EP3C25F324I7 vs EP3C25F324C7 比較
詳細並排比較 EP3C25F324I7 由 Intel 與 EP3C25F324C7 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3C25F324I7 | EP3C25F324C7 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | 啟用中 |
| Series | Cyclone III | — |
| Logic Elements (LEs) | 24,624 | — |
| Logic Array Blocks (LABs) | 1,539 | — |
| Embedded Memory | 608,256 bits (594 Kbits M9K blocks) | — |
| Embedded 18x18 Multipliers | 66 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Maximum User I/O | 215 | — |
| Process Technology | TSMC 65 nm low-power CMOS | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (per bank) | — |
| 工作接面溫度 | -40 °C to +100 °C (industrial) | — |
| 封裝 | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch | — |
| 安裝類型 | Surface Mount | Surface Mount |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG | — |
| RoHS 狀態 | Compliant | — |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| FPGA Family | — | Cyclone III |
| Logic Elements | — | 24,624 |
| Memory Bits | — | 608,256 bits |
| Number of I/O | — | 215 |
| Package Type | — | 324-BGA |
| Package Code | — | BGA |
| Number of Terminals | — | 324 |
| Package Shape | — | Square |
| Terminal Form | — | Ball |
| Operating Voltage Range | — | [DATA_NEEDED: operating voltage range] |
| Maximum Operating Frequency | — | [DATA_NEEDED: maximum operating frequency] |
| 工作溫度範圍 | — | [DATA_NEEDED: operating temperature range] |
| Internal Memory Configuration | — | [DATA_NEEDED: internal memory configuration] |
| I/O Standard | — | [DATA_NEEDED: supported I/O standards] |
| RoHS Compliance | — | [DATA_NEEDED: RoHS compliance] |
| REACH Compliance | — | [DATA_NEEDED: REACH compliance] |
| Lead-Free Status | — | [DATA_NEEDED: lead-free status] |