10M25DAF484C8G vs 10M08DAF484C8G 比較
詳細並排比較 10M25DAF484C8G 由 Intel 與 10M08DAF484C8G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | 10M25DAF484C8G | 10M08DAF484C8G |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 25,000 | — |
| Embedded Memory (Kbits) | 1638 | — |
| User I/O Count | 360 | — |
| Process Technology | 55 nm CMOS | 55 nm |
| Core Supply Voltage (VCCINT) | 1.2 V (1.15 V min / 1.25 V max) | — |
| 封裝 | 484-ball FineLine BGA (F484), 23 × 23 mm, 1.0 mm pitch | 484-ball FBGA (FineLine BGA) |
| 安裝類型 | Surface Mount | — |
| 工作溫度 | 0 °C to 85 °C (Commercial) | — |
| Speed Grade | -8 | -C8 |
| Configuration Memory | On-chip dual-configuration flash | — |
| ADC | Integrated 12-bit ADC (where enabled) | 8-channel, 12-bit |
| PLLs | Yes (up to 4 analog PLLs per device) | 2 |
| RoHS 狀態 | Compliant | Compliant |
| MSL 等級 | MSL3 | — |
| Number of I/O Banks | 8 (per F484 pinout) | — |
| Logic Elements (LE) | — | 8000 |
| Embedded Memory | — | 387,072 bits (378 Kbits) |
| User Flash | — | 1,540 Kbits |
| Maximum User I/O | — | 250 |
| Core Voltage | — | 1.2 V |
| I/O Bank Voltage | — | 1.2 V to 3.3 V |
| 工作接面溫度 | — | -40 C to +100 C (industrial) |
| Configuration | — | Internal flash, dual-configuration, RSU support |
| DSP Blocks | — | Yes |