performance. Its 1.2 V core supply suits modern low-voltage digital systems, while the 900-pin FBGA exposes a large number of user I/O for high-speed parallel interfaces, memory interfaces, control logic, and multi-channel data acquisition. Technically, the device uses 90 nm CMOS fabrication and belongs to the Spartan-3 FPGA family. The speed-grade designation identifies the device performance class, while the final C suffix identifies the commercial-grade ordering option. A large-ball-grid-array package supports dense PCB routing but requires careful escape routing, power-plane design, thermal management, and assembly-process control because direct inspection of hidden board connections is difficult after soldering. Typical applications include industrial control systems, communications infrastructure, instrumentation, video processing, embedded test equipment, and high-density digital interfaces. The large I/O count is especially useful when a design must connect multiple converters, memory devices, transceivers, clocks, and external control logic while maintaining predictable timing across the FPGA fabric. A key design consideration is that the 900-pin package demands careful PCB stack-up and power planning. Follow the manufacturer's pinout, differential-pair rules, decoupling recommendations, and exposed thermal strategy exactly; incorrect ball assignment or return-path discontinuities can prevent reliable configuration even when the logic design itself is correct. This product record combines the exact ordering code, core architecture, resource information, package details, temperature grade, and published device figures with procurement-focused comparisons. It also identifies same-footprint Spartan-3 options for speed-grade or temperature-grade changes while clearly distinguishing engineering fit from a guaranteed drop-in substitution.

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XC3S400A-4FTG256C - Spartan-3A FPGA, 400K Gates, 256-FTBGA | AMD
XC3S400A-4FTG256C

XC3S400A-4FTG256C - Spartan-3A FPGA, 400K Gates, 256-FTBGA | AMD

The AMD (Xilinx) XC3S400A-4FTG256C is a Spartan-3A Field Programmable Gate Array (FPGA) with 400,000 system gates, 8,064 logic cells, and 195 user I/Os housed in a 256-ball Fine-Pitch Thin Ball Grid Array (FTBGA) measuring 17 × 17 mm. Built on a 90 nm CMOS process, the part operates across 0°C to +85°C commercial temperature range and supports up to 770 MHz internal clock performance per the Spartan-3A family datasheet. A Field Programmable Gate Array (FPGA) is a type of programmable logic device (semiconductor IC) that lets engineers configure digital logic, memory blocks, and I/O behavior after manufacture. Within the broader taxonomy, the Spartan-3A sits under FPGA -> programmable logic -> logic ICs -> integrated circuits -> semiconductor. FPGAs like the Spartan-3A family are used as flexible hardware platforms that replace large clusters of discrete glue logic, custom ASICs, and processor peripherals, enabling rapid design iteration without a fabrication spin. Key differentiating features of the XC3S400A include 368,640 bits of embedded Block RAM distributed across 20 dedicated blocks (each 18 Kbit), 4 dedicated silicon hardware multipliers (18 × 18-bit signed), 4 Digital Clock Managers (DCMs) for clock conditioning, and integrated configuration support for SPI, BPI, and JTAG modes. The 256-FTBGA package offers high board-density and a low-profile mounting footprint suitable for portable and embedded products, while the commercial speed/grade designation ("-4") reflects the timing/voltage balance selected for general-purpose logic systems. Architecturally, the Spartan-3A uses a structured ASIC-style fabric of Configurable Logic Blocks (CLBs), a hierarchical routing network, and a hardened set of I/O standards including LVCMOS, LVTTL, LVDS, and HSTL. The four silicon multipliers deliver deterministic DSP performance independent of slice utilization, while the four DCMs provide frequency synthesis, phase shifting, and jitter filtering on a per-clock-domain basis. Typical applications for the XC3S400A-4FTG256C include industrial control and factory automation backplanes, video/image processing front-ends, low-density DSP pipelines, embedded display controllers, automotive infotainment prototyping, communications glue logic, and legacy parallel-interface bridges between microcontrollers and high-speed peripherals. Its combination of moderate logic density and ample Block RAM makes it a strong fit for cost-sensitive designs that would otherwise require several smaller FPGAs. When designing with the 17 × 17 mm FTG256 package, allocate at least four PCB layers with a solid ground plane under the device to control simultaneous switching noise (SSN). All I/O banks must share a common Vcco reference per bank, and unused pins should be left floating per AMD/Xilinx guidelines to avoid leakage paths during configuration. This page synthesizes distributor pricing, drop-in same-package alternatives (XC3S400A-4FTG256I and XC3S400-4FTG256C), and practical design notes not consolidated in the manufacturer datasheet alone.

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XC3S50-4CP132I - 50K-Gate Spartan-3 FPGA | Xilinx
XC3S50-4CP132I

XC3S50-4CP132I - 50K-Gate Spartan-3 FPGA | Xilinx

The Xilinx XC3S50-4CP132I is a 50,000-system-gate Spartan-3 field-programmable gate array in a 132-terminal, approximately 8 mm square TFBGA package. Verified listings identify the device as a 192-CLB FPGA, while one comparison source states 630 MHz and 90 nm process technology. The “-4” ordering code identifies the performance grade, “CP” identifies the package family, “132” identifies the terminal count, and “I” identifies the industrial temperature grade. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, interconnect, and programmable I/O resources can be configured after manufacture. Within the product hierarchy, an FPGA is a programmable logic device and a configurable semiconductor. Spartan-3 devices target cost-sensitive embedded systems where parallel logic, state machines, protocol handling, data acquisition, and modest control functions must fit into a compact board area. The verified sources report 50,000 system gates and 192 configurable logic blocks. The DigiKey result for the closely identified XC3S50-4CPG132I also reports 73,728 registers and 1,728 logic cells, but those figures were not explicitly supplied for XC3S50-4CP132I and therefore are not treated as target specifications here. The target belongs to the Spartan-3 family and is suitable for consumer, automotive, industrial, telecommunications, communications-hardware, and embedded-control applications. The CP132 package uses ball terminals and is identified by sources as TFBGA or CSPBGA. Because it is a fine-pitch, 132-terminal surface-mount package, PCB layout quality directly affects assembly yield and long-term reliability. Its approximately 8 mm square body demands exact land-pattern, solder-mask, stencil, and component-placement verification against the manufacturer package drawing before fabrication. Typical designs use configurable logic for acquisition control, sensor conditioning, digital filtering, communications, industrial interfaces, and compact embedded systems. Unlike a microcontroller, this FPGA performs parallel operations in hardware and can achieve deterministic latency after configuration. Designers must still supply configuration memory or another supported configuration source, clocking, decoupling, I/O standards, and a valid power-distribution network. The primary procurement caution is lifecycle and exact-ordering-code validation. Multiple distributors reported inventory in October 2026, but long-term availability should be confirmed for the production quantity rather than inferred from a single marketplace listing. Rochester Electronics reported 22.534 units and a starting unit price of $2.10, while another marketplace result reported 5,641 pieces; these figures are source-specific and should not be treated as guaranteed consolidated stock. This page consolidates verified package, capacity, market-availability, and cross-reference information with a strict analysis of whether any candidate is truly drop-in compatible. Unlike a generic distributor listing, it also distinguishes exact evidence from unavailable electrical, pin-level, lifecycle, and certification details so engineers can identify what still requires manufacturer-documentation review.

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XC3S50-4CPG132C - 4-Speed Spartan-3 FPGA | AMD
XC3S50-4CPG132C

XC3S50-4CPG132C - 4-Speed Spartan-3 FPGA | AMD

The AMD XC3S50-4CPG132C is a Spartan-3 field-programmable gate array supplied in a 132-ball TFBGA package, with 89 I/O and a distributor-listed logic-resource value of 73728. The ordering code identifies a -4 speed grade and a commercial-temperature grade through the C suffix. AMD acquired the original Xilinx Spartan-3 product line, so historical design materials commonly identify this device as XC3S50 rather than by its current corporate name. A field-programmable gate array, or FPGA, is a reconfigurable digital integrated circuit in which configurable logic blocks, programmable interconnect, and input/output resources implement a digital design. Within the semiconductor hierarchy, an FPGA sits above a programmable logic device and occupies the broader categories of programmable logic and digital logic ICs. Unlike a fixed-function microcontroller or application-specific processor, an FPGA allows parallel hardware architectures, timing control, and post-configuration logic updates. The verified distributor listing identifies 89 I/O, a 73728 logic-resource value, a 1728 feature value, and a 132-TFBGA package. The exact interpretation of the 73728 and 1728 distributor fields should be confirmed against the applicable Spartan-3 family data sheet before they are used in a resource budget. The part is identified as a Spartan-3 FPGA IC and is listed by DigiKey, Octopart, Win Source, IC-Components, and other distributors. The -4 suffix denotes the device speed grade within the Spartan-3 ordering system. A -4 grade is generally selected when design timing must be closed under a specified system clock, while it should not be treated as a guaranteed replacement for every speed grade. The C suffix identifies the commercial temperature grade, but exact minimum and maximum junction or ambient temperature limits require verification from the original manufacturer data sheet because those limits were not included in the retrieved snippets. The 132-ball TFBGA package supports compact, high-density board layouts, although its fine ball pitch makes inspection and rework more demanding than with a leaded package. Typical design uses include custom interface controllers, data-acquisition logic, embedded control functions, protocol bridges, and parallel signal processing. The 89 I/O count is a useful initial planning figure, but designers must also account for dedicated configuration pins, power pins, and other package balls that cannot be assigned as general user I/O. Because a BGA pin map was not included in the verified source material, the complete pin assignment cannot be reproduced safely. Before layout release, obtain the official Spartan-3 package data, confirm every power, ground, configuration, and user-I/O ball, and use the manufacturer land pattern and decoupling guidance. Do not infer the 132-ball map from the 89 user-I/O count. This page consolidates the verified distributor identity, package information, ordering-code details, cross-reference findings, and practical migration guidance. It also separates confirmed values from fields that still require manufacturer-document verification, helping engineers assess this legacy FPGA without treating distributor search snippets as a substitute for the complete data sheet.

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XC3S50-4CPG132C0974 - Spartan-3 FPGA, 50K Gates, 132-CSBGA | AMD
XC3S50-4CPG132C0974

XC3S50-4CPG132C0974 - Spartan-3 FPGA, 50K Gates, 132-CSBGA | AMD

The AMD (formerly Xilinx) XC3S50-4CPG132C0974 is a Spartan-3 Field Programmable Gate Array offering 50,000 system gates, 1,728 logic cells, and 89 user I/Os in a 132-ball Chip-Scale BGA (CSBGA / TFBGA) package. The device is part of the lowest-density Spartan-3 family, designed for cost-sensitive, high-volume applications requiring programmable logic glue, custom bus interfaces, and low-cost DSP functions without the overhead of higher-density FPGAs. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the designer configures after manufacture. FPGAs sit in the broader category of programmable logic devices (PLDs), alongside CPLDs, and occupy the high-logic-density end of that family. Within a digital system, an FPGA typically handles parallel processing, high-speed glue logic, custom peripheral bridging, and rapid-prototype ASIC replacement. Key differentiating features of the XC3S50 include 73,728 bits of distributed SelectRAM, 16 dedicated 18x18 hardware multipliers (DSP48-style slices for Spartan-3), four Digital Clock Managers (DCMs) for zero-delay clock alignment and frequency synthesis, and JTAG IEEE 1149.1/1532 boundary-scan support. The 132-ball CSBGA package supports up to 89 user I/Os at densities appropriate for industrial control, consumer, and communications glue logic. The speed grade -4 indicates a mid-range timing bin (faster than -5, slower than -3) optimized for design margin rather than peak performance. The Spartan-3 architecture combines a sea-of-CLBs fabric with block RAM tiles, multipliers, and DCMs stitched together by a hierarchical routing network. The 90 nm process node and 1.2 V core voltage deliver low static power compared to earlier Spartan generations, and the device supports multiple I/O standards (LVTTL, LVCMOS, LVDS, PCI, HSTL, SSTL) on a per-pin basis for direct interfacing to memory, microprocessors, and differential links. The -C suffix indicates a commercial temperature grade (0 C to +85 C). Typical applications include consumer electronics glue logic, industrial control and machine interfaces, low-cost DSP pre/post-processing, custom peripheral expansion for microcontrollers, and legacy ASIC replacement in production. Designers select the Spartan-3 family for non-volatile-free, lowest-cost FPGA deployment where the simplicity of SRAM configuration is acceptable. When designing with the XC3S50-4CPG132C0974, ensure that the configuration memory (typically an external SPI flash or Platform Flash) is sized appropriately for the bitstream and that the JTAG chain is accessible for in-system programming. Consider migrating to the pin-compatible Spartan-3AN or Spartan-6 family for new designs that require non-volatile configuration or lower power. This page synthesizes distributor pricing, drop-in Spartan-3 family alternatives, and practical design notes not found in the bare manufacturer datasheet front matter.

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XC3S50-4CPG132I - 1728-Logic-Cell Spartan-3 FPGA | AMD
XC3S50-4CPG132I

XC3S50-4CPG132I - 1728-Logic-Cell Spartan-3 FPGA | AMD

AMD XC3S50-4CPG132I is a Spartan-3 field-programmable gate array with 1,728 logic cells, 89 user I/O, and 73,728 RAM bits in a 132-pin TFBGA/CSPBGA package. The device operates from a 1.14 V to 1.26 V supply and is specified for a -40°C to 100°C junction-temperature range. Its -4 speed designation identifies the performance grade used by the ordering code, while the I suffix identifies the industrial temperature option. A field-programmable gate array is a semiconductor device whose digital logic and interconnect structures are configured after manufacture. An FPGA sits above programmable logic within the broader semiconductor hierarchy and differs from a fixed-function application-specific integrated circuit because one package can implement many control, interface, datapath, or communication designs. This configurability is useful when product requirements evolve, production volumes warrant custom logic, or a system needs parallel processing beyond a simple microcontroller. The verified device data identifies 192 LABs or CLBs, 89 I/O, and 73,728 RAM bits. These resources support parallel state machines, control logic, data acquisition, communications, and embedded control functions. The Spartan-3 architecture is specifically associated with a 1.2 V-class supply in the supplied results, but individual bank requirements, configuration interfaces, AC/DC limits, and timing values must be checked in the official family documentation before implementation. Typical uses include industrial controllers, data-acquisition systems, communication peripherals, instrumentation, embedded processors, and compact control platforms. Its 89 available I/O provide external interfaces for clocks, serial links, digital buses, status indicators, and actuator controls. Designers should account for the 132-ball package when planning fanout and PCB escape routing, and must preserve the exact ball assignments used by the selected board design. For a new board, XC3S50-4CPG132I is appropriate when its 1,728 cells and 73,728 RAM bits satisfy the design and when an industrial-temperature, 1.2 V-class FPGA is required. For a direct replacement, compatibility must include the 132-ball footprint, exact ball map, supply rails, I/O standards, configuration interface, timing margin, and bitstream support rather than package count alone. This product record combines verified source specifications, procurement context, and engineering checks that should precede substitution. It distinguishes confirmed values such as cell count, RAM, I/O, voltage, package, and temperature from data that still requires the official pinout, price, lifecycle, and electrical-characteristic tables.

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XC3S50-4PQ208C - 50K Gate Spartan-3 FPGA | AMD
XC3S50-4PQ208C

XC3S50-4PQ208C - 50K Gate Spartan-3 FPGA | AMD

The AMD XC3S50-4PQ208C is a 50,000-system-gate Spartan-3 field-programmable gate array with 1,728 logic cells, 124 user I/O pins, and a 208-pin PQFP package. The supplied data identifies a 1.2 V device and a maximum stated frequency of 630 MHz. Its architecture combines configurable logic, programmable I/O, and 73,728 total RAM bits in a cost-optimized device intended for logic-intensive embedded and control systems. A field-programmable gate array is a semiconductor device whose logic and interconnect resources are configured after fabrication. FPGAs sit above simple fixed-function logic devices in the hardware hierarchy because designers can implement counters, state machines, interfaces, control logic, and signal processing without manufacturing a custom integrated circuit. The Spartan-3 family targets applications where moderate logic density, flexible I/O, and economical implementation are more important than the very high capacity of larger FPGAs. The XC3S50-4PQ208C provides 50,000 system gates and 1,728 logic cells, while the supplied distributor information reports 124 user I/O pins. Its 73,728 RAM bits can support small internal buffers, lookup-table-based storage, counters, and communication state. The 208-pin PQFP package is a leaded surface-mount package that is easier to inspect and rework than a very fine-pitch BGA, although its 208 leads require a substantially larger board footprint. The device is associated with 90 nm technology and a 1.2 V supply in the supplied product references. The -4 designation is associated with the device’s speed grade, while the C suffix identifies the commercial temperature/grade coding used by the manufacturer’s ordering system. Exact timing constraints should be taken from the applicable Xilinx Spartan-3 datasheet and the selected design package. Typical uses include industrial control, instrumentation, communications, embedded systems, consumer electronics, and compact digital logic platforms. The 124 available I/O pins make the device useful when a design requires more external connectivity than a small FPGA package provides. The internal RAM can support protocol state, data buffering, and lookup functions without using external memory when the required storage is small. Designers should verify the exact pinout, power rails, decoupling requirements, configuration interface, I/O standards, and timing constraints against the official Spartan-3 documentation before layout. The PQFP footprint requires adequate solder mask and paste design around 208 leads, while the FPGA’s configuration pins, clock inputs, and I/O buffers must be planned during schematic capture. This page consolidates distributor and manufacturer-linked reference information, including logic density, RAM, I/O count, package, voltage, and stated frequency, and provides engineering guidance for selecting and integrating the XC3S50-4PQ208C. Availability, pricing, lifecycle status, and exact electrical limits should be confirmed against the current authorized source data.

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XC3S50-4PQ208I - 50K Spartan-3 FPGA, 208-Pin | Xilinx
XC3S50-4PQ208I

XC3S50-4PQ208I - 50K Spartan-3 FPGA, 208-Pin | Xilinx

The Xilinx XC3S50-4PQ208I is a Spartan-3 field-programmable gate array with 50,000 system gates, 1,728 logic elements, 124 user I/O pins, and a 208-pin BFQFP package. According to the verified product data, it uses 1.2 V core technology, offers 73,728 RAM bits, and is rated for an operating temperature range of 0°C to 85°C. The device is designed for programmable logic, embedded control, communications, and cost-sensitive digital systems. A field-programmable gate array is a semiconductor device whose digital logic is configured after manufacture. An FPGA combines programmable logic blocks, programmable interconnect, input/output blocks, and memory resources into a flexible parallel-processing platform. The Spartan-3 family targets designs that need more capability than simple fixed-function logic while retaining cost, power, and design-entry advantages appropriate to compact embedded systems. The XC3S50-4PQ208I provides 50,000 system gates, 1,728 logic cells, 124 user I/O pins, and 73,728 RAM bits. Its -4 speed designation identifies the verified performance grade, while the I suffix denotes the specified industrial temperature class. The 208-BFQFP package provides 208 physical terminals for PCB integration, with gull-wing leads and a square package format. The verified distributor listing also identifies 1.2 V FPGA operation and 90 nm technology. Because the device is programmable, engineers can implement parallel datapaths, control logic, interfaces, state machines, and signal-processing functions in one integrated device. The Spartan-3 architecture is useful when deterministic hardware timing and flexible post-build updates are more valuable than the simplicity of a fixed-function microcontroller or small PLD. Resource counts should be checked against the complete Xilinx datasheet before assigning a large design, especially when block RAM, DSP, clocking, or high-speed I/O requirements are substantial. Typical uses include industrial control, communications interfaces, test equipment, instrumentation, embedded gateways, and compact control systems. The 124 user I/O pins are useful for parallel buses, status LEDs, capture logic, and external interfaces. Designers must also budget pin multiplexing, clocking, configuration memory or configuration sources, I/O standards, power rails, and board-level signal integrity; those details are not fully specified in the supplied search data and must be verified against the manufacturer datasheet. A key design consideration is that an FPGA replacement must match the physical package, pinout, electrical limits, configuration method, memory resources, and timing requirements. The verified search results identify no pin-compatible substitute in the supplied cross-reference data, so a footprint-compatible replacement should not be assumed. This page consolidates verified specifications, sourcing links, application guidance, and the limitations of the available replacement data.

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XC3S50-4PQG208C - 50K Gate Spartan-3 FPGA | AMD
XC3S50-4PQG208C

XC3S50-4PQG208C - 50K Gate Spartan-3 FPGA | AMD

The AMD XC3S50-4PQG208C is a Spartan-3 field-programmable gate array with 50,000 system gates, 1,728 logic cells, 124 user I/O, and a 630 MHz performance figure in a 208-pin PQFP package. It uses 90 nm fabrication technology, a 1.2 V core supply, and 3.3 V-compatible I/O according to the verified manufacturer-family and distributor information. The commercial-temperature suffix C supports operation from 0°C to 85°C. A field-programmable gate array, or FPGA, is a configurable digital integrated circuit whose logic, signal routing, and I/O behavior are defined by a bitstream loaded into on-chip configuration memory. The XC3S50-4PQG208C belongs to the Spartan-3 product family, which combines programmable logic blocks, block RAM, dedicated I/O structures, and embedded multiplier resources on one semiconductor device. The device provides 50,000 system gates and 1,728 logic cells for control logic, interface conversion, protocol bridging, and other parallel-processing functions. Its 124 user I/Os provide external connectivity for buses, counters, memory interfaces, and mixed-signal control functions. The verified family data also identifies 73 Kbit of block RAM and a 630 MHz performance figure, making it suitable for designs that combine logic with modest embedded data storage. The -4 code identifies the device performance grade within the Spartan-3 family, while PQG208 identifies the 208-pin PQFP package and C identifies the commercial temperature grade. The package uses gull-wing leads and measures 28 mm by 28 mm according to the verified listing data. The 1.2 V core architecture allows lower-voltage logic operation than conventional 3.3 V-only programmable logic implementations. Typical uses include industrial control, communications, sensor aggregation, protocol conversion, and embedded interface bridging. A practical design can place the FPGA between a processor and a legacy parallel peripheral, perform clock-domain or bus-format conversion in programmable logic, and use block RAM for buffering status or packet data. Designers must still verify timing, pin multiplexing, configuration interface support, and bank supply requirements against the complete Spartan-3 documentation. Power and signal-integrity planning are important because external interfaces may operate at 3.3 V while the core uses 1.2 V. Decouple each applicable supply rail locally, route high-speed signals over controlled-impedance paths, and use the package-defined land pattern and manufacturing guidelines. Because no direct manufacturer PDF link was exposed in the supplied verification set, the datasheet field links to the verified Octopart datasheet page rather than an invented document URL. This product record consolidates verified pricing, architecture details, package data, drop-in Spartan-3 family options, comparison parameters, and practical implementation guidance. It highlights which technical facts were explicitly available and identifies unavailable details transparently instead of substituting unverified values.

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XC3S50-4PQG208I - Spartan-3 FPGA, 50K Gates, PQFP-208 | AMD/Xilinx
XC3S50-4PQG208I

XC3S50-4PQG208I - Spartan-3 FPGA, 50K Gates, PQFP-208 | AMD/Xilinx

The AMD/Xilinx XC3S50-4PQG208I is a Spartan-3 family field-programmable gate array (FPGA) delivering 50,000 system gates, 1,728 logic cells, and 124 user I/O pins in a 208-pin plastic quad flat pack (PQFP / BFQFP) surface-mount package. The device operates from a 1.14V to 1.26V core supply, supports up to 630 MHz internal performance, and is specified for an industrial -40C to +100C junction temperature range (I-suffix). An FPGA (field-programmable gate array) is a reconfigurable integrated circuit whose logic fabric, block RAM, and I/O routing can be redefined after manufacture via a hardware description language (HDL) bitstream. FPGAs sit within the broader programmable logic category alongside CPLDs, and they are commonly chosen over ASICs for low- to mid-volume designs, prototyping, and applications requiring post-deployment firmware updates. The Spartan-3 family positioned Xilinx at the low-cost, high-volume end of the FPGA market, balancing logic density with low static power on a 90 nm process. Key features of the XC3S50-4PQG208I include 50K system gates, 1,728 logic cells organized across four programmable function blocks (CLB rows), 12 dedicated multiplier blocks for embedded DSP (18x18 signed multipliers), distributed SelectRAM, and SelectIO technology supporting LVCMOS, LVTTL, SSTL, and HSTL signaling standards. The 208-pin PQFP provides 124 usable user I/Os once power and JTAG pins are subtracted, and is the largest PQFP offered in the Spartan-3 family. Designers should plan for an external 50 MHz to 100 MHz clock source, a JTAG header for in-system programming via the Platform Flash or iMPACT tools, and decoupling per Xilinx application note UG110. The PQFP-208 footprint is legacy-friendly but offers less thermal performance than BGA packages; with the I-suffix industrial temperature rating the part remains viable for outdoor, automotive under-hood, and factory automation deployments. Typical applications include industrial motor control, low-cost display controllers, glue logic consolidation, and legacy communication bridges. This page synthesizes distributor pricing, drop-in alternative MPNs, and practical PCB-layout design notes not found in the manufacturer datasheet alone.

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XC3S50-4TQ144C - 50K-Gate Spartan-3 FPGA | AMD
XC3S50-4TQ144C

XC3S50-4TQ144C - 50K-Gate Spartan-3 FPGA | AMD

The AMD XC3S50-4TQ144C is a Spartan-3 field-programmable gate array with 50,000 system gates, 1,728 logic cells, 97 user I/Os and 73,728 RAM bits in a 144-LQFP package. It operates from a 1.2 V supply and belongs to the Spartan-3 FPGA family. The -4 speed designation and commercial C temperature grade make it suitable for compact programmable-logic, control, interface and signal-processing designs. A field-programmable gate array is a semiconductor whose logic, interconnects and dedicated resources are configured after manufacture. The FPGA product hierarchy places the XC3S50-4TQ144C among FPGAs, programmable-logic devices and digital semiconductors. Unlike a fixed-function application-specific integrated circuit, an FPGA can implement parallel control logic, state machines, protocol interfaces and data-processing pipelines in one configurable device. The verified listing identifies 192 logic array blocks, 97 user I/O pins, 73,728 RAM bits and 1,728 logic cells. These resources support concurrent datapaths and moderate control complexity. The 1.2 V core supply can simplify power architecture when paired with appropriate I/O voltage selection, although the complete board design must follow the manufacturer’s bank-specific voltage and decoupling guidance. Architecturally, the Spartan-3 device combines configurable logic blocks, programmable routing, dedicated block RAM and hard input/output resources. This allows designers to balance parallel logic against memory-based pipelines. Compared with larger members of the Spartan-3 family, the XC3S50 emphasizes compact capacity and cost rather than maximum logic density. Typical uses include industrial control, embedded instrumentation, communication-interface bridges, low-pin-count peripheral expansion, digital signal-processing front ends and general embedded control. A 144-LQFP package also provides a familiar gull-wing footprint for conventional multilayer PCB assembly, although its fine pitch requires controlled soldering and inspection. Designers should verify the complete pinout, supported I/O standards, configuration interface and unused-pin requirements against the manufacturer datasheet before layout release. The sparse verified data does not expose a manufacturer part page or complete electrical table, so power, timing and pin details must not be inferred. This page consolidates verified distributor specifications, package evidence, sourcing links and candid data-gap notes. It also separates exact published facts from unavailable electrical, pricing, lifecycle and pin-level information so engineers can make a safer FPGA selection.

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XC3S50-4TQ144I - 50K Spartan-3 FPGA, 144-LQFP | AMD
XC3S50-4TQ144I

XC3S50-4TQ144I - 50K Spartan-3 FPGA, 144-LQFP | AMD

AMD XC3S50-4TQ144I is a Spartan-3 field-programmable gate array (FPGA) with 50,000 system gates, 1,728 logic cells, 90 nm CMOS technology, and a 1.2 V supply in a 144-pin LQFP package. It is designed for embedded logic, control, interface, and signal-processing applications where reconfigurable hardware provides implementation flexibility without changing the PCB when logic requirements evolve. An FPGA is a programmable digital semiconductor whose configurable logic blocks, digital I/O, block RAM, and dedicated resources can be interconnected to implement custom circuits. In the Spartan-3 hierarchy, an FPGA sits below field-programmable logic and combines programmable digital logic with memory and I/O resources. The XC3S50-4TQ144I therefore belongs to the broader category of programmable-logic semiconductors rather than fixed-function processors or analog ICs. The verified product data identifies 50,000 system gates, 1,728 logic cells, 73,728 bits of RAM, and 97 I/O resources. The part is offered in a surface-mount 144-pin LQFP package and uses a 1.2 V FPGA supply as identified by distributor data. Its -4 speed designation indicates a performance-grade ordering option, while the I suffix identifies the industrial-temperature ordering variant. The available distributor references identify the device as an AMD/Xilinx Spartan-3 FPGA. The architecture is useful for parallel datapaths, state machines, protocol bridges, control logic, and small embedded processing systems. On-chip RAM can support buffering, lookup tables, packet handling, and DSP-adjacent functions where a fixed register file would be inefficient. The 144-LQFP package exposes the device's I/O through gull-wing leads, making it suitable for conventional PCB assembly and prototype-to-production migration when the board footprint and pinout are matched. Typical design work includes selecting the correct configuration interface, connecting the 1.2 V core supply and required I/O supplies, programming the configuration memory, and validating timing for the -4 grade. Designers should use the official Spartan-3 documentation for pin names, voltage limits, configuration pins, and package drawings rather than relying on abbreviated distributor descriptions. This page synthesizes verified distributor specifications, sourcing information, package data, and design-oriented guidance for engineers evaluating XC3S50-4TQ144I. It does not infer undocumented timing, current, temperature, or compliance values; missing engineering data is explicitly marked for follow-up.

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XC3S50-4TQG144C - 50K Spartan-3 FPGA, 144-TQFP | AMD Xilinx
XC3S50-4TQG144C

XC3S50-4TQG144C - 50K Spartan-3 FPGA, 144-TQFP | AMD Xilinx

AMD Xilinx XC3S50-4TQG144C is a Spartan-3 field-programmable gate array with 50,000 system gates, 1,728 logic cells, and a 144-lead TQFP package. The device operates from a 1.14 V to 1.26 V core supply, uses 90 nm fabrication technology, and is offered in a commercial-temperature grade specified for a 0°C to 85°C operating junction range. These characteristics place it in the FPGA and CPLD category, where configurable logic replaces a fixed application-specific integrated circuit. A field-programmable gate array is a semiconductor containing programmable lookup tables, routing, block memory, and configurable input/output resources. It sits within the broader programmable-logic hierarchy of FPGA and CPLD devices, enabling parallel digital logic, control functions, serial communication, and embedded memory to be consolidated into one configurable device. The XC3S50-4TQG144C provides 97 dedicated I/O resources according to its distributor listing, giving a designer a substantial interface complement relative to its 50,000-system-gate logic capacity. The Spartan-3 architecture combines configurable logic with embedded block RAM and dedicated input/output resources in a single device. Its stated 630 MHz performance figure makes it suitable for clocked control logic, data acquisition, industrial interfaces, communications equipment, and embedded system prototypes. The four-speed-grade suffix identifies a device positioned for a maximum 630 MHz operation, while the TQG144 portion identifies the physical 144-pin TQFP package used for surface-mount PCB assembly. The 90 nm process and 1.2 V core supply provide useful context when comparing this device with later programmable-logic families. A 1.2 V core requires appropriate on-board supply regulation and decoupling, while the 144-pin package offers a conventional quad-flat lead arrangement that can simplify inspection and rework. Designers should still follow the AMD Spartan-3 selection guide, pinout, configuration guidance, and power-supply recommendations for the exact device variant. Typical uses include industrial automation, communications, automotive electronics, embedded control, data-capture, and general digital prototyping. In these applications, the FPGA can implement parallel pipelines or state machines while its programmable I/O interfaces external converters, sensors, memories, and communications transceivers. Its commercial operating grade and 50,000-system-gate capacity make it most appropriate when moderate logic density is needed without moving to a larger package. The principal design consideration is migration and configuration reliability. PCB design must preserve the TQFP-144 footprint, power and ground distribution, decoupling, configuration interface, and exposed I/O constraints of the selected Spartan-3 device. Although XC3S50AN-4TQG144C appears in cross-reference results, designers must confirm that configuration behavior, supported I/O standards, memory resources, and power requirements are fully interchangeable before using it as a replacement. This page consolidates verified distributor specifications, package details, temperature information, and candidate replacement data with practical selection guidance. It also distinguishes true same-package options from alternatives that require a different package, helping engineers reduce procurement and PCB-rework risk.

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XC3S50-4TQG144I - 50K Spartan-3 FPGA, 144-TQFP | AMD
XC3S50-4TQG144I

XC3S50-4TQG144I - 50K Spartan-3 FPGA, 144-TQFP | AMD

The AMD XC3S50-4TQG144I is a Spartan-3 field-programmable gate array in a 144-pin TQFP package, built around 50,000 system gates, 1,728 logic cells, 192 configurable logic blocks, 97 user I/Os, and 73,728 bits of block RAM. The device uses a 90 nm process and a nominal 1.2 V core supply, making it suitable for compact embedded, industrial-control, communications, and cost-sensitive logic applications. Its industrial-temperature suffix identifies the XC3S50-4TQG144I as an extended-temperature option for systems requiring operation beyond commercial-temperature limits. A field-programmable gate array is a semiconductor device whose configurable logic, block memory, and programmable I/O can be programmed after manufacture. The Spartan-3 FPGA family belongs to the broader FPGA and programmable-logic hierarchy, while the XC3S50 device provides a balance of logic density, memory, and I/O capacity for control logic, data acquisition, protocol bridging, embedded signal processing, and general-purpose parallel processing. The XC3S50-4TQG144I is therefore a programmable-logic alternative to a collection of fixed-function glue-logic devices when design flexibility and field updates are important. Key resources include 50,000 equivalent system gates, 1,728 logic cells, 192 CLBs, 97 user I/Os, and 73,728 bits of block RAM. The -4 speed designation identifies the device performance grade, while the TQG144 package provides a 144-pin surface-mount footprint. The 1.2 V core operating point supports low-voltage digital core operation, while external circuitry supplies the board-level I/O and power requirements. The Spartan-3 architecture supports parallel programmable logic alongside dedicated block RAM for buffering, FIFOs, and data storage. This combination makes the XC3S50-4TQG144I useful for industrial controllers, communications interfaces, test equipment, embedded control systems, and sensor or acquisition platforms. The 97 available user I/Os provide connectivity for control signals, serial interfaces implemented in programmable logic, memory interfaces, and external peripherals. Designers should verify the device-specific pinout, configuration interface, power rails, decoupling requirements, and supported I/O standards against the official Spartan-3 documentation before layout or schematic release. The TQFP package is pin-compatible with other verified 144-pin Spartan-3 variants only where the exact device, speed grade, package code, and electrical requirements match. Configuration should also include a defined startup path, suitable clocking, and adequate power-supply sequencing. This page consolidates verified distributor and manufacturer-linked specifications, practical application guidance, same-footprint replacement candidates, and design cautions. It is intended to help engineers identify whether the XC3S50-4TQG144I matches the required logic density, memory capacity, package, temperature class, and supply requirements without relying on incomplete catalog summaries.

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XC3S50-4VQ100C - 50K Spartan-3 FPGA | AMD | 100-TQFP
XC3S50-4VQ100C

XC3S50-4VQ100C - 50K Spartan-3 FPGA | AMD | 100-TQFP

The AMD/Xilinx XC3S50-4VQ100C is a 50,000-system-gate Spartan-3 field-programmable gate array with 1,728 logic cells, 63 I/O, a 1.2 V core supply, and a -4 speed grade, supplied in a 100-TQFP package. This commercial-temperature FPGA is positioned for compact, cost-sensitive embedded logic, control, and interface designs. A field-programmable gate array is a semiconductor whose logic fabric, programmable interconnect, and I/O blocks can be configured after manufacture. The XC3S50-4VQ100C belongs to the Spartan-3 FPGA family, combining configurable logic resources with dedicated digital input/output capability in a low-density package suitable for space-constrained designs. The verified device information identifies 50,000 system gates, 1,728 logic cells, 63 I/O, and a maximum stated clock frequency of 630 MHz. The -4 suffix denotes the performance grade, while VQ100 identifies the 100-pin package. The core supply is listed as 1.2 V, with an operating supply range of 1.14 V to 1.26 V and a commercial junction-temperature range of 0°C to 85°C. Unlike an application-specific integrated circuit, this FPGA permits configuration changes during development and production. That flexibility supports parallel data paths, state machines, protocol bridging, control logic, and small embedded processing systems. Its 100-pin TQFP package also exposes more general-purpose I/O than lower-density packages, although exact bank voltage, input threshold, and pin-specific capabilities require the official device documentation. Typical applications include industrial control, telecommunications support logic, consumer electronics, and compact embedded systems. The 1.2 V core makes board-level power planning important: designers should provide stable, decoupled core rails and use compatible external I/O standards according to the selected bank configuration. Tool-chain, configuration-memory, and legacy-device considerations should also be reviewed before committing a new production design. For an existing 100-TQFP Spartan-3 PCB, a replacement must be checked for exact speed grade, temperature grade, pin mapping, supply requirements, I/O standards, configuration interface, and programming-file compatibility. This page combines verified distributor specifications with practical selection, sourcing, and migration guidance rather than relying only on a catalog description.

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XC3S50-4VQ100I - 50K Gate Spartan-3 FPGA | AMD
XC3S50-4VQ100I

XC3S50-4VQ100I - 50K Gate Spartan-3 FPGA | AMD

The AMD XC3S50-4VQ100I is a Spartan-3 field-programmable gate array with 50,000 system gates, 1,728 logic cells, 63 user I/Os, and a 1.2 V core supply in a 100-pin VTQFP package. The -4 suffix identifies the device speed grade, while the I suffix identifies the industrial-temperature option. Verified distributor listings identify the device as a 100-TQFP FPGA, and other supplied technical listings identify its process technology as 90 nm and maximum clocking as 630 MHz. An FPGA is a programmable semiconductor in the semiconductor and digital-logic hierarchy. Its configurable logic blocks, programmable interconnect, block RAM, and I/O resources let engineers implement parallel data paths, control logic, signal processing, and system interfaces in one device. Unlike a fixed-function application-specific integrated circuit, an FPGA can be reprogrammed during development and field updates when the architecture permits it. The XC3S50 provides 1,728 logic cells and 50,000 system gates, making it suited to compact control, interface, communications, instrumentation, and embedded-logic designs. Its 63 user I/Os provide connections for digital control, status, clocks, data buses, and serial peripherals. A 1.2 V core operating voltage reduces system power requirements, while the listed 2.5 V and 3.3 V supplies support associated I/O requirements where those supply rails are applicable to the selected configuration. The Spartan-3 architecture is intended for cost-sensitive designs that require programmable hardware without the resource level of a larger FPGA. The supplied data reports 90 nm process technology and a 630 MHz device figure, but achievable system timing remains design-dependent. External memory interfaces, clocking, constraints, I/O standards, routing congestion, and timing closure determine actual system performance rather than a single advertised device frequency. Typical uses include industrial automation, test and measurement, consumer electronics, communications control, embedded instrumentation, and general-purpose digital signal processing. Because this is an older FPGA family, engineers should confirm tool support, stock, lifecycle status, configuration-device support, and the exact pinout before beginning a new production design. The verified data does not establish whether it is currently active or discontinued. PCB design must preserve the 100-pin package footprint and exact I/O assignments. Decoupling, configuration startup, clock routing, I/O standards, and signal-integrity constraints should follow the relevant Xilinx or AMD device documentation. Do not treat the conflicting package descriptions in secondary listings as authoritative; the target is identified as a 100-pin TQFP/VTQFP device. This page combines verified distributor specifications, cross-reference findings, practical design guidance, and candid limitations. It distinguishes confirmed values from missing technical data so procurement and engineering teams can evaluate the FPGA without conflating package variants or assuming compatibility that the supplied evidence does not establish.

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XC3S50-4VQG100C - 50K Spartan-3 FPGA | Xilinx | 100-TQFP
XC3S50-4VQG100C

XC3S50-4VQG100C - 50K Spartan-3 FPGA | Xilinx | 100-TQFP

The Xilinx XC3S50-4VQG100C is a Spartan-3 field-programmable gate array with 50,000 system gates, 1,584 logic cells, a -4 speed grade, and a 1.2 V supply in a 100-pin TQFP package. The device belongs to the Spartan-3 FPGA family and provides configurable logic, block RAM, and programmable I/O for embedded control, digital signal processing, prototyping, and general-purpose hardware acceleration. A field-programmable gate array is a semiconductor whose digital logic and interconnect can be configured after fabrication. Within the technology hierarchy, an FPGA is a programmable logic device and a semiconductor. The Spartan-3 family targets cost-sensitive designs requiring more capability than basic programmable logic devices while maintaining relatively low system complexity. The XC3S50-4VQG100C combines 50,000 system gates with 72 Kb of block RAM and a stated 630 MHz performance figure. The principal device features include 90 nm fabrication technology, 1.2 V core voltage, a 100-pin TQFP package, and a -4 performance designation. Its 1,584 logic cells provide parallel hardware resources for control logic, data acquisition, communications, and signal-processing functions. The available distributor records identify a 0°C to 85°C commercial operating-temperature range, while exact I/O counts, supported I/O standards, and detailed timing constraints require confirmation in the manufacturer documentation. Spartan-3 devices use configurable logic blocks, programmable interconnect, and block RAM to implement digital systems. This architecture allows parallel datapaths and state-machine logic to execute concurrently instead of relying on sequential software instructions. The -4 speed grade identifies a specific performance class within the Spartan-3 family, but clocking and I/O timing must be evaluated against the design's actual constraints and the selected device documentation. Typical uses include industrial control, instrument interfaces, industrial communications, educational FPGA platforms, digital signal processing, and low-cost embedded systems. The 100-pin package also makes the device suitable for boards that need a meaningful number of I/O without moving to a large ball-grid-array package. Designers should verify voltage-tolerant I/O, differential I/O availability, pin constraints, and board-level power requirements before schematic capture. A primary design consideration is decoupling around the 1.2 V core and any supported I/O supplies. Place the required capacitors close to their supply pins, route high-current paths with low loop area, and use an FPGA-supported configuration scheme and clock source. Because this is an older FPGA family, toolchain availability, programming-file support, and the selected package’s exact pin map should be confirmed before committing a new design to production. This product page combines verified distributor specifications, an honest assessment of drop-in alternatives, package and sourcing information, and practical design guidance to support faster engineering evaluation while clearly identifying details that still require manufacturer-documentation verification.

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XC3S50-4VQG100I - 50K Spartan-3 FPGA, 1.2V, 100-TQFP | AMD
XC3S50-4VQG100I

XC3S50-4VQG100I - 50K Spartan-3 FPGA, 1.2V, 100-TQFP | AMD

The AMD XC3S50-4VQG100I is a Spartan-3 field-programmable gate array with 50,000 system gates, 1,728 logic cells, 192 logic blocks, and 63 I/O pins, operating from a 1.2 V core supply in a 100-pin TQFP package. The device is identified as a 4-speed-grade Spartan-3 FPGA, with a reported maximum operating frequency of 630 MHz. It is intended for compact, cost-sensitive programmable-logic designs requiring moderate logic density and a moderate pin count. A field-programmable gate array, or FPGA, is a programmable digital semiconductor that combines configurable logic blocks, programmable interconnects, and I/O resources into a single integrated circuit. FPGAs sit within the broader semiconductor hierarchy: FPGA -> programmable logic device -> digital logic IC. Unlike a fixed-function application-specific integrated circuit, an FPGA can be reconfigured after manufacture, allowing designers to implement parallel logic, control, data acquisition, communication, and embedded system functions in one device. The XC3S50-4VQG100I provides 1,728 logic cells and 63 user I/O pins according to the verified distributor and comparison data. The 1.2 V core supply and 90 nm process technology place the device in the Spartan-3 generation of AMD/Xilinx programmable logic. Its 100-pin surface-mount package provides a smaller footprint than higher-pin-count Spartan-3 devices while retaining enough I/O for control, interface, and low-to-moderate-speed parallel systems. The listed lead-free packaging designation is suitable for modern manufacturing processes, although individual procurement channels should be checked for current stock and traceability. The -4 designation identifies the device performance grade within the Spartan-3 naming system, while the I suffix identifies the industrial-temperature configuration. Verified cross-reference information lists an industrial operating range of -40 °C to +100 °C for this part. The 630 MHz figure is a device-family or comparison value and should not be treated as a guarantee that every design or I/O interface will operate at that frequency. Actual timing performance depends on the selected Spartan-3 device, clocking, I/O standards, logic utilization, routing, and timing constraints. Typical uses include industrial control logic, sensor and signal conditioning, communication interfaces, test equipment, embedded control, consumer electronics, and general-purpose prototyping. Because the FPGA is programmable, designers can implement parallel datapaths, state machines, protocol controllers, or custom interfaces without designing a fixed ASIC. The 63 I/O count is particularly useful for designs requiring multiple digital control or status signals while keeping the package reasonably compact. The main design consideration is package and pin planning. This page synthesizes verified distributor specifications, source links, and practical selection guidance; it does not invent pin functions or timing details. Before layout, engineers should obtain the official Spartan-3 family documentation and confirm the exact VQG100 pin map, bank voltages, configuration requirements, decoupling recommendations, and supported I/O standards for the selected board design. For replacements, the XC3S50-4VQG100C and related 100-pin Spartan-3 devices can be considered as same-footprint candidates where temperature grade, speed grade, device revision, and configuration details are acceptable. The XC3S50A-4VQG100I is a Spartan-3A-family option with related package information, but Spartan-3 and Spartan-3A devices should not be treated as automatically interchangeable without checking the complete pinout, configuration interface, electrical characteristics, and design-tool support.

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XC3S50-5CPG132C - 50K Spartan-3 FPGA | AMD | 132-CSPBGA
XC3S50-5CPG132C

XC3S50-5CPG132C - 50K Spartan-3 FPGA | AMD | 132-CSPBGA

The AMD XC3S50-5CPG132C is a Spartan-3 field-programmable gate array with 50K gates, 1,728 logic cells, 89 programmable I/O pins, and a 725 MHz stated operating frequency in a 132-TFBGA CSPBGA package. It uses 90 nm FPGA technology and operates from a 1.2 V core supply whose verified operating range is 1.14 V to 1.26 V. The device is a surface-mount, ball-grid package device with 132 terminals and a 0°C to 85°C junction-temperature range. A field-programmable gate array, or FPGA, is a semiconductor whose logic, interconnect, and I/O behavior can be configured after manufacture. Within the product hierarchy, the XC3S50 belongs to the Spartan-3 FPGA family and combines programmable logic, block RAM, dedicated I/O, and configurable digital interfaces on one device. This makes it suitable when designers need hardware-level parallelism and field-updatable control logic rather than a fixed instruction sequence in a microcontroller. The 50K-gate designation identifies the device as the smallest member of the supplied Spartan-3 family information, while the 1,728 logic cells provide the usable programmable-logic resource count. Its 89 programmable I/O pins provide connections to external logic, memory, communications, and control circuitry. The -5 speed designation corresponds to the verified 725 MHz figure, while the CPG132 suffix identifies the 132-ball CSPBGA package used for compact surface-mount designs. The 90 nm process generation places this device in a mature FPGA architecture whose implementation resources and toolchain are established rather than new. The 1.2 V core operation can simplify power architecture compared with older, higher-voltage programmable devices, although the board still needs regulated supplies, decoupling, configuration storage, and correct ball-grid layout support. Exact RAM, I/O-standard, timing, and configuration-memory details were not present in the supplied data and should be confirmed in the manufacturer documentation. Typical uses include industrial control, compact communication interfaces, sensor and instrumentation logic, embedded display or networking controllers, and low-cost embedded systems requiring configurable parallel processing. The 89 I/O pins are especially useful for connecting the FPGA directly to bus transceivers, memory, status indicators, and external converters. Designers should select the Spartan-3 family only when its verified logic capacity and I/O resources satisfy the design rather than assuming equivalent capacity from a different FPGA family. Board planning must preserve the CSPBGA footprint, power rails, decoupling network, configuration interface, and exposed thermal behavior. Because the supplied data does not provide the complete 132-ball pin map, engineers should download the applicable Spartan-3 documentation and compare every ball assignment before routing or replacing the component. Legacy availability and tooling compatibility should also be confirmed before a new production design is committed. This page consolidates the verified distributor specifications, package data, temperature range, pricing-status limitations, and documented same-family alternatives. It also adds practical migration guidance, parameter comparisons, and explicit identification of data that remains unavailable, providing engineering context beyond a basic distributor listing while avoiding unsupported assumptions about legacy FPGA pin compatibility.

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XC3S50-5TQG144C - 50K Spartan-3 FPGA | AMD | 144-TQFP
XC3S50-5TQG144C

XC3S50-5TQG144C - 50K Spartan-3 FPGA | AMD | 144-TQFP

The AMD XC3S50-5TQG144C is a Spartan-3 field-programmable gate array with 50,000 system gates, 1,728 logic cells, 97 I/O, a 1.2 V core supply, and a 144-pin TQFP package. Rated at up to 725 MHz, it targets compact programmable-logic designs that require more I/O and processing capacity than small CPLDs can provide. A field-programmable gate array is a semiconductor whose digital logic and interconnect are configured after manufacture. Within the product hierarchy, an FPGA is a programmable logic device and a semiconductor. The Spartan-3 family combines configurable logic blocks, programmable I/O, embedded block RAM, dedicated multipliers, and clock-management resources, allowing one device to implement control logic, data processing, interfaces, and small embedded systems. The XC3S50-5TQG144C combines 50,000 system gates with 1,728 logic cells and 97 available I/O in a 144-lead TQFP package. Its 1.2 V core supply reduces core power requirements, while the -5 speed designation corresponds to the 725 MHz maximum figure reported in the supplied product data. The commercial temperature range shown by the verified listings is 0°C to 85°C. This device is manufactured using 90 nm technology, positioning it as a cost-oriented, low-density FPGA rather than a high-performance FPGA with large on-chip memories. Configuration data programs the logic fabric and I/O standards, allowing hardware revisions and field updates without changing the printed circuit board. Because the package exposes many I/O in a relatively compact surface-mount format, PCB routing and power delivery remain central design constraints. Typical uses include industrial control, consumer electronics, embedded systems, communications interfaces, instrumentation, and general-purpose digital logic. Its 97 I/O make it particularly useful where external memory, parallel buses, status indicators, sensors, or multiple digital interfaces must connect to programmable logic. The 144-pin package also offers more I/O than a small PLD while remaining manageable for multilayer board assembly. Designers should verify the exact pinout, configuration interface, supported I/O standards, bank supply voltages, and decoupling requirements against the Spartan-3 manufacturer documentation before layout release. Because this is a legacy programmable-logic platform, toolchain availability, configuration-device compatibility, and long-term procurement should be confirmed during product planning. This page consolidates the verified distributor specifications, practical design considerations, and carefully qualified same-footprint alternatives for XC3S50-5TQG144C. It also distinguishes documented production options from unavailable or unverified engineering data so engineers can make a defensible sourcing and design decision.

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XC3S50-5VQG100C - 50K Gate Spartan-3 FPGA | AMD
XC3S50-5VQG100C

XC3S50-5VQG100C - 50K Gate Spartan-3 FPGA | AMD

AMD XC3S50-5VQG100C is a Spartan-3 field-programmable gate array with 50,000 system gates, 1,728 logic cells, 63 programmable I/O pins, and a 1.2 V core supply in a 100-pin VTQFP package. It uses 90 nm CMOS technology and is rated for a maximum clock frequency of 725 MHz. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic and I/O can be configured after fabrication. In the device hierarchy, an FPGA is a programmable logic device, followed by the broader categories of semiconductor, integrated circuit, and digital logic. Spartan-3 devices combine configurable logic blocks, distributed memory, dedicated input/output structures, and clocking resources in a single package. The XC3S50-5VQG100C provides 73,728 bits of distributed RAM and 192 logic array blocks, making its internal resources suitable for modest control systems, interface conditioning, signal processing, and embedded logic. Its 63 configurable I/O pins provide external connectivity, while the -5 speed designation corresponds to the verified 725 MHz maximum frequency. The 100-pin VTQFP package supports compact surface-mount PCB layouts. The Spartan-3 architecture uses a 90 nm process and a 1.2 V internal core voltage. Distributed RAM provides storage alongside configurable logic, allowing small lookup tables, buffers, and state machines to be implemented without relying entirely on external memory. Designers must also account for dedicated configuration pins, clock routing, power-supply sequencing, and the fixed resources assigned to configuration when planning the pinout. Typical uses include industrial control logic, low-cost embedded control, data acquisition, communication-interface bridging, instrumentation, and consumer electronics. The component is appropriate when a relatively small amount of parallel logic, moderate I/O connectivity, and programmable functionality are needed without moving to a larger FPGA. The primary design consideration is package and power planning. A 100-pin VTQFP layout is sensitive to thermal via placement and power-distribution integrity, while the 1.2 V core rail requires clean supply delivery. Configuration logic should also be preserved according to the manufacturer's guidance because its pins may not be freely available for ordinary user functions. This page combines the verified distributor specifications, package details, lifecycle caveat, drop-in replacement analysis, and practical design guidance for engineers evaluating the AMD Spartan-3 XC3S50-5VQG100C.

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XC3S5000-4FG676C - 5M Gate Spartan-3 FPGA, 676-BGA | Xilinx
XC3S5000-4FG676C

XC3S5000-4FG676C - 5M Gate Spartan-3 FPGA, 676-BGA | Xilinx

The Xilinx XC3S5000-4FG676C is a 5-million system-gate Spartan-3 field-programmable gate array (FPGA) packaged in a 676-ball fine-pitch ball grid array, delivering 74,880 logic cells, 1,728 Kbits of block RAM, 104 dedicated 18x18 multipliers, 4 digital clock managers and up to 489 user I/O pins. A field-programmable gate array is a reconfigurable digital semiconductor: an FPGA contains an array of programmable logic blocks, block RAM, dedicated multipliers and programmable I/O, so a design is implemented by writing a bitstream into on-chip configuration memory rather than fabricating a custom ASIC mask set. In the device hierarchy, an FPGA sits above a programmable logic device (PLD) and a fixed-function logic IC, and below an ASIC, inside the broader category of programmable logic semiconductors. Key features of this device include a -4 speed grade for higher performance timing, a commercial temperature option indicated by the C suffix, 676 ball-grid-array package balls providing 489 available user I/O in the FGG676 variant, 4 DCMs for clock generation, de-skew and jitter removal, and 104 18x18 signed multipliers for DSP-style multiply-accumulate work without external DSP chips. The device belongs to the Spartan-3 cost-optimized family, which was designed for high-volume consumer and industrial electronics. Technically, the XC3S5000-4FG676C couples configurable logic slices with dedicated arithmetic and memory resources so that filter, correlation, protocol and control functions can be consolidated in one device. The DCMs generate four-phase and divided clocks on-chip, which reduces external clock-tree components and simplifies timing closure in designs with multiple clock domains. Configuration is loaded from an external non-volatile memory or a processor bus through the standard serial or parallel configuration ports. Typical applications include industrial control and factory automation, video and image processing, network packet handling, instrumentation and test equipment, embedded consumer products, and digital signal conditioning in communication equipment. The large logic-cell count and 489 available user I/Os suit designs that need parallel parallel-bus interfaces, multiple data converters, or wide video capture and processing paths. One design consideration is that the 676-ball FBGA is a fine-pitch, lead-free-intensive package that requires careful PCB layout with solid ground and power planes, controlled-length configuration traces and Xilinx-recommended decoupling. Design for the -4 speed grade timing constraints, and verify that the target board uses the same 676-ball footprint and ball map if you intend to migrate between the FG, FGG, I and C suffix variants. This page consolidates device specifications, drop-in package-compatible alternatives, a parameter-by-parameter comparison and practical layout and configuration guidance into a single engineering reference for engineers evaluating the Spartan-3 XC3S5000 in production designs.

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