AS4C512M16D4A-62BIN vs H5AN8G6NDJR-XNC Comparison

Detailed side-by-side comparison of AS4C512M16D4A-62BIN by Alliance Memory and H5AN8G6NDJR-XNC by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Alliance Memory
AS4C512M16D4A-62BIN

AS4C512M16D4A-62BIN - 8Gb DDR4 SDRAM 512Mx16 | Alliance Memory

AS4C512M16D4A-62BIN βœ“ Active
SK hynix
H5AN8G6NDJR-XNC H5AN8G6NDJR-XNC - 8Gb DDR4-3200 x16 DRAM | SK Hynix

H5AN8G6NDJR-XNC - 8Gb DDR4-3200 x16 DRAM | SK Hynix

H5AN8G6NDJR-XNC βœ“ Active

Specification Comparison

Parameter AS4C512M16D4A-62BIN H5AN8G6NDJR-XNC
Brand Alliance Memory SK hynix
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $8.10 $55.68
Memory Type DDR4 SDRAM DDR4 SDRAM
Memory Size 8 Gbit 8 Gb
Organization 512M x 16 β€”
Clock Rate 1600 MHz β€”
Data Rate 3200 Mbps per pin 3200 Mbps
Supply Voltage 1.14V ~ 1.26V (nominal 1.2V) β€”
Operating Temperature -40Β°C to +95Β°C β€”
Package 96-FBGA (7.5x13mm) FBGA-96 (13x7.5 mm)
Interface POD (Pseudo Open Drain) β€”
CAS Latency Programmable (e.g., 22 cycles) β€”
Burst Length 8 (with burst chop 4) β€”
Refresh Auto-refresh and self-refresh β€”
RoHS Compliant Compliant
Mounting Type Surface Mount β€”
Lead Free Yes β€”
Memory Organization β€” 512M x16
Supply Voltage (VDD) β€” 1.2 V (max 1.26 V)
Number of Terminals β€” 96
Maximum Operating Temperature β€” 85 Β°C
Input/Output Type β€” COMMON
Lead-Free β€” Yes
Halogen-Free β€” Yes
Auto Self-Refresh β€” Yes
Auto Precharge β€” Yes
Data Mask β€” Yes
Dynamic On-Chip Termination β€” Yes
ZQ Calibration β€” Yes
CRC Function β€” Yes
Write Leveling β€” Yes
Asynchronous Reset β€” Yes

Datasheets & Resources

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