EP3C25F324I7 vs EP3C25F324C7 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3C25F324I7 sa pamamagitan ng Intel at EP3C25F324C7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3C25F324I7 EP3C25F324C7
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Aktibo
Series Cyclone III —
Logic Elements (LEs) 24,624 —
Logic Array Blocks (LABs) 1,539 —
Embedded Memory 608,256 bits (594 Kbits M9K blocks) —
Embedded 18x18 Multipliers 66 —
PLLs 4 —
Global Clock Networks 20 —
Maximum User I/O 215 —
Process Technology TSMC 65 nm low-power CMOS —
Core Voltage (VCCINT) 1.2 V —
I/O Voltage (VCCIO) 1.2 V to 3.3 V (per bank) —
Temperature ng Junction na Operasyon -40 °C to +100 °C (industrial) —
Packhaging 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch —
Uri ng Pagpapasok Surface Mount Surface Mount
Configuration Modes Passive Serial (PS), Active Serial (AS), JTAG —
Tindminan RoHS Compliant —
Device Type — Field Programmable Gate Array (FPGA)
FPGA Family — Cyclone III
Logic Elements — 24,624
Memory Bits — 608,256 bits
Number of I/O — 215
Package Type — 324-BGA
Package Code — BGA
Number of Terminals — 324
Package Shape — Square
Terminal Form — Ball
Operating Voltage Range — [DATA_NEEDED: operating voltage range]
Maximum Operating Frequency — [DATA_NEEDED: maximum operating frequency]
Hanay ng Temperature na Operasyon — [DATA_NEEDED: operating temperature range]
Internal Memory Configuration — [DATA_NEEDED: internal memory configuration]
I/O Standard — [DATA_NEEDED: supported I/O standards]
RoHS Compliance — [DATA_NEEDED: RoHS compliance]
REACH Compliance — [DATA_NEEDED: REACH compliance]
Lead-Free Status — [DATA_NEEDED: lead-free status]

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