XC3S50-5CPG132C - 50K Spartan-3 FPGA | AMD | 132-CSPBGA
MPN: XC3S50-5CPG132C ✗ End of LifeXC3S50-5CPG132C Overview
A field-programmable gate array, or FPGA, is a semiconductor whose logic, interconnect, and I/O behavior can be configured after manufacture. Within the product hierarchy, the XC3S50 belongs to the Spartan-3 FPGA family and combines programmable logic, block RAM, dedicated I/O, and configurable digital interfaces on one device. This makes it suitable when designers need hardware-level parallelism and field-updatable control logic rather than a fixed instruction sequence in a microcontroller.
The 50K-gate designation identifies the device as the smallest member of the supplied Spartan-3 family information, while the 1,728 logic cells provide the usable programmable-logic resource count. Its 89 programmable I/O pins provide connections to external logic, memory, communications, and control circuitry. The -5 speed designation corresponds to the verified 725 MHz figure, while the CPG132 suffix identifies the 132-ball CSPBGA package used for compact surface-mount designs.
The 90 nm process generation places this device in a mature FPGA architecture whose implementation resources and toolchain are established rather than new. The 1.2 V core operation can simplify power architecture compared with older, higher-voltage programmable devices, although the board still needs regulated supplies, decoupling, configuration storage, and correct ball-grid layout support. Exact RAM, I/O-standard, timing, and configuration-memory details were not present in the supplied data and should be confirmed in the manufacturer documentation.
Typical uses include industrial control, compact communication interfaces, sensor and instrumentation logic, embedded display or networking controllers, and low-cost embedded systems requiring configurable parallel processing. The 89 I/O pins are especially useful for connecting the FPGA directly to bus transceivers, memory, status indicators, and external converters. Designers should select the Spartan-3 family only when its verified logic capacity and I/O resources satisfy the design rather than assuming equivalent capacity from a different FPGA family.
Board planning must preserve the CSPBGA footprint, power rails, decoupling network, configuration interface, and exposed thermal behavior. Because the supplied data does not provide the complete 132-ball pin map, engineers should download the applicable Spartan-3 documentation and compare every ball assignment before routing or replacing the component. Legacy availability and tooling compatibility should also be confirmed before a new production design is committed.
This page consolidates the verified distributor specifications, package data, temperature range, pricing-status limitations, and documented same-family alternatives. It also adds practical migration guidance, parameter comparisons, and explicit identification of data that remains unavailable, providing engineering context beyond a basic distributor listing while avoiding unsupported assumptions about legacy FPGA pin compatibility.
Drop-in alternatives for XC3S50-5CPG132C — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with XC3S50-5CPG132C (same form factor and footprint) — differing in Mounting Type, Package, Temperature Grade, Device Type, Junction Temperature Range.
XC3S50-4CPG132I
✅ Drop-InContact for price
View Datasheet →XC3S50-4CP132I
✅ Drop-InContact for price
View Datasheet →XC3S50-5CP132C
✅ Drop-In📋 Reference alternative (not in catalog)
XC3S50-4CPG132C0974
✅ Drop-In ⚠️ Specs UnverifiedContact for price
View Datasheet →XC3S50-5CPG132I
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
XC3S50-5CPG132C Maximum Ratings & Electrical Characteristics
| Device Type | Spartan-3 Field Programmable Gate Array (FPGA) |
| Logic Cell Count | 1,728 cells |
| Gate Count | 50K gates |
| Maximum Stated Frequency | 725 MHz |
| Programmable I/O | 89 pins |
| Package | 132-TFBGA, CSPBGA |
| Package Dimensions | 8 x 8 mm |
| Terminal Count | 132 terminals |
| Technology | 90 nm |
| Core Supply Voltage | 1.2 V |
| Core Supply Operating Range | 1.14 V to 1.26 V |
| Junction Temperature Range | 0°C to 85°C |
| Mounting Type | Surface Mount |
| Terminal Form | Ball |
| Package Shape | Square |
| FPGA Product Family | Spartan-3 |
XC3S50-5CPG132C square Pin Configuration Guide
Pin configuration for XC3S50-5CPG132C (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XC3S50-5CPG132C.
Refer to the datasheet for full pin configuration.
Typical Applications
XC3S50-5CPG132C is suitable for 6 applications: Industrial Control and Automation, Communication Interface Bridge, Sensor Acquisition and Signal Conditioning, Embedded Display and User Interface Controller, Instrumentation and Measurement Logic, Low-Cost Programmable Embedded System.
Industrial Control and Automation
The XC3S50-5CPG132C fits compact industrial controllers that combine parallel logic, interface adaptation, and deterministic control functions in one reprogrammable device. Its 1,728 logic cells and 89 programmable I/O pins provide resources for state machines, signal conditioning, interlocks, and machine sequencing, while the -5 grade supports the verified 725 MHz performance class. The 1.14 V to 1.26 V core range also gives board designers a defined supply target. A production design should verify the complete 132-ball map, configure the FPGA using the supported AMD toolchain, and confirm that the 0°C to 85°C junction-temperature specification matches the enclosure. The 132-CSPBGA footprint is suitable for dense control boards but requires careful ball-grid layout, decoupling, configuration support, and assembly planning.
Recommended
Communication Interface Bridge
The XC3S50-5CPG132C is suitable for protocol conversion, data buffering, and legacy-to-modern interface bridging because its 89 programmable I/O pins can connect parallel sources to serialized or differently timed logic. The 725 MHz stated frequency gives designers additional timing margin for parallel pipelines, although actual throughput depends on the selected I/O standards and implemented logic. The 1.2 V core supply and 132-ball CSPBGA package support compact mixed-signal boards, but external transceivers, level translation, and termination may still be required. Before layout, engineers should confirm pin assignments, supported I/O voltage classes, and whether the target toolchain still supports the selected configuration file and legacy device revision.
Recommended
Sensor Acquisition and Signal Conditioning
The XC3S50-5CPG132C can implement parallel sensor acquisition, digital filtering, thresholding, and time-domain logic when an application needs reconfigurable acquisition behavior. Its 89 programmable I/O pins provide connectivity for multiple sensor channels and control signals, and the 1,728 logic cells allow state machines and digital signal-processing elements to share one device. The 725 MHz performance class can support pipelined sampling logic, but the analog front end remains responsible for amplification, filtering, and conversion. Designers must budget FPGA logic for the selected architecture, verify I/O voltage compatibility, and maintain separate, well-decoupled supply rails for analog and digital sections where required.
Recommended
Embedded Display and User Interface Controller
The XC3S50-5CPG132C is appropriate for programmable display timing, keypad scanning, indicator control, and compact human-machine interfaces where multiple outputs must be coordinated in hardware. With 89 programmable I/O pins, the device can connect display-control logic, serial interface engines, buttons, and status signals, while its 50K-gate family positioning keeps utilization appropriate for small interface subsystems. The 1.2 V core rail and compact 132-CSPBGA package help limit board area, although display-panel voltage requirements may need separate I/O support. Designers should use the verified device data to select compatible I/O standards and should validate refresh timing, panel initialization, and ESD protection independently of the FPGA logic.
Recommended
Instrumentation and Measurement Logic
The XC3S50-5CPG132C can implement acquisition sequencing, calibration tables, trigger logic, and data packetization in compact test and measurement equipment. Its 725 MHz stated operating class is useful for pipelined control, while 1,728 logic cells and 89 I/O pins provide a defined capacity for modest parallel-channel systems. The 1.14 V to 1.26 V core operating range requires a stable regulated supply, and the 0°C to 85°C junction specification must be checked against the instrument's internal temperature. Instrumentation designs should isolate analog measurement circuitry from digital switching activity, validate timing with the complete device constraints, and verify that legacy configuration files and tool versions remain reproducible for production.
Recommended
Low-Cost Programmable Embedded System
The XC3S50-5CPG132C provides a cost-oriented platform for legacy embedded products that benefit from configurable parallel logic without adopting a larger programmable device. Its 50K gates, 1,728 logic cells, and 89 programmable I/O pins are suitable for control engines, protocol adapters, and accelerator functions that leave sufficient margin for configuration and interconnect overhead. The compact 132-CSPBGA package supports surface-mount production, while the 1.2 V core architecture simplifies supply planning compared with older FPGA families. Before adoption, teams should confirm current AMD tooling support, programmed-device availability, long-term supply, and whether an -I temperature-grade alternative is required. Complete pinout and lifecycle validation are essential because similar Spartan-3 ordering codes can differ in speed and temperature attributes.
Recommended
Recommended Products Summary
Engineering reference data for XC3S50-5CPG132C — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC3S50-4CPG132I | XC3S50-4CP132I | XC3S50-5CP132C | XC3S50-4CPG132C | XC3S50-5CPG132I |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 1,728 cells | 1,728 cells | 1,728 cells | 1,728 cells | 1,728 cells | 1,728 cells |
| Gate Capacity | 50K gates | 50K gates | 50K gates | 50K gates | 50K gates | 50K gates |
| Programmable I/O | 89 pins | 89 pins | 89 pins | 89 pins | 89 pins | 89 pins |
| Stated Frequency | 725 MHz | 657 MHz | 657 MHz | 725 MHz | 657 MHz | 725 MHz |
| Technology | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm |
Key Differentiators
- Higher verified speed grade than the -4 same-package alternatives (vs XC3S50-4CPG132I)
- Retains the same stated logic and interface capacity (vs XC3S50-4CP132I)
- Same 132-CSPBGA family enables controlled migration (vs XC3S50-5CP132C)
Design Notes
Treat the 132-TFBGA layout as a ball-grid escape and escape-routing problem rather than a conventional perimeter package. Confirm every power, ground, configuration, and user-I/O ball against the complete AMD package drawing before committing to a PCB footprint. The supplied sources identify an 8 x 8 mm CSPBGA, but they do not provide a complete ball map, so no unverified pin assignments are published here. Validate courtyard, solder-mask, paste, via-in-pad, and assembly-process requirements with the fabricator and package mechanical drawing.
Design the core supply for the verified 1.14 V to 1.26 V operating range and keep transient, ripple, startup, and sequencing requirements within the complete manufacturer limits. Place local high-frequency and bulk decoupling directly at the relevant supply and ground balls using the manufacturer reference layout. Because the 0°C to 85°C junction specification and detailed current limits were not supplied, calculate actual rail current, board copper, and package heating from the final design rather than estimating from the 1.2 V nominal value.
Do not substitute the XC3S50-4CPG132I or XC3S50-4CP132I solely because their names and 132-CSPBGA packages look similar. The documented -4 alternatives provide 657 MHz versus 725 MHz for the target, approximately 20% lower, and the -I suffix changes temperature-grade implications. Run a fresh timing analysis, compare configuration behavior and exact ordering attributes, and validate any hardware substitution on the intended board before production use.
Plan configuration storage, programming access, clock distribution, reset behavior, and JTAG debugging during the schematic phase rather than treating them as optional programming features. Keep sensitive clock and data routes short, provide clean reference clocking, and isolate noisy switching nodes from precision analog sections. The verified data identifies the device as programmable and surface-mountable but does not specify supported configuration memories or clock standards; consult the manufacturer family documentation before selecting those companion components.
Compliance Information
The supplied manufacturer and distributor excerpts do not state RoHS, REACH, lead-free, halogen-free, or conflict-minerals status. The -I ordering designation identifies an industrial temperature option in the comparison data, but it is not evidence of AEC-Q100 qualification.
