10M25DAF484C8G vs 10M08DAF484C8G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M25DAF484C8G sa pamamagitan ng Intel at 10M08DAF484C8G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M25DAF484C8G | 10M08DAF484C8G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 25,000 | — |
| Embedded Memory (Kbits) | 1638 | — |
| User I/O Count | 360 | — |
| Process Technology | 55 nm CMOS | 55 nm |
| Core Supply Voltage (VCCINT) | 1.2 V (1.15 V min / 1.25 V max) | — |
| Packhaging | 484-ball FineLine BGA (F484), 23 × 23 mm, 1.0 mm pitch | 484-ball FBGA (FineLine BGA) |
| Uri ng Pagpapasok | Surface Mount | — |
| Temperature na Operasyon | 0 °C to 85 °C (Commercial) | — |
| Speed Grade | -8 | -C8 |
| Configuration Memory | On-chip dual-configuration flash | — |
| ADC | Integrated 12-bit ADC (where enabled) | 8-channel, 12-bit |
| PLLs | Yes (up to 4 analog PLLs per device) | 2 |
| Tindminan RoHS | Compliant | Compliant |
| Level ng MSL | MSL3 | — |
| Number of I/O Banks | 8 (per F484 pinout) | — |
| Logic Elements (LE) | — | 8000 |
| Embedded Memory | — | 387,072 bits (378 Kbits) |
| User Flash | — | 1,540 Kbits |
| Maximum User I/O | — | 250 |
| Core Voltage | — | 1.2 V |
| I/O Bank Voltage | — | 1.2 V to 3.3 V |
| Temperature ng Junction na Operasyon | — | -40 C to +100 C (industrial) |
| Configuration | — | Internal flash, dual-configuration, RSU support |
| DSP Blocks | — | Yes |