XC3S50-4CPG132C - 4-Speed Spartan-3 FPGA | AMD
MPN: XC3S50-4CPG132C ✓ ActiveXC3S50-4CPG132C Overview
A field-programmable gate array, or FPGA, is a reconfigurable digital integrated circuit in which configurable logic blocks, programmable interconnect, and input/output resources implement a digital design. Within the semiconductor hierarchy, an FPGA sits above a programmable logic device and occupies the broader categories of programmable logic and digital logic ICs. Unlike a fixed-function microcontroller or application-specific processor, an FPGA allows parallel hardware architectures, timing control, and post-configuration logic updates.
The verified distributor listing identifies 89 I/O, a 73728 logic-resource value, a 1728 feature value, and a 132-TFBGA package. The exact interpretation of the 73728 and 1728 distributor fields should be confirmed against the applicable Spartan-3 family data sheet before they are used in a resource budget. The part is identified as a Spartan-3 FPGA IC and is listed by DigiKey, Octopart, Win Source, IC-Components, and other distributors.
The -4 suffix denotes the device speed grade within the Spartan-3 ordering system. A -4 grade is generally selected when design timing must be closed under a specified system clock, while it should not be treated as a guaranteed replacement for every speed grade. The C suffix identifies the commercial temperature grade, but exact minimum and maximum junction or ambient temperature limits require verification from the original manufacturer data sheet because those limits were not included in the retrieved snippets.
The 132-ball TFBGA package supports compact, high-density board layouts, although its fine ball pitch makes inspection and rework more demanding than with a leaded package. Typical design uses include custom interface controllers, data-acquisition logic, embedded control functions, protocol bridges, and parallel signal processing. The 89 I/O count is a useful initial planning figure, but designers must also account for dedicated configuration pins, power pins, and other package balls that cannot be assigned as general user I/O.
Because a BGA pin map was not included in the verified source material, the complete pin assignment cannot be reproduced safely. Before layout release, obtain the official Spartan-3 package data, confirm every power, ground, configuration, and user-I/O ball, and use the manufacturer land pattern and decoupling guidance. Do not infer the 132-ball map from the 89 user-I/O count.
This page consolidates the verified distributor identity, package information, ordering-code details, cross-reference findings, and practical migration guidance. It also separates confirmed values from fields that still require manufacturer-document verification, helping engineers assess this legacy FPGA without treating distributor search snippets as a substitute for the complete data sheet.
Drop-in alternatives for XC3S50-4CPG132C — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with XC3S50-4CPG132C (same form factor and footprint) — differing in Temperature Grade.
XC3S50-4CPG132I
✅ Drop-InContact for price
View Datasheet →XC3S50-5CPG132C
✅ Drop-InContact for price
View Datasheet →XC3S500E-4CPG132C
✅ Drop-In📋 Reference alternative (not in catalog)
XC3S50-3CPG132C
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
XC3S250-4CPG132I
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
XC3S50-4CPG132C Maximum Ratings & Electrical Characteristics
| Device Type | Spartan-3 Field Programmable Gate Array (FPGA) |
| Manufacturer | AMD |
| Original Product Line | Xilinx Spartan-3 |
| Speed Grade | -4 |
| Temperature Grade | Commercial (C suffix) |
| User I/O Count | 89 I/O |
| Logic Resource Value | 73728 (distributor-listed value; exact resource definition requires data-sheet confirmation) |
| Secondary Logic Feature Value | 1728 (distributor-listed value; exact feature definition requires data-sheet confirmation) |
| Package Type | 132-TFBGA |
| Total Terminals | 132 terminals |
| Package Shape | Square |
| Terminal Form | Ball |
| Mounting Technology | Surface Mount |
| Programmability | User-programmable digital logic and interconnect |
| RoHS Status | unknown |
| REACH Status | unknown |
| AEC-Q100 Qualification | not_applicable |
XC3S50-4CPG132C square Pin Configuration Guide
Pin configuration for XC3S50-4CPG132C (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XC3S50-4CPG132C.
Refer to the datasheet for full pin configuration.
Typical Applications
XC3S50-4CPG132C is suitable for 6 applications: Custom Data-Acquisition and Signal Conditioning, Industrial Communication and Protocol Bridge, Embedded Control and Hardware Supervision, Video Timing and Display Interface Support, Sensor Aggregation and Edge Processing, Cryptographic and Bitstream Processing Support.
Custom Data-Acquisition and Signal Conditioning
The XC3S50-4CPG132C fits parallel data-acquisition, digital filtering, and protocol-decoding designs that benefit from programmable logic and 89 user I/O. Multiple input channels can be sampled and processed concurrently in the FPGA fabric, reducing the need to serialize transfers through a microcontroller. Its 132-TFBGA package keeps the assembly compact, although the fine ball pitch requires careful escape routing. Before committing, confirm the exact I/O standards, clock-capable pins, core voltage, and performance grade from the DS312 family documentation.
Recommended
Industrial Communication and Protocol Bridge
The XC3S50-4CPG132C can implement dedicated communication controllers, protocol converters, and deterministic data routers where parallel hardware operation is more valuable than a general-purpose processor. Its 89 I/O provide a practical base for multiple byte-wide buses, chip selects, and handshaking signals. The -4 speed grade supports an existing timing plan that has already been verified with Spartan-3 constraints. For industrial deployments, the commercial C suffix may not be sufficient; the 132-TFBGA industrial-grade alternative XC3S50-4CPG132I deserves evaluation against the required temperature range.
Recommended
Embedded Control and Hardware Supervision
The XC3S50-4CPG132C is appropriate for deterministic machine-control blocks, watchdog logic, sequencers, and hardware interlocks that must respond with predictable latency. Fixed logic can implement timers, state machines, and fault handling directly in the fabric, while a microcontroller handles supervisory software. Its 89 I/O allow direct connection to sensors, actuators, status LEDs, and interlock inputs. Verify supported I/O voltage classes, on-chip clocking resources, and the industrial-grade ordering option before using the part where ambient temperature excursions are expected.
Recommended
Video Timing and Display Interface Support
The XC3S50-4CPG132C can support pixel timing, blanking generation, test-pattern insertion, and interface timing conversion because these functions benefit from deterministic parallel logic and programmable registers. It is also useful as a timing companion to a separate video processing device, provided the required video standards, voltage levels, and clock rates are confirmed. The 132-TFBGA package requires careful ball-escape and return-path planning, while the 89 user I/O must be allocated against clock-capable and voltage-restricted pins. Validate the complete design with the Spartan-3 implementation tools.
Recommended
Sensor Aggregation and Edge Processing
The XC3S50-4CPG132C fits sensor-aggregation nodes that combine multiple low- to moderate-rate channels, perform thresholding or filtering, and forward results over a serial link. Parallel acquisition and FPGA-based filtering can reduce repeated host-processor transfers and provide deterministic latency. The 89 I/O are useful when several sensors share byte-wide buses, while the surface-mount BGA package supports compact boards. Confirm input thresholds, supported I/O standards, and whether the commercial-grade C suffix meets the product's environmental requirements before volume procurement.
Recommended
Cryptographic and Bitstream Processing Support
The XC3S50-4CPG132C can serve as a companion logic engine for bitstream manipulation, CRC generation, key-scheduling acceleration, or protocol-specific checksum blocks. Such fixed-function implementations can run concurrently with host software and provide deterministic throughput without relying on an instruction-set processor. The device's verified 89 I/O and 132-TFBGA package make it suitable for compact accelerator cards, but actual throughput depends on unverified clock, block-RAM, and logic-resource specifications. Retrieve the manufacturer family data and compile the intended RTL before relying on performance figures.
Recommended
Recommended Products Summary
Engineering reference data for XC3S50-4CPG132C — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC3S50-4CPG132I | XC3S50-5CPG132C | XC3S500E-4CPG132C | XC3S50-3CPG132C | XC3S250-4CPG132I |
|---|---|---|---|---|---|---|
| Package | 132-TFBGA | 132-TFBGA | 132-TFBGA | 132-TFBGA | 132-TFBGA | 132-TFBGA |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| FPGA Family | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3E | Spartan-3 | Spartan-3 |
| Speed Grade | -4 | -4 | -5 | -4 | -3 | -4 |
| Temperature Grade | Commercial (C suffix) | Industrial (I suffix) | Commercial (C suffix) | Commercial (C suffix) | Commercial (C suffix) | Industrial (I suffix) |
| Primary Verified Advantage | Commercial -4 grade in 132-TFBGA | Industrial temperature suffix | Higher -5 speed grade | Different, expanded Spartan-3E resource set | Lower-cost timing class | Smaller device in industrial suffix |
Key Differentiators
- Exact -4 speed grade with commercial ordering suffix (vs XC3S50-4CPG132I)
- Direct same-package timing option without changing speed grade (vs XC3S50-3CPG132C)
- Additional timing margin in a like-package device (vs XC3S50-5CPG132C)
- Same family and speed grade with an expanded-device alternative (vs XC3S500E-4CPG132C)
Design Notes
Do not derive the XC3S50-4CPG132C land pattern from the 132-TFBGA name alone. Retrieve the manufacturer package drawing, confirm ball pitch, ball-map orientation, power balls, ground balls, configuration pins, and exposed thermal features. The verified snippets establish a 132-ball square TFBGA but do not provide the ball map. Check every escape route against the selected Spartan-3 pinout before fabrication, and account for via-in-pad or solder-mask requirements specified by the assembly process.
Build the power tree from the original DS312 DC electrical characteristics and DS312-3 absolute maximum and supply specifications. The retrieved data does not expose the core voltage, I/O voltage classes, or decoupling values, so none should be inferred. Validate supply sequencing, per-rail tolerances, startup current, and configuration behavior. Use the manufacturer's recommended capacitor placement and provide a low-impedance return for every supply ball to limit simultaneous switching current and logic noise.
A distributor listing's 73728 and 1728 fields are not a substitute for a verified resource map. Confirm the corresponding logic-cell, block-RAM, slice, or register quantities against the appropriate family data sheet before compiling the RTL. Also avoid assuming that 89 user I/O means 89 freely usable pins: configuration, supply, ground, and reserved balls reduce the general-purpose allocation. Run the vendor implementation flow and review the post-fit resource report and pin constraints.
Estimated: a 132-TFBGA package requires attention to board heat spreading even though the verified data does not provide junction temperature or package thermal-resistance values. Route exposed thermal features to copper planes where the manufacturer drawing permits, use multiple thermal vias, and avoid blocking airflow beneath the BGA. Actual power loss must be calculated from the programmed design and device-specific operating current; because core voltage and current were not verified, no numerical junction-temperature claim is made here.
Assign clock-capable pins and dedicated configuration signals early, then constrain the implementation tool against the confirmed package data. Keep sensitive clock and differential pairs routed over continuous reference planes, with return paths directly beneath them. Separate noisy switching outputs from precision inputs where possible. Because the complete I/O standards and pin capabilities are not present in the supplied snippets, final assignment should follow the manufacturer pinout and selected design-tool constraints rather than generic TFBGA routing practice.
Compliance Information
The supplied distributor snippets do not state RoHS, REACH, halogen-free, conflict-minerals, or lead-free status. No compliance declaration has been inferred. The commercial C suffix is an ordering-temperature designation and does not by itself establish AEC-Q100 automotive qualification.
