EP3C25F324I7 vs EP3C25F324C7 Comparison

Detailed side-by-side comparison of EP3C25F324I7 by Intel and EP3C25F324C7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C25F324I7 EP3C25F324C7
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status NRND Active
Series Cyclone III —
Logic Elements (LEs) 24,624 —
Logic Array Blocks (LABs) 1,539 —
Embedded Memory 608,256 bits (594 Kbits M9K blocks) —
Embedded 18x18 Multipliers 66 —
PLLs 4 —
Global Clock Networks 20 —
Maximum User I/O 215 —
Process Technology TSMC 65 nm low-power CMOS —
Core Voltage (VCCINT) 1.2 V —
I/O Voltage (VCCIO) 1.2 V to 3.3 V (per bank) —
Operating Junction Temperature -40 °C to +100 °C (industrial) —
Package 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch —
Mounting Type Surface Mount Surface Mount
Configuration Modes Passive Serial (PS), Active Serial (AS), JTAG —
RoHS Status Compliant —
Device Type — Field Programmable Gate Array (FPGA)
FPGA Family — Cyclone III
Logic Elements — 24,624
Memory Bits — 608,256 bits
Number of I/O — 215
Package Type — 324-BGA
Package Code — BGA
Number of Terminals — 324
Package Shape — Square
Terminal Form — Ball
Operating Voltage Range — [DATA_NEEDED: operating voltage range]
Maximum Operating Frequency — [DATA_NEEDED: maximum operating frequency]
Operating Temperature Range — [DATA_NEEDED: operating temperature range]
Internal Memory Configuration — [DATA_NEEDED: internal memory configuration]
I/O Standard — [DATA_NEEDED: supported I/O standards]
RoHS Compliance — [DATA_NEEDED: RoHS compliance]
REACH Compliance — [DATA_NEEDED: REACH compliance]
Lead-Free Status — [DATA_NEEDED: lead-free status]

Datasheets & Resources

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